頁 477 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  477/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2B8K45BTDF
TE Connectivity Passive Product

RES SMD 8.45K OHM 0.1% 1/4W 1206

  • Resistance: 8.45 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,124
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B8K25BTDF
TE Connectivity Passive Product

RES SMD 8.25K OHM 0.1% 1/4W 1206

  • Resistance: 8.25 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,286
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B8K06BTDF
TE Connectivity Passive Product

RES SMD 8.06K OHM 0.1% 1/4W 1206

  • Resistance: 8.06 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,046
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B7K87BTDF
TE Connectivity Passive Product

RES SMD 7.87K OHM 0.1% 1/4W 1206

  • Resistance: 7.87 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存6,462
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B7K68BTDF
TE Connectivity Passive Product

RES SMD 7.68K OHM 0.1% 1/4W 1206

  • Resistance: 7.68 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,002
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B7K5BTDF
TE Connectivity Passive Product

RES SMD 7.5K OHM 0.1% 1/4W 1206

  • Resistance: 7.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,994
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B7K32BTDF
TE Connectivity Passive Product

RES SMD 7.32K OHM 0.1% 1/4W 1206

  • Resistance: 7.32 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,266
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B7K15BTDF
TE Connectivity Passive Product

RES SMD 7.15K OHM 0.1% 1/4W 1206

  • Resistance: 7.15 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,898
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K98BTDF
TE Connectivity Passive Product

RES SMD 6.98K OHM 0.1% 1/4W 1206

  • Resistance: 6.98 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,164
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K81BTDF
TE Connectivity Passive Product

RES SMD 6.81K OHM 0.1% 1/4W 1206

  • Resistance: 6.81 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,100
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K65BTDF
TE Connectivity Passive Product

RES SMD 6.65K OHM 0.1% 1/4W 1206

  • Resistance: 6.65 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,922
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K49BTDF
TE Connectivity Passive Product

RES SMD 6.49K OHM 0.1% 1/4W 1206

  • Resistance: 6.49 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,428
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K34BTDF
TE Connectivity Passive Product

RES SMD 6.34K OHM 0.1% 1/4W 1206

  • Resistance: 6.34 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,820
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K19BTDF
TE Connectivity Passive Product

RES SMD 6.19K OHM 0.1% 1/4W 1206

  • Resistance: 6.19 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,344
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B6K04BTDF
TE Connectivity Passive Product

RES SMD 6.04K OHM 0.1% 1/4W 1206

  • Resistance: 6.04 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,384
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K9BTDF
TE Connectivity Passive Product

RES SMD 5.9K OHM 0.1% 1/4W 1206

  • Resistance: 5.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,526
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K76BTDF
TE Connectivity Passive Product

RES SMD 5.76K OHM 0.1% 1/4W 1206

  • Resistance: 5.76 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,824
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K62BTDF
TE Connectivity Passive Product

RES SMD 5.62K OHM 0.1% 1/4W 1206

  • Resistance: 5.62 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,356
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K49BTDF
TE Connectivity Passive Product

RES SMD 5.49K OHM 0.1% 1/4W 1206

  • Resistance: 5.49 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,748
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K36BTDF
TE Connectivity Passive Product

RES SMD 5.36K OHM 0.1% 1/4W 1206

  • Resistance: 5.36 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,510
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K23BTDF
TE Connectivity Passive Product

RES SMD 5.23K OHM 0.1% 1/4W 1206

  • Resistance: 5.23 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,330
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B5K11BTDF
TE Connectivity Passive Product

RES SMD 5.11K OHM 0.1% 1/4W 1206

  • Resistance: 5.11 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,562
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K99BTDF
TE Connectivity Passive Product

RES SMD 4.99K OHM 0.1% 1/4W 1206

  • Resistance: 4.99 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,956
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K87BTDF
TE Connectivity Passive Product

RES SMD 4.87K OHM 0.1% 1/4W 1206

  • Resistance: 4.87 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,916
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K75BTDF
TE Connectivity Passive Product

RES SMD 4.75K OHM 0.1% 1/4W 1206

  • Resistance: 4.75 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,472
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K64BTDF
TE Connectivity Passive Product

RES SMD 4.64K OHM 0.1% 1/4W 1206

  • Resistance: 4.64 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,078
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K53BTDF
TE Connectivity Passive Product

RES SMD 4.53K OHM 0.1% 1/4W 1206

  • Resistance: 4.53 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,868
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B4K42BTDF
TE Connectivity Passive Product

RES SMD 4.42K OHM 0.1% 1/4W 1206

  • Resistance: 4.42 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,574
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-