頁 508 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  508/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RN73C2A22KBTDF
TE Connectivity Passive Product

RES SMD 22K OHM 0.1% 1/10W 0805

  • Resistance: 22 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存3,744
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A33KBTDF
TE Connectivity Passive Product

RES SMD 33K OHM 0.1% 1/10W 0805

  • Resistance: 33 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存5,742
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9R76BTDF
TE Connectivity Passive Product

RES SMD 9.76 OHM 0.1% 1/10W 0805

  • Resistance: 9.76 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,424
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9R53BTDF
TE Connectivity Passive Product

RES SMD 9.53 OHM 0.1% 1/10W 0805

  • Resistance: 9.53 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存5,022
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9R31BTDF
TE Connectivity Passive Product

RES SMD 9.31 OHM 0.1% 1/10W 0805

  • Resistance: 9.31 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存3,546
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A9R09BTDF
TE Connectivity Passive Product

RES SMD 9.09 OHM 0.1% 1/10W 0805

  • Resistance: 9.09 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,714
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A8R87BTDF
TE Connectivity Passive Product

RES SMD 8.87 OHM 0.1% 1/10W 0805

  • Resistance: 8.87 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存2,880
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A8R66BTDF
TE Connectivity Passive Product

RES SMD 8.66 OHM 0.1% 1/10W 0805

  • Resistance: 8.66 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存2,100
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A8R45BTDF
TE Connectivity Passive Product

RES SMD 8.45 OHM 0.1% 1/10W 0805

  • Resistance: 8.45 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存4,320
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A8R06BTDF
TE Connectivity Passive Product

RES SMD 8.06 OHM 0.1% 1/10W 0805

  • Resistance: 8.06 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存5,760
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A7R87BTDF
TE Connectivity Passive Product

RES SMD 7.87 OHM 0.1% 1/10W 0805

  • Resistance: 7.87 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,624
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A7R68BTDF
TE Connectivity Passive Product

RES SMD 7.68 OHM 0.1% 1/10W 0805

  • Resistance: 7.68 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,370
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A7R15BTDF
TE Connectivity Passive Product

RES SMD 7.15 OHM 0.1% 1/10W 0805

  • Resistance: 7.15 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,028
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R98BTDF
TE Connectivity Passive Product

RES SMD 6.98 OHM 0.1% 1/10W 0805

  • Resistance: 6.98 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存2,250
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R81BTDF
TE Connectivity Passive Product

RES SMD 6.81 OHM 0.1% 1/10W 0805

  • Resistance: 6.81 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存3,114
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R65BTDF
TE Connectivity Passive Product

RES SMD 6.65 OHM 0.1% 1/10W 0805

  • Resistance: 6.65 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存5,112
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R49BTDF
TE Connectivity Passive Product

RES SMD 6.49 OHM 0.1% 1/10W 0805

  • Resistance: 6.49 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,606
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R34BTDF
TE Connectivity Passive Product

RES SMD 6.34 OHM 0.1% 1/10W 0805

  • Resistance: 6.34 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,678
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R19BTDF
TE Connectivity Passive Product

RES SMD 6.19 OHM 0.1% 1/10W 0805

  • Resistance: 6.19 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,748
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5R9BTDF
TE Connectivity Passive Product

RES SMD 5.9 OHM 0.1% 1/10W 0805

  • Resistance: 5.9 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,532
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5R62BTDF
TE Connectivity Passive Product

RES SMD 5.62 OHM 0.1% 1/10W 0805

  • Resistance: 5.62 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,876
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5R49BTDF
TE Connectivity Passive Product

RES SMD 5.49 OHM 0.1% 1/10W 0805

  • Resistance: 5.49 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存3,672
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5R36BTDF
TE Connectivity Passive Product

RES SMD 5.36 OHM 0.1% 1/10W 0805

  • Resistance: 5.36 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存7,740
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5R23BTDF
TE Connectivity Passive Product

RES SMD 5.23 OHM 0.1% 1/10W 0805

  • Resistance: 5.23 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存8,244
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A160KBTDF
TE Connectivity Passive Product

RES SMD 160K OHM 0.1% 1/10W 0805

  • Resistance: 160 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存5,814
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A4R7BTDF
TE Connectivity Passive Product

RES SMD 4.7 OHM 0.1% 1/10W 0805

  • Resistance: 4.7 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存3,348
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A4K3BTDF
TE Connectivity Passive Product

RES SMD 4.3K OHM 0.1% 1/10W 0805

  • Resistance: 4.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存6,768
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A3K3BTDF
TE Connectivity Passive Product

RES SMD 3.3K OHM 0.1% 1/10W 0805

  • Resistance: 3.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 0805 (2012 Metric)
庫存2,016
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-