TE Connectivity Passive Product 產品

H81K91BDA

TE Connectivity Passive Product

RES 1.91K OHM 1/4W 0.1% AXIAL

• Resistance: 1.91 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.098" Dia x 0.283" L (2.50mm x 7.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

H4P14K7DZA

TE Connectivity Passive Product

RES 14.7K OHM 1W 0.5% AXIAL

• Resistance: 14.7 kOhms
• Tolerance: ±0.5%
• Power (Watts): 1W
• Composition: Metal Film
• Features: Pulse Withstanding
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.146" Dia x 0.394" L (3.70mm x 10.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

ROX3SJ4K7

TE Connectivity Passive Product

RES 4.70K OHM 3W 5% AXIAL

• Resistance: 4.7 kOhms
• Tolerance: ±5%
• Power (Watts): 3W
• Composition: Metal Oxide Film
• Features: Flame Proof, Pulse Withstanding, Safety
• Temperature Coefficient: ±350ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.217" Dia x 0.630" L (5.50mm x 16.00mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

LR1F2K2

TE Connectivity Passive Product

RES 2.20K OHM 0.6W 1% AXIAL

• Resistance: 2.2 kOhms
• Tolerance: ±1%
• Power (Watts): 0.6W
• Composition: Metal Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.091" Dia x 0.244" L (2.30mm x 6.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: Axial

RN73C2A11R3BTDF

TE Connectivity Passive Product

RES SMD 11.3 OHM 0.1% 1/10W 0805

• Resistance: 11.3 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.1W, 1/10W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±10ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

RP73D2B768KBTDF

TE Connectivity Passive Product

RES SMD 768K OHM 0.1% 1/4W 1206

• Resistance: 768 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

RP73D2A178KBTDF

TE Connectivity Passive Product

RES SMD 178K OHM 0.1% 1/8W 0805

• Resistance: 178 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±15ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CPF0603B30K1E1

TE Connectivity Passive Product

RES SMD 30.1KOHM 0.1% 1/16W 0603

• Resistance: 30.1 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CPF0603B3K92E1

TE Connectivity Passive Product

RES SMD 3.92KOHM 0.1% 1/16W 0603

• Resistance: 3.92 kOhms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

RL73K3AR39JTE

TE Connectivity Passive Product

RES SMD 0.39 OHM 5% 1W 2512

• Resistance: 390 mOhms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.122" W (6.35mm x 3.10mm)
• Height - Seated (Max): 0.033" (0.84mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGV2512F140K

TE Connectivity Passive Product

RES SMD 140K OHM 1% 1W 2512

• Resistance: 140 kOhms
• Tolerance: ±1%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±200ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.252" L x 0.126" W (6.40mm x 3.20mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

CRGH2010J2K2

TE Connectivity Passive Product

RES SMD 2.2K OHM 5% 1W 2010

• Resistance: 2.2 kOhms
• Tolerance: ±5%
• Power (Watts): 1W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2010 (5025 Metric)
• Supplier Device Package: 2010
• Size / Dimension: 0.197" L x 0.098" W (5.00mm x 2.50mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 2010 (5025 Metric)

CPF0603F768RC1

TE Connectivity Passive Product

RES SMD 768 OHM 1% 1/16W 0603

• Resistance: 768 Ohms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CPF0603F107RC1

TE Connectivity Passive Product

RES SMD 107 OHM 1% 1/16W 0603

• Resistance: 107 Ohms
• Tolerance: ±1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±50ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CRGH1206F470R

TE Connectivity Passive Product

RES SMD 470 OHM 1% 1/2W 1206

• Resistance: 470 Ohms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRGH1206F3K01

TE Connectivity Passive Product

RES SMD 3.01K OHM 1% 1/2W 1206

• Resistance: 3.01 kOhms
• Tolerance: ±1%
• Power (Watts): 0.5W, 1/2W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): -
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRG1206F510K

TE Connectivity Passive Product

RES SMD 510K OHM 1% 1/4W 1206

• Resistance: 510 kOhms
• Tolerance: ±1%
• Power (Watts): 0.25W, 1/4W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 1206 (3216 Metric)
• Supplier Device Package: 1206
• Size / Dimension: 0.122" L x 0.061" W (3.10mm x 1.55mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 1206 (3216 Metric)

CRG0805F68K

TE Connectivity Passive Product

RES SMD 68K OHM 1% 1/8W 0805

• Resistance: 68 kOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

CRG0805F2K0

TE Connectivity Passive Product

RES SMD 2K OHM 1% 1/8W 0805

• Resistance: 2 kOhms
• Tolerance: ±1%
• Power (Watts): 0.125W, 1/8W
• Composition: Thick Film
• Features: -
• Temperature Coefficient: ±100ppm/°C
• Operating Temperature: -55°C ~ 125°C
• Package / Case: 0805 (2012 Metric)
• Supplier Device Package: 0805
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Height - Seated (Max): 0.026" (0.65mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0805 (2012 Metric)

RLP73M3AR030FTDF

TE Connectivity Passive Product

RES SMD 0.03 OHM 1% 2W 2512

• Resistance: 30 mOhms
• Tolerance: ±1%
• Power (Watts): 2W
• Composition: Thick Film
• Features: Current Sense
• Temperature Coefficient: ±400ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 2512 (6432 Metric)
• Supplier Device Package: 2512
• Size / Dimension: 0.250" L x 0.124" W (6.35mm x 3.15mm)
• Height - Seated (Max): 0.028" (0.70mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 2512 (6432 Metric)

