圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
510-AG92D-16LF= SIP ROHS, TIN/TI
|
封裝: - |
庫存4,842 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
|
封裝: - |
庫存5,850 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 20POS GOLD
|
封裝: - |
庫存2,394 |
|
20 (1 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | - | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 23POS TIN
|
封裝: - |
庫存5,778 |
|
23 (1 x 23) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存6,156 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
510-AG92D-12LF= SIP ROHS, TIN/TI
|
封裝: - |
庫存4,140 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存3,456 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
508-AG11F=SOCKET ASSY
|
封裝: - |
庫存8,244 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS TIN
|
封裝: - |
庫存7,326 |
|
24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SKT ASSY EMBOSS 56MM,RPGA989 R
|
封裝: - |
庫存7,704 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SOCKET (G/F) W/EMBOSS TAPE 56MM,
|
封裝: - |
庫存8,964 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
SOCKET ASSY(G/F) W/EMBOSS TAPE,
|
封裝: - |
庫存3,078 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
封裝: - |
庫存3,384 |
|
20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 48POS GOLD
|
封裝: - |
庫存3,564 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SOCKET ASSY
|
封裝: - |
庫存4,518 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 12POS GOLD
|
封裝: - |
庫存7,326 |
|
12 (1 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
|
封裝: - |
庫存5,760 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS TIN
|
封裝: - |
庫存6,516 |
|
24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
SOCKET ASSY
|
封裝: - |
庫存6,354 |
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 36POS GOLD
|
封裝: - |
庫存8,208 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
封裝: - |
庫存5,850 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
|
封裝: - |
庫存7,650 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存5,634 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 5µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存5,742 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存7,668 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存7,488 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存3,528 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS TIN
|
封裝: - |
庫存3,420 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |