頁 539 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

零件編號	製造商	描述	封裝	庫存	Tolerance	Power (Watts)	Composition	Features	Temperature Coefficient	Operating Temperature	Package / Case	Supplier Device Package	Size / Dimension	Height - Seated (Max)	Number of Terminations	Failure Rate
SP218RJT	TE Connectivity Passive Product	RES SMD 18 OHM 5% 2.5W 4823 Resistance: 18 Ohms Tolerance: ±5% Power (Watts): 2.5W Composition: Wirewound Features: Current Sense, Moisture Resistant Temperature Coefficient: ±30ppm/°C Operating Temperature: - Package / Case: 4823 J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 J-Lead	庫存2,340	±5%	2.5W	Wirewound	Current Sense, Moisture Resistant	±30ppm/°C	-	4823 J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
SL1R062ET	TE Connectivity Passive Product	RES SMD 0.062 OHM 3% 1W 2615 Resistance: 62 mOhms Tolerance: ±3% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存3,798	±3%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R05JT	TE Connectivity Passive Product	RES SMD 0.05 OHM 5% 1W 2615 Resistance: 50 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,094	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R047JT	TE Connectivity Passive Product	RES SMD 0.047 OHM 5% 1W 2615 Resistance: 47 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,922	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R022JT	TE Connectivity Passive Product	RES SMD 0.022 OHM 5% 1W 2615 Resistance: 22 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,994	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
CGSSL1R015J	TE Connectivity Passive Product	RES SMD 0.015 OHM 5% 1W 2615 Resistance: 15 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存4,788	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
CGSSL1R033J	TE Connectivity Passive Product	RES SMD 0.033 OHM 5% 1W 2615 Resistance: 33 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,346	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
CGSSL1R005J	TE Connectivity Passive Product	RES SMD 0.005 OHM 5% 1W 2615 Resistance: 5 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,850	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
CGSSL1R068J	TE Connectivity Passive Product	RES SMD 0.068 OHM 5% 1W 2615 Resistance: 68 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存5,688	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
CGSSL1R051J	TE Connectivity Passive Product	RES SMD 0.051 OHM 5% 1W 2615 Resistance: 51 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存4,032	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R068JT	TE Connectivity Passive Product	RES SMD 0.068 OHM 5% 1W 2615 Resistance: 68 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存4,266	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R051JT	TE Connectivity Passive Product	RES SMD 0.051 OHM 5% 1W 2615 Resistance: 51 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存6,534	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
SL1R01JT	TE Connectivity Passive Product	RES SMD 0.01 OHM 5% 1W 2615 Resistance: 10 mOhms Tolerance: ±5% Power (Watts): 1W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 2615 (6538 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm) Height - Seated (Max): 0.112" (2.84mm) Number of Terminations: 2 Failure Rate: -	封裝: 2615 (6538 Metric), J-Lead	庫存4,374	±5%	1W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	2615 (6538 Metric), J-Lead	SMD	0.255" L x 0.150" W (6.48mm x 3.81mm)	0.112" (2.84mm)	2	-
RH73X2A33GKTN	TE Connectivity Passive Product	RES SMD 33G OHM 10% 1/8W 0805 Resistance: 33 GOhms Tolerance: ±10% Power (Watts): 0.125W, 1/8W Composition: Thick Film Features: - Temperature Coefficient: ±1000ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm) Height - Seated (Max): 0.020" (0.50mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存4,392	±10%	0.125W, 1/8W	Thick Film	-	±1000ppm/°C	-55°C ~ 125°C	0805 (2012 Metric)	0805	0.079" L x 0.047" W (2.00mm x 1.20mm)	0.020" (0.50mm)	2	-
