頁 102 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XC17S40PD8I	Xilinx Inc.	IC PROM PROG I-TEMP 5V 8-DIP Programmable Type: OTP Memory Size: 400kb Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-PDIP	封裝: 8-DIP (0.300", 7.62mm)	庫存3,472
XC17S100AVO8I	Xilinx Inc.	IC PROM SER 10K 8-SOIC Programmable Type: OTP Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存126,300
XC18V01PCG20C	Xilinx Inc.	IC PROM SERIAL CONFIG 1M 20-PLCC Programmable Type: In System Programmable Memory Size: 1Mb Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: 0°C ~ 70°C Package / Case: 20-LCC (J-Lead) Supplier Device Package: 20-PLCC (9x9)	封裝: 20-LCC (J-Lead)	庫存4,256
XCZU11EG-2FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	封裝: 1517-BBGA, FCBGA	庫存7,152
XCZU6CG-2FFVB1156E	Xilinx Inc.	XCZU6CG-2FFVB1156E Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	封裝: 1156-BBGA, FCBGA	庫存2,608
XCZU4EV-1FBVB900I	Xilinx Inc.	IC FPGA 204 I/O 900FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31)	封裝: 900-BBGA, FCBGA	庫存5,792
XCZU3CG-L2SBVA484E	Xilinx Inc.	IC FPGA 82 I/O 484FCBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 533MHz, 1.3GHz Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (19x19)	封裝: 484-BBGA, FCBGA	庫存6,608
XC7Z030-1FFG676I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 676FBGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存5,072
XA2S200E-6FT256I	Xilinx Inc.	IC FPGA 182 I/O 256FTBGA Number of LABs/CLBs: 1176 Number of Logic Elements/Cells: 5292 Total RAM Bits: 57344 Number of I/O: 182 Number of Gates: 200000 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	封裝: 256-LBGA	庫存6,672
XC5VFX200T-1FFG1738CES	Xilinx Inc.	IC FPGA 960 I/O 1738FCBGA Number of LABs/CLBs: 15360 Number of Logic Elements/Cells: 196608 Total RAM Bits: 16809984 Number of I/O: 960 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存3,120
XC4013XL-3PQ160C	Xilinx Inc.	IC FPGA 129 I/O 160QFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 129 Number of Gates: 13000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	封裝: 160-BQFP	庫存4,128
XC2VP100-6FFG1696C	Xilinx Inc.	IC FPGA 1164 I/O 1696FCBGA Number of LABs/CLBs: 11024 Number of Logic Elements/Cells: 99216 Total RAM Bits: 8183808 Number of I/O: 1164 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1696-BBGA, FCBGA Supplier Device Package: 1696-FCBGA (42.5x42.5)	封裝: 1696-BBGA, FCBGA	庫存4,672
XC7K325T-2FF676I	Xilinx Inc.	IC FPGA 400 I/O 676FCBGA Number of LABs/CLBs: 25475 Number of Logic Elements/Cells: 326080 Total RAM Bits: 16404480 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存6,828
XC2VP30-7FFG896C	Xilinx Inc.	IC FPGA 556 I/O 896FCBGA Number of LABs/CLBs: 3424 Number of Logic Elements/Cells: 30816 Total RAM Bits: 2506752 Number of I/O: 556 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存5,376
XC5VLX50-1FFG676I	Xilinx Inc.	IC FPGA 440 I/O 676FCBGA Number of LABs/CLBs: 3600 Number of Logic Elements/Cells: 46080 Total RAM Bits: 1769472 Number of I/O: 440 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存17,736
XQ4VFX60-DIE4058	Xilinx Inc.	IC FPGA VIRTEX-4 FX 60K DIE Number of LABs/CLBs: 6320 Number of Logic Elements/Cells: 56880 Total RAM Bits: 4276224 Number of I/O: - Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: - Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存6,304
XC5VLX30-2FF324I	Xilinx Inc.	IC FPGA 220 I/O 324FBGA Number of LABs/CLBs: 2400 Number of Logic Elements/Cells: 30720 Total RAM Bits: 1179648 Number of I/O: 220 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-BBGA, FCBGA Supplier Device Package: 324-FCBGA (19x19)	封裝: 324-BBGA, FCBGA	庫存4,576
XC4VLX25-11SFG363I	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	封裝: 363-FBGA, FCBGA	庫存3,376
XC2VP7-5FFG896I	Xilinx Inc.	IC FPGA 396 I/O 896FCBGA Number of LABs/CLBs: 1232 Number of Logic Elements/Cells: 11088 Total RAM Bits: 811008 Number of I/O: 396 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	封裝: 896-BBGA, FCBGA	庫存4,464
XC7A50T-3CSG325E	Xilinx Inc.	IC FPGA 150 I/O 325CSBGA Number of LABs/CLBs: 4075 Number of Logic Elements/Cells: 52160 Total RAM Bits: 2764800 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 325-CSBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存6,224
XC3S1400A-5FGG676C	Xilinx Inc.	IC FPGA 502 I/O 676FBGA Number of LABs/CLBs: 2816 Number of Logic Elements/Cells: 25344 Total RAM Bits: 589824 Number of I/O: 502 Number of Gates: 1400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存6,012
XC7A35T-3FGG484E	Xilinx Inc.	IC FPGA 250 I/O 484FCBGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33208 Total RAM Bits: 1843200 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存3,152
XC3S100E-4CP132C	Xilinx Inc.	IC FPGA 83 I/O 132CSBGA Number of LABs/CLBs: 240 Number of Logic Elements/Cells: 2160 Total RAM Bits: 73728 Number of I/O: 83 Number of Gates: 100000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 132-TFBGA, CSPBGA Supplier Device Package: 132-CSPBGA (8x8)	封裝: 132-TFBGA, CSPBGA	庫存5,840
XC95288XV-10TQ144C	Xilinx Inc.	IC CPLD 288MC 10NS 144TQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 2.37 V ~ 2.62 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 117 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存6,288
XC7S100-1FGGA484I	Xilinx Inc.	XC7S100-1FGGA484I Number of LABs/CLBs: 8000 Number of Logic Elements/Cells: 102400 Total RAM Bits: 4423680 Number of I/O: 338 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存7,088
XCVU13P-3FLGA2577E	Xilinx Inc.	XCVU13P-3FLGA2577E Number of LABs/CLBs: 216000 Number of Logic Elements/Cells: 3780000 Total RAM Bits: 514867200 Number of I/O: 448 Number of Gates: - Voltage - Supply: 0.873 V ~ 0.927 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 2577-BBGA, FCBGA Supplier Device Package: 2577-FCBGA (52.5x52.5)	封裝: 2577-BBGA, FCBGA	庫存4,400
XCVU11P-2FLGC2104I	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 162000 Number of Logic Elements/Cells: 2835000 Total RAM Bits: 396150400 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	封裝: 2104-BBGA, FCBGA	庫存4,592
XCVU080-H1FFVB1760E	Xilinx Inc.	IC FPGA VIRTEX-U 1760FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 1.030 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存3,712

