頁 469 - TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式 | 黑森爾電子
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TE Connectivity Passive Product 產品 - 晶片電阻 - 表面黏著式

記錄 15,287
頁  469/546
圖片
零件編號
製造商
描述
封裝
庫存
數量
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2B39R2BTDF
TE Connectivity Passive Product

RES SMD 39.2 OHM 0.1% 1/4W 1206

  • Resistance: 39.2 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,562
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B38R3BTDF
TE Connectivity Passive Product

RES SMD 38.3 OHM 0.1% 1/4W 1206

  • Resistance: 38.3 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,590
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B37R4BTDF
TE Connectivity Passive Product

RES SMD 37.4 OHM 0.1% 1/4W 1206

  • Resistance: 37.4 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,616
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B36R5BTDF
TE Connectivity Passive Product

RES SMD 36.5 OHM 0.1% 1/4W 1206

  • Resistance: 36.5 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,040
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B35R7BTDF
TE Connectivity Passive Product

RES SMD 35.7 OHM 0.1% 1/4W 1206

  • Resistance: 35.7 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,490
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B34R8BTDF
TE Connectivity Passive Product

RES SMD 34.8 OHM 0.1% 1/4W 1206

  • Resistance: 34.8 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,266
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B34RBTDF
TE Connectivity Passive Product

RES SMD 34 OHM 0.1% 1/4W 1206

  • Resistance: 34 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,694
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B33R2BTDF
TE Connectivity Passive Product

RES SMD 33.2 OHM 0.1% 1/4W 1206

  • Resistance: 33.2 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,632
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B32R4BTDF
TE Connectivity Passive Product

RES SMD 32.4 OHM 0.1% 1/4W 1206

  • Resistance: 32.4 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,226
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B31R6BTDF
TE Connectivity Passive Product

RES SMD 31.6 OHM 0.1% 1/4W 1206

  • Resistance: 31.6 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,366
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B30R9BTDF
TE Connectivity Passive Product

RES SMD 30.9 OHM 0.1% 1/4W 1206

  • Resistance: 30.9 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,226
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B30R1BTDF
TE Connectivity Passive Product

RES SMD 30.1 OHM 0.1% 1/4W 1206

  • Resistance: 30.1 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,970
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B29R4BTDF
TE Connectivity Passive Product

RES SMD 29.4 OHM 0.1% 1/4W 1206

  • Resistance: 29.4 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,680
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B28R7BTDF
TE Connectivity Passive Product

RES SMD 28.7 OHM 0.1% 1/4W 1206

  • Resistance: 28.7 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存8,370
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B28RBTDF
TE Connectivity Passive Product

RES SMD 28 OHM 0.1% 1/4W 1206

  • Resistance: 28 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,704
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B27R4BTDF
TE Connectivity Passive Product

RES SMD 27.4 OHM 0.1% 1/4W 1206

  • Resistance: 27.4 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,754
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B26R7BTDF
TE Connectivity Passive Product

RES SMD 26.7 OHM 0.1% 1/4W 1206

  • Resistance: 26.7 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存4,536
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B26R1BTDF
TE Connectivity Passive Product

RES SMD 26.1 OHM 0.1% 1/4W 1206

  • Resistance: 26.1 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存6,912
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B25R5BTDF
TE Connectivity Passive Product

RES SMD 25.5 OHM 0.1% 1/4W 1206

  • Resistance: 25.5 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,274
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B24R9BTDF
TE Connectivity Passive Product

RES SMD 24.9 OHM 0.1% 1/4W 1206

  • Resistance: 24.9 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,718
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B24R3BTDF
TE Connectivity Passive Product

RES SMD 24.3 OHM 0.1% 1/4W 1206

  • Resistance: 24.3 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,362
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B23R7BTDF
TE Connectivity Passive Product

RES SMD 23.7 OHM 0.1% 1/4W 1206

  • Resistance: 23.7 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存7,182
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B23R2BTDF
TE Connectivity Passive Product

RES SMD 23.2 OHM 0.1% 1/4W 1206

  • Resistance: 23.2 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,598
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B22R6BTDF
TE Connectivity Passive Product

RES SMD 22.6 OHM 0.1% 1/4W 1206

  • Resistance: 22.6 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存6,390
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B22R1BTDF
TE Connectivity Passive Product

RES SMD 22.1 OHM 0.1% 1/4W 1206

  • Resistance: 22.1 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存2,736
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B21R5BTDF
TE Connectivity Passive Product

RES SMD 21.5 OHM 0.1% 1/4W 1206

  • Resistance: 21.5 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,850
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B21RBTDF
TE Connectivity Passive Product

RES SMD 21 OHM 0.1% 1/4W 1206

  • Resistance: 21 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存3,798
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B20R5BTDF
TE Connectivity Passive Product

RES SMD 20.5 OHM 0.1% 1/4W 1206

  • Resistance: 20.5 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
封裝: 1206 (3216 Metric)
庫存5,256
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-