TE Connectivity Passive Product 產品

H411R8BYA

TE Connectivity Passive Product

RES 11.8 OHM 1/2W 0.1% AXIAL

• Resistance: 11.8 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.5W, 1/2W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

H4P11K5DCA

TE Connectivity Passive Product

RES 11.5K OHM 1W 0.5% AXIAL

• Resistance: 11.5 kOhms
• Tolerance: ±0.5%
• Power (Watts): 1W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

H4P8K2FCA

TE Connectivity Passive Product

RES 8.20K OHM 1W 1% AXIAL

• Resistance: 8.2 kOhms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

H891RFZA

TE Connectivity Passive Product

RES 91.0 OHM 1/4W 1% AXIAL

• Resistance: 91 Ohms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

RP73D2B11KBTDF

TE Connectivity Passive Product

RES SMD 11K OHM 0.1% 1/4W 1206

• Resistance: 11 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

RP73D2B806RBTDF

TE Connectivity Passive Product

RES SMD 806 OHM 0.1% 1/4W 1206

• Resistance: 806 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

RP73D2B19R1BTDF

TE Connectivity Passive Product

RES SMD 19.1 OHM 0.1% 1/4W 1206

• Resistance: 19.1 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

RP73D2A22R6BTDF

TE Connectivity Passive Product

RES SMD 22.6 OHM 0.1% 1/8W 0805

• Resistance: 22.6 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

RP73D2A18R7BTDF

TE Connectivity Passive Product

RES SMD 18.7 OHM 0.1% 1/8W 0805

• Resistance: 18.7 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGH2512F130K

TE Connectivity Passive Product

RES SMD 130K OHM 1% 2W 2512

• Resistance: 130 kOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGH2512F200R

TE Connectivity Passive Product

RES SMD 200 OHM 1% 2W 2512

• Resistance: 200 Ohms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CPF0603B105KE1

TE Connectivity Passive Product

RES SMD 105K OHM 0.1% 1/16W 0603

• Resistance: 105 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRGV2010F137K

TE Connectivity Passive Product

RES SMD 137K OHM 1% 1/2W 2010

• Resistance: 137 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2010 (5025 Metric)

3520160KJT

TE Connectivity Passive Product

RES SMD 160K OHM 5% 1W 2512

• Resistance: 160 kOhms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: SMD
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

35203R6JT

TE Connectivity Passive Product

RES SMD 3.6 OHM 5% 1W 2512

• Resistance: 3.6 Ohms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±350ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: SMD
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGH1206F30R1

TE Connectivity Passive Product

RES SMD 30.1 OHM 1% 1/2W 1206

• Resistance: 30.1 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRGH0805F5K23

TE Connectivity Passive Product

RES SMD 5.23K OHM 1% 1/3W 0805

• Resistance: 5.23 kOhms
• Tolerance: ±1%
• Power (Watts): 0.333W, 1/3W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.083" L x 0.051" W (2.10mm x 1.30mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGH0603F301R

TE Connectivity Passive Product

RES SMD 301 OHM 1% 1/5W 0603

• Resistance: 301 Ohms
• Tolerance: ±1%
• Power (Watts): 0.2W, 1/5W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRG0805F51K

TE Connectivity Passive Product

RES SMD 51K OHM 1% 1/8W 0805

• Resistance: 51 kOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRGH0603J91R

TE Connectivity Passive Product

RES SMD 91 OHM 5% 1/5W 0603

• Resistance: 91 Ohms
• Tolerance: ±5%
• Power (Watts): 0.2W, 1/5W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRG0603F590R

TE Connectivity Passive Product

RES SMD 590 OHM 1% 1/10W 0603

• Resistance: 590 Ohms
• Tolerance: ±1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

3-2176090-1

TE Connectivity Passive Product

RES SMD 267K OHM 0.1% 1/6W 0603

• Resistance: 267 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CPF0402B95K3E1

TE Connectivity Passive Product

RES SMD 95.3KOHM 0.1% 1/16W 0402

• Resistance: 95.3 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0402 (1005 Metric)

RN73C1E57K6BTD

TE Connectivity Passive Product

RES SMD 57.6KOHM 0.1% 1/16W 0402

• Resistance: 57.6 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0402 (1005 Metric)

RN73C1E25K5BTD

TE Connectivity Passive Product

RES SMD 25.5KOHM 0.1% 1/16W 0402

• Resistance: 25.5 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0402 (1005 Metric)

CPF0603F5K11C1

TE Connectivity Passive Product

RES SMD 5.11K OHM 1% 1/16W 0603

• Resistance: 5.11 kOhms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

THS156R8J

TE Connectivity Passive Product

RES CHAS MNT 6.8 OHM 5% 15W

• Resistance: 6.8 Ohms
• Tolerance: ±5%
• Power (Watts): 15W
• Composition: Wirewound
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 0.827" L x 0.827" W (21.00mm x 21.00mm)
• Height - Seated (Max): 0.433" (11.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封裝: Axial, Box

36501E33NJTDG

TE Connectivity Passive Product

FIXED IND 33NH 400MA 350 MOHM

• Type: Wirewound
• Material - Core: -
• Inductance: 33nH
• Tolerance: ±5%
• Current Rating: 400mA
• Current - Saturation: -
• Shielding: Unshielded
• DC Resistance (DCR): 350 mOhm Max
• Q @ Freq: 24 @ 250MHz
• Frequency - Self Resonant: 2.35GHz
• Ratings: -
• Operating Temperature: -40°C ~ 125°C
• Frequency - Test: 250MHz
• Features: -
• Mounting Type: Surface Mount
• Package / Case: Nonstandard
• Supplier Device Package: 0402 (1005 Metric)
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.015" (0.37mm)

封裝: Nonstandard