XC17S40PD8I

Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

Programmable Type: OTP
Memory Size: 400kb
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-PDIP

封裝: 8-DIP (0.300", 7.62mm)

庫存3,472

XC17S100AVO8I

Xilinx Inc.

IC PROM SER 10K 8-SOIC

Programmable Type: OTP
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存126,300

XC18V01PCG20C

Xilinx Inc.

IC PROM SERIAL CONFIG 1M 20-PLCC

Programmable Type: In System Programmable
Memory Size: 1Mb
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C
Package / Case: 20-LCC (J-Lead)
Supplier Device Package: 20-PLCC (9x9)

封裝: 20-LCC (J-Lead)

庫存4,256

XCZU11EG-2FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 653K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

庫存7,152

XCZU6CG-2FFVB1156E

Xilinx Inc.

XCZU6CG-2FFVB1156E

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 469K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

庫存2,608

XCZU4EV-1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

庫存5,792

XCZU3CG-L2SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 533MHz, 1.3GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (19x19)

封裝: 484-BBGA, FCBGA

庫存6,608

XC7Z030-1FFG676I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存5,072

XA2S200E-6FT256I

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

Number of LABs/CLBs: 1176
Number of Logic Elements/Cells: 5292
Total RAM Bits: 57344
Number of I/O: 182
Number of Gates: 200000
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

庫存6,672

XC5VFX200T-1FFG1738CES

Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

Number of LABs/CLBs: 15360
Number of Logic Elements/Cells: 196608
Total RAM Bits: 16809984
Number of I/O: 960
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存3,120

XC4013XL-3PQ160C

Xilinx Inc.

IC FPGA 129 I/O 160QFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 129
Number of Gates: 13000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

封裝: 160-BQFP

庫存4,128

XC2VP100-6FFG1696C

Xilinx Inc.