CGSSL2R068J	TE Connectivity Passive Product	RES SMD 0.068 OHM 5% 2W 4823 Resistance: 68 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存5,004	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R051J	TE Connectivity Passive Product	RES SMD 0.051 OHM 5% 2W 4823 Resistance: 51 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存6,534	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R047J	TE Connectivity Passive Product	RES SMD 0.047 OHM 5% 2W 4823 Resistance: 47 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存5,724	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R033J	TE Connectivity Passive Product	RES SMD 0.033 OHM 5% 2W 4823 Resistance: 33 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存5,940	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R022J	TE Connectivity Passive Product	RES SMD 0.022 OHM 5% 2W 4823 Resistance: 22 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存3,582	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R01J	TE Connectivity Passive Product	RES SMD 0.01 OHM 5% 2W 4823 Resistance: 10 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存5,058	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
CGSSL2R015J	TE Connectivity Passive Product	RES SMD 0.015 OHM 5% 2W 4823 Resistance: 15 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存4,266	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
SL2R005JT	TE Connectivity Passive Product	RES SMD 0.005 OHM 5% 2W 4823 Resistance: 5 mOhms Tolerance: ±5% Power (Watts): 2W Composition: Metal Foil Features: Current Sense, Moisture Resistant Temperature Coefficient: ±100ppm/°C Operating Temperature: - Package / Case: 4823 (12158 Metric), J-Lead Supplier Device Package: SMD Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm) Height - Seated (Max): 0.210" (5.33mm) Number of Terminations: 2 Failure Rate: -	封裝: 4823 (12158 Metric), J-Lead	庫存6,210	±5%	2W	Metal Foil	Current Sense, Moisture Resistant	±100ppm/°C	-	4823 (12158 Metric), J-Lead	SMD	0.478" L x 0.230" W (12.14mm x 5.84mm)	0.210" (5.33mm)	2	-
RN73C2A2K0LTDF	TE Connectivity Passive Product	RES SMD 2K OHM 0.01% 1/10W 0805 Resistance: 2 kOhms Tolerance: ±0.01% Power (Watts): 0.1W, 1/10W Composition: Thin Film Features: - Temperature Coefficient: ±10ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存5,004	±0.01%	0.1W, 1/10W	Thin Film	-	±10ppm/°C	-55°C ~ 155°C	0805 (2012 Metric)	0805	0.079" L x 0.049" W (2.00mm x 1.25mm)	0.026" (0.65mm)	2	-
RH73X2A50GNTN	TE Connectivity Passive Product	RES SMD 50G OHM 30% 1/8W 0805 Resistance: 50 GOhms Tolerance: ±30% Power (Watts): 0.125W, 1/8W Composition: Thick Film Features: - Temperature Coefficient: ±1000ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm) Height - Seated (Max): 0.020" (0.50mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存5,418	±30%	0.125W, 1/8W	Thick Film	-	±1000ppm/°C	-55°C ~ 125°C	0805 (2012 Metric)	0805	0.079" L x 0.047" W (2.00mm x 1.20mm)	0.020" (0.50mm)	2	-
RH73H1E22MJTN	TE Connectivity Passive Product	RES SMD 22M OHM 5% 1/20W 0402 Resistance: 22 MOhms Tolerance: ±5% Power (Watts): 0.05W, 1/20W Composition: Thick Film Features: - Temperature Coefficient: ±100ppm/°C Operating Temperature: -55°C ~ 125°C Package / Case: 0402 (1005 Metric) Supplier Device Package: 0402 Size / Dimension: 0.041" L x 0.020" W (1.04mm x 0.50mm) Height - Seated (Max): 0.014" (0.35mm) Number of Terminations: 2 Failure Rate: -	封裝: 0402 (1005 Metric)	庫存4,194	±5%	0.05W, 1/20W	Thick Film	-	±100ppm/°C	-55°C ~ 125°C	0402 (1005 Metric)	0402	0.041" L x 0.020" W (1.04mm x 0.50mm)	0.014" (0.35mm)	2	-
RN73C2A1K0LTDF	TE Connectivity Passive Product	RES SMD 1K OHM 0.01% 1/10W 0805 Resistance: 1 kOhms Tolerance: ±0.01% Power (Watts): 0.1W, 1/10W Composition: Thin Film Features: - Temperature Coefficient: ±10ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存3,526	±0.01%	0.1W, 1/10W	Thin Film	-	±10ppm/°C	-55°C ~ 155°C	0805 (2012 Metric)	0805	0.079" L x 0.049" W (2.00mm x 1.25mm)	0.026" (0.65mm)	2	-
RN73C2A10KLTDF	TE Connectivity Passive Product	RES SMD 10K OHM 0.01% 1/10W 0805 Resistance: 10 kOhms Tolerance: ±0.01% Power (Watts): 0.1W, 1/10W Composition: Thin Film Features: - Temperature Coefficient: ±10ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存3,924	±0.01%	0.1W, 1/10W	Thin Film	-	±10ppm/°C	-55°C ~ 155°C	0805 (2012 Metric)	0805	0.079" L x 0.049" W (2.00mm x 1.25mm)	0.026" (0.65mm)	2	-
RN73C2A102KLTDF	TE Connectivity Passive Product	RES SMD 102KOHM 0.01% 1/10W 0805 Resistance: 102 kOhms Tolerance: ±0.01% Power (Watts): 0.1W, 1/10W Composition: Thin Film Features: - Temperature Coefficient: ±10ppm/°C Operating Temperature: -55°C ~ 155°C Package / Case: 0805 (2012 Metric) Supplier Device Package: 0805 Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) Height - Seated (Max): 0.026" (0.65mm) Number of Terminations: 2 Failure Rate: -	封裝: 0805 (2012 Metric)	庫存8,406	±0.01%	0.1W, 1/10W	Thin Film	-	±10ppm/°C	-55°C ~ 155°C	0805 (2012 Metric)	0805	0.079" L x 0.049" W (2.00mm x 1.25mm)	0.026" (0.65mm)	2	-

