TE Connectivity Passive Product 產品

H848R7BDA

TE Connectivity Passive Product

RES 48.7 OHM 1/4W 0.1% AXIAL

• Resistance: 48.7 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

H844K2BCA

TE Connectivity Passive Product

RES 44.2K OHM 1/4W 0.1% AXIAL

• Resistance: 44.2 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

ER583R3JT

TE Connectivity Passive Product

RES 3.30 OHM 7W 5% AXIAL

• Resistance: 3.3 Ohms
• Tolerance: ±5%
• Power (Watts): 7W
• Composition: Wirewound
• Features: -
• Temperature Coefficient: 0/ +60ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.315" Dia x 0.874" L (8.00mm x 22.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

CFR25J5M6

TE Connectivity Passive Product

RES 5.60M OHM 1/3W 5% AXIAL

• Resistance: 5.6 MOhms
• Tolerance: ±5%
• Power (Watts): 0.333W, 1/3W
• Composition: Carbon Film
• Features: -
• Temperature Coefficient: 0/ -1500ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.268" L (2.50mm x 6.80mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

RP73D2B825KBTDF

TE Connectivity Passive Product

RES SMD 825K OHM 0.1% 1/4W 1206

• Resistance: 825 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

RP73D2B90R9BTDF

TE Connectivity Passive Product

RES SMD 90.9 OHM 0.1% 1/4W 1206

• Resistance: 90.9 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRGH2512F26K1

TE Connectivity Passive Product

RES SMD 26.1K OHM 1% 2W 2512

• Resistance: 26.1 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGH2512F1K37

TE Connectivity Passive Product

RES SMD 1.37K OHM 1% 2W 2512

• Resistance: 1.37 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGH2512F715R

TE Connectivity Passive Product

RES SMD 715 OHM 1% 2W 2512

• Resistance: 715 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CPF0603B8R06E1

TE Connectivity Passive Product

RES SMD 8.06 OHM 0.1% 1/16W 0603

• Resistance: 8.06 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CPF0805B59KE

TE Connectivity Passive Product

RES SMD 59K OHM 0.1% 1/10W 0805

• Resistance: 59 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGV2512F52K3

TE Connectivity Passive Product

RES SMD 52.3K OHM 1% 1W 2512

• Resistance: 52.3 kOhms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGV2010F158K

TE Connectivity Passive Product

RES SMD 158K OHM 1% 1/2W 2010

• Resistance: 158 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2010 (5025 Metric)

CRG0201F140K

TE Connectivity Passive Product

RES SMD 140K OHM 1% 1/20W 0201

• Resistance: 140 kOhms
• Tolerance: ±1%
• Power (Watts): 0.05W, 1/20W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (Max): 0.010" (0.26mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0201 (0603 Metric)

CRG0201F121R

TE Connectivity Passive Product

RES SMD 121 OHM 1% 1/20W 0201

• Resistance: 121 Ohms
• Tolerance: ±1%
• Power (Watts): 0.05W, 1/20W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0201 (0603 Metric)
• Supplier Device Package: 0201
• Size / Dimension: 0.024" L x 0.012" W (0.60mm x 0.30mm)
• Height - Seated (Max): 0.010" (0.26mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0201 (0603 Metric)

CRGH1206F43K2

TE Connectivity Passive Product

RES SMD 43.2K OHM 1% 1/2W 1206

• Resistance: 43.2 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRGH0805F2K21

TE Connectivity Passive Product

RES SMD 2.21K OHM 1% 1/3W 0805

• Resistance: 2.21 kOhms
• Tolerance: ±1%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGH0805F27R4

TE Connectivity Passive Product

RES SMD 27.4 OHM 1% 1/3W 0805

• Resistance: 27.4 Ohms
• Tolerance: ±1%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGV0603F187K

TE Connectivity Passive Product

RES SMD 187K OHM 1% 1/10W 0603

• Resistance: 187 kOhms
• Tolerance: ±1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRG1206F390R

TE Connectivity Passive Product

RES SMD 390 OHM 1% 1/4W 1206

• Resistance: 390 Ohms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRGH0603F41R2

TE Connectivity Passive Product

RES SMD 41.2 OHM 1% 1/5W 0603

• Resistance: 41.2 Ohms
• Tolerance: ±1%
• Power (Watts): 0.2W, 1/5W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRG1206J2M2

TE Connectivity Passive Product

RES SMD 2.2M OHM 5% 1/4W 1206

• Resistance: 2.2 MOhms
• Tolerance: ±5%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

3-2176089-9

TE Connectivity Passive Product

RES SMD 28K OHM 0.1% 1/6W 0603

• Resistance: 28 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

RN73C2A200RBTD

TE Connectivity Passive Product

RES SMD 200 OHM 0.1% 1/10W 0805

• Resistance: 200 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CPF0603B6R8E1

TE Connectivity Passive Product

RES SMD 6.8 OHM 0.1% 1/16W 0603

• Resistance: 6.8 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

35215K1FT

TE Connectivity Passive Product

RES SMD 5.1K OHM 1% 2W 2512

• Resistance: 5.1 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: -
• Size / Dimension: 0.248" L x 0.126" W (6.30mm x 3.20mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

TE200B82RJ

TE Connectivity Passive Product

RES CHAS MNT 82 OHM 5% 200W

• Resistance: 82 Ohms
• Tolerance: ±5%
• Power (Watts): 200W
• Composition: Wirewound
• Temperature Coefficient: ±440ppm/°C
• Operating Temperature: -25°C ~ 225°C
• Features: Flame Proof, Safety
• Coating, Housing Type: Silicone Coated
• Mounting Feature: Brackets
• Size / Dimension: 1.575" Dia x 7.677" L (40.00mm x 195.00mm)
• Height - Seated (Max): -
• Lead Style: Solder Lugs
• Package / Case: Radial, Tubular
• Failure Rate: -

封裝: Radial, Tubular

HSA5R10J

TE Connectivity Passive Product

RES CHAS MNT 0.1 OHM 5% 10W

• Resistance: 100 mOhms
• Tolerance: ±5%
• Power (Watts): 10W
• Composition: Wirewound
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 0.669" L x 0.669" W (17.00mm x 17.00mm)
• Height - Seated (Max): 0.354" (9.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封裝: Axial, Box