RP73PF1J47R5BTDF

TE Connectivity Passive Product

RES SMD 47.5 OHM 0.1% 1/6W 0603

• Resistance: 47.5 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.167W, 1/6W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0603 (1608 Metric)
• Supplier Device Package: 0603
• Size / Dimension: 0.061" L x 0.031" W (1.55mm x 0.80mm)
• Height - Seated (Max): 0.022" (0.55mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0603 (1608 Metric)

CPF0402B23R2E1

TE Connectivity Passive Product

RES SMD 23.2 OHM 0.1% 1/16W 0402

• Resistance: 23.2 Ohms
• Tolerance: ±0.1%
• Power (Watts): 0.063W, 1/16W
• Composition: Thin Film
• Features: -
• Temperature Coefficient: ±25ppm/°C
• Operating Temperature: -55°C ~ 155°C
• Package / Case: 0402 (1005 Metric)
• Supplier Device Package: 0402
• Size / Dimension: 0.039" L x 0.020" W (1.00mm x 0.50mm)
• Height - Seated (Max): 0.014" (0.35mm)
• Number of Terminations: 2
• Failure Rate: -

封裝: 0402 (1005 Metric)

TE1200B12RJ

TE Connectivity Passive Product

RES CHAS MNT 12 OHM 5% 1200W

• Resistance: 12 Ohms
• Tolerance: ±5%
• Power (Watts): 1200W
• Composition: Wirewound
• Temperature Coefficient: ±440ppm/°C
• Operating Temperature: -25°C ~ 225°C
• Features: Flame Proof, Safety
• Coating, Housing Type: Silicone Coated
• Mounting Feature: Brackets
• Size / Dimension: 2.362" Dia x 16.339" L (60.00mm x 415.00mm)
• Height - Seated (Max): -
• Lead Style: Solder Lugs
• Package / Case: Radial, Tubular
• Failure Rate: -

封裝: Radial, Tubular

HSA5027KJ

TE Connectivity Passive Product

RES CHAS MNT 27K OHM 5% 50W

• Resistance: 27 kOhms
• Tolerance: ±5%
• Power (Watts): 50W
• Composition: Wirewound
• Temperature Coefficient: ±30ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 2.008" L x 1.181" W (51.00mm x 30.00mm)
• Height - Seated (Max): 0.669" (17.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封裝: Axial, Box

THS50270RJ

TE Connectivity Passive Product

RES CHAS MNT 270 OHM 5% 50W

• Resistance: 270 Ohms
• Tolerance: ±5%
• Power (Watts): 50W
• Composition: Wirewound
• Temperature Coefficient: ±30ppm/°C
• Operating Temperature: -55°C ~ 200°C
• Features: -
• Coating, Housing Type: Aluminum
• Mounting Feature: Flanges
• Size / Dimension: 2.008" L x 1.181" W (51.00mm x 30.00mm)
• Height - Seated (Max): 0.669" (17.00mm)
• Lead Style: Solder Lugs
• Package / Case: Axial, Box
• Failure Rate: -

封裝: Axial, Box

TW1501KA

TE Connectivity Passive Product

POT 500 OHM 1W WIREWOUND LINEAR

• Taper: Linear
• Resistance (Ohms): 500
• Tolerance: ±10%
• Number of Gangs: 1
• Built in Switch: None
• Power (Watts): 1W
• Temperature Coefficient: ±100ppm/°C
• Number of Turns: 1
• Rotation: 285°
• Adjustment Type: User Defined
• Resistive Material: Wirewound
• Termination Style: Solder Lug
• Actuator Type: Round
• Actuator Length: 0.984" (25.00mm)
• Actuator Diameter: 0.250" (6.35mm)
• Bushing Thread: M10 x 0.75
• Mounting Type: Panel Mount

封裝: -

TW1102KA

TE Connectivity Passive Product

POT 1K OHM 1W WIREWOUND LINEAR

• Taper: Linear
• Resistance (Ohms): 1k
• Tolerance: ±10%
• Number of Gangs: 1
• Built in Switch: None
• Power (Watts): 1W
• Temperature Coefficient: ±100ppm/°C
• Number of Turns: 1
• Rotation: 285°
• Adjustment Type: User Defined
• Resistive Material: Wirewound
• Termination Style: Solder Lug
• Actuator Type: Round
• Actuator Length: 0.984" (25.00mm)
• Actuator Diameter: 0.250" (6.35mm)
• Bushing Thread: M10 x 0.75
• Mounting Type: Panel Mount

封裝: -

SC10100JT

TE Connectivity Passive Product

FIXED IND 10UH 510MA 900 MOHM TH

• Type: -
• Material - Core: -
• Inductance: 10µH
• Tolerance: ±5%
• Current Rating: 510mA
• Current - Saturation: -
• Shielding: Unshielded
• DC Resistance (DCR): 900 mOhm Max
• Q @ Freq: 45 @ 7.9MHz
• Frequency - Self Resonant: 45MHz
• Ratings: -
• Operating Temperature: -55°C ~ 100°C
• Frequency - Test: 7.9MHz
• Features: -
• Mounting Type: Through Hole
• Package / Case: Axial
• Supplier Device Package: Axial
• Size / Dimension: 0.165" Dia x 0.394" L (4.20mm x 10.00mm)
• Height - Seated (Max): -

封裝: Axial