SP218RJT

TE Connectivity Passive Product

RES SMD 18 OHM 5% 2.5W 4823

Resistance: 18 Ohms
Tolerance: ±5%
Power (Watts): 2.5W
Composition: Wirewound
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±30ppm/°C
Operating Temperature: -
Package / Case: 4823 J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 J-Lead

庫存2,340

±5%

2.5W

Wirewound

Current Sense, Moisture Resistant

±30ppm/°C

-

4823 J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

SL1R062ET

TE Connectivity Passive Product

RES SMD 0.062 OHM 3% 1W 2615

Resistance: 62 mOhms
Tolerance: ±3%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存3,798

±3%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R05JT

TE Connectivity Passive Product

RES SMD 0.05 OHM 5% 1W 2615

Resistance: 50 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,094

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R047JT

TE Connectivity Passive Product

RES SMD 0.047 OHM 5% 1W 2615

Resistance: 47 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,922

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R022JT

TE Connectivity Passive Product

RES SMD 0.022 OHM 5% 1W 2615

Resistance: 22 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,994

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

CGSSL1R015J

TE Connectivity Passive Product

RES SMD 0.015 OHM 5% 1W 2615

Resistance: 15 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存4,788

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

CGSSL1R033J

TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 1W 2615

Resistance: 33 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,346

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

CGSSL1R005J

TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 1W 2615

Resistance: 5 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,850

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

CGSSL1R068J

TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 1W 2615

Resistance: 68 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存5,688

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

CGSSL1R051J

TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 1W 2615

Resistance: 51 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存4,032

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R068JT

TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 1W 2615

Resistance: 68 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存4,266

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R051JT

TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 1W 2615

Resistance: 51 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存6,534

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

SL1R01JT

TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 1W 2615

Resistance: 10 mOhms
Tolerance: ±5%
Power (Watts): 1W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 2615 (6538 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.255" L x 0.150" W (6.48mm x 3.81mm)
Height - Seated (Max): 0.112" (2.84mm)
Number of Terminations: 2
Failure Rate: -

封裝: 2615 (6538 Metric), J-Lead

庫存4,374

±5%

1W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

2615 (6538 Metric), J-Lead

SMD

0.255" L x 0.150" W (6.48mm x 3.81mm)

0.112" (2.84mm)

2

-

RH73X2A33GKTN

TE Connectivity Passive Product

RES SMD 33G OHM 10% 1/8W 0805

Resistance: 33 GOhms
Tolerance: ±10%
Power (Watts): 0.125W, 1/8W
Composition: Thick Film
Features: -
Temperature Coefficient: ±1000ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm)
Height - Seated (Max): 0.020" (0.50mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存4,392

±10%

0.125W, 1/8W

Thick Film

-

±1000ppm/°C

-55°C ~ 125°C

0805 (2012 Metric)

0805

0.079" L x 0.047" W (2.00mm x 1.20mm)

0.020" (0.50mm)

2

-

CGSSL2R068J

TE Connectivity Passive Product

RES SMD 0.068 OHM 5% 2W 4823

Resistance: 68 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存5,004

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R051J

TE Connectivity Passive Product

RES SMD 0.051 OHM 5% 2W 4823

Resistance: 51 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存6,534

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R047J

TE Connectivity Passive Product

RES SMD 0.047 OHM 5% 2W 4823

Resistance: 47 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存5,724

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R033J

TE Connectivity Passive Product

RES SMD 0.033 OHM 5% 2W 4823

Resistance: 33 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存5,940

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R022J

TE Connectivity Passive Product

RES SMD 0.022 OHM 5% 2W 4823

Resistance: 22 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存3,582

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R01J

TE Connectivity Passive Product

RES SMD 0.01 OHM 5% 2W 4823

Resistance: 10 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存5,058

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

CGSSL2R015J

TE Connectivity Passive Product

RES SMD 0.015 OHM 5% 2W 4823

Resistance: 15 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存4,266

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

SL2R005JT

TE Connectivity Passive Product

RES SMD 0.005 OHM 5% 2W 4823

Resistance: 5 mOhms
Tolerance: ±5%
Power (Watts): 2W
Composition: Metal Foil
Features: Current Sense, Moisture Resistant
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -
Package / Case: 4823 (12158 Metric), J-Lead
Supplier Device Package: SMD
Size / Dimension: 0.478" L x 0.230" W (12.14mm x 5.84mm)
Height - Seated (Max): 0.210" (5.33mm)
Number of Terminations: 2
Failure Rate: -