IC FPGA 1164 I/O 1696FCBGA

Number of LABs/CLBs: 11024
Number of Logic Elements/Cells: 99216
Total RAM Bits: 8183808
Number of I/O: 1164
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1696-BBGA, FCBGA
Supplier Device Package: 1696-FCBGA (42.5x42.5)

封裝: 1696-BBGA, FCBGA

庫存4,672

XC7K325T-2FF676I

Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

Number of LABs/CLBs: 25475
Number of Logic Elements/Cells: 326080
Total RAM Bits: 16404480
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存6,828

XC2VP30-7FFG896C

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

Number of LABs/CLBs: 3424
Number of Logic Elements/Cells: 30816
Total RAM Bits: 2506752
Number of I/O: 556
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存5,376

XC5VLX50-1FFG676I

Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

Number of LABs/CLBs: 3600
Number of Logic Elements/Cells: 46080
Total RAM Bits: 1769472
Number of I/O: 440
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存17,736

XQ4VFX60-DIE4058

Xilinx Inc.

IC FPGA VIRTEX-4 FX 60K DIE

Number of LABs/CLBs: 6320
Number of Logic Elements/Cells: 56880
Total RAM Bits: 4276224
Number of I/O: -
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存6,304

XC5VLX30-2FF324I

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

Number of LABs/CLBs: 2400
Number of Logic Elements/Cells: 30720
Total RAM Bits: 1179648
Number of I/O: 220
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-BBGA, FCBGA
Supplier Device Package: 324-FCBGA (19x19)

封裝: 324-BBGA, FCBGA

庫存4,576

XC4VLX25-11SFG363I

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

封裝: 363-FBGA, FCBGA

庫存3,376

XC2VP7-5FFG896I

Xilinx Inc.

IC FPGA 396 I/O 896FCBGA

Number of LABs/CLBs: 1232
Number of Logic Elements/Cells: 11088
Total RAM Bits: 811008
Number of I/O: 396
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

庫存4,464

XC7A50T-3CSG325E

Xilinx Inc.

IC FPGA 150 I/O 325CSBGA

Number of LABs/CLBs: 4075
Number of Logic Elements/Cells: 52160
Total RAM Bits: 2764800
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 325-CSBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存6,224

XC3S1400A-5FGG676C

Xilinx Inc.

IC FPGA 502 I/O 676FBGA

Number of LABs/CLBs: 2816
Number of Logic Elements/Cells: 25344
Total RAM Bits: 589824
Number of I/O: 502
Number of Gates: 1400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存6,012

XC7A35T-3FGG484E

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33208
Total RAM Bits: 1843200
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存3,152

XC3S100E-4CP132C

Xilinx Inc.

IC FPGA 83 I/O 132CSBGA

Number of LABs/CLBs: 240
Number of Logic Elements/Cells: 2160
Total RAM Bits: 73728
Number of I/O: 83
Number of Gates: 100000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 132-TFBGA, CSPBGA
Supplier Device Package: 132-CSPBGA (8x8)

封裝: 132-TFBGA, CSPBGA

庫存5,840

XC95288XV-10TQ144C

Xilinx Inc.

IC CPLD 288MC 10NS 144TQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 2.37 V ~ 2.62 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 117
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存6,288

XC7S100-1FGGA484I

Xilinx Inc.

XC7S100-1FGGA484I

Number of LABs/CLBs: 8000
Number of Logic Elements/Cells: 102400
Total RAM Bits: 4423680
Number of I/O: 338
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存7,088

XCVU13P-3FLGA2577E

Xilinx Inc.

XCVU13P-3FLGA2577E

Number of LABs/CLBs: 216000
Number of Logic Elements/Cells: 3780000
Total RAM Bits: 514867200
Number of I/O: 448
Number of Gates: -
Voltage - Supply: 0.873 V ~ 0.927 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 2577-BBGA, FCBGA
Supplier Device Package: 2577-FCBGA (52.5x52.5)

封裝: 2577-BBGA, FCBGA

庫存4,400

XCVU11P-2FLGC2104I

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

Number of LABs/CLBs: 162000
Number of Logic Elements/Cells: 2835000
Total RAM Bits: 396150400
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

庫存4,592

XCVU080-H1FFVB1760E

Xilinx Inc.

IC FPGA VIRTEX-U 1760FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 1.030 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存3,712