封裝: 4823 (12158 Metric), J-Lead

庫存6,210

±5%

2W

Metal Foil

Current Sense, Moisture Resistant

±100ppm/°C

-

4823 (12158 Metric), J-Lead

SMD

0.478" L x 0.230" W (12.14mm x 5.84mm)

0.210" (5.33mm)

2

-

RN73C2A2K0LTDF

TE Connectivity Passive Product

RES SMD 2K OHM 0.01% 1/10W 0805

Resistance: 2 kOhms
Tolerance: ±0.01%
Power (Watts): 0.1W, 1/10W
Composition: Thin Film
Features: -
Temperature Coefficient: ±10ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存5,004

±0.01%

0.1W, 1/10W

Thin Film

-

±10ppm/°C

-55°C ~ 155°C

0805 (2012 Metric)

0805

0.079" L x 0.049" W (2.00mm x 1.25mm)

0.026" (0.65mm)

2

-

RH73X2A50GNTN

TE Connectivity Passive Product

RES SMD 50G OHM 30% 1/8W 0805

Resistance: 50 GOhms
Tolerance: ±30%
Power (Watts): 0.125W, 1/8W
Composition: Thick Film
Features: -
Temperature Coefficient: ±1000ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm)
Height - Seated (Max): 0.020" (0.50mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存5,418

±30%

0.125W, 1/8W

Thick Film

-

±1000ppm/°C

-55°C ~ 125°C

0805 (2012 Metric)

0805

0.079" L x 0.047" W (2.00mm x 1.20mm)

0.020" (0.50mm)

2

-

RH73H1E22MJTN

TE Connectivity Passive Product

RES SMD 22M OHM 5% 1/20W 0402

Resistance: 22 MOhms
Tolerance: ±5%
Power (Watts): 0.05W, 1/20W
Composition: Thick Film
Features: -
Temperature Coefficient: ±100ppm/°C
Operating Temperature: -55°C ~ 125°C
Package / Case: 0402 (1005 Metric)
Supplier Device Package: 0402
Size / Dimension: 0.041" L x 0.020" W (1.04mm x 0.50mm)
Height - Seated (Max): 0.014" (0.35mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0402 (1005 Metric)

庫存4,194

±5%

0.05W, 1/20W

Thick Film

-

±100ppm/°C

-55°C ~ 125°C

0402 (1005 Metric)

0402

0.041" L x 0.020" W (1.04mm x 0.50mm)

0.014" (0.35mm)

2

-

RN73C2A1K0LTDF

TE Connectivity Passive Product

RES SMD 1K OHM 0.01% 1/10W 0805

Resistance: 1 kOhms
Tolerance: ±0.01%
Power (Watts): 0.1W, 1/10W
Composition: Thin Film
Features: -
Temperature Coefficient: ±10ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存3,526

±0.01%

0.1W, 1/10W

Thin Film

-

±10ppm/°C

-55°C ~ 155°C

0805 (2012 Metric)

0805

0.079" L x 0.049" W (2.00mm x 1.25mm)

0.026" (0.65mm)

2

-

RN73C2A10KLTDF

TE Connectivity Passive Product

RES SMD 10K OHM 0.01% 1/10W 0805

Resistance: 10 kOhms
Tolerance: ±0.01%
Power (Watts): 0.1W, 1/10W
Composition: Thin Film
Features: -
Temperature Coefficient: ±10ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存3,924

±0.01%

0.1W, 1/10W

Thin Film

-

±10ppm/°C

-55°C ~ 155°C

0805 (2012 Metric)

0805

0.079" L x 0.049" W (2.00mm x 1.25mm)

0.026" (0.65mm)

2

-

RN73C2A102KLTDF

TE Connectivity Passive Product

RES SMD 102KOHM 0.01% 1/10W 0805

Resistance: 102 kOhms
Tolerance: ±0.01%
Power (Watts): 0.1W, 1/10W
Composition: Thin Film
Features: -
Temperature Coefficient: ±10ppm/°C
Operating Temperature: -55°C ~ 155°C
Package / Case: 0805 (2012 Metric)
Supplier Device Package: 0805
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (Max): 0.026" (0.65mm)
Number of Terminations: 2
Failure Rate: -

封裝: 0805 (2012 Metric)

庫存8,406

±0.01%

0.1W, 1/10W

Thin Film

-

±10ppm/°C

-55°C ~ 155°C

0805 (2012 Metric)

0805

0.079" L x 0.049" W (2.00mm x 1.25mm)

0.026" (0.65mm)

2

-