圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TE Connectivity AMP Connectors |
CONN SOCKET PLCC 28POS TIN
|
封裝: - |
庫存4,176 |
|
28 (4 x 7) | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET PLCC 20POS TIN
|
封裝: - |
庫存7,596 |
|
20 (4 x 5) | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 100µin (2.54µm) | Phosphor Bronze | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 479POS GOLD
|
封裝: - |
庫存3,438 |
|
479 (26 x 26) | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | 30µin (0.76µm) | Copper Alloy | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET PGA 638POS GOLD
|
封裝: - |
庫存6,930 |
|
638 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Copper Alloy | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | - | Copper Alloy | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET PGA ZIF 939POS GOLD
|
封裝: - |
庫存3,528 |
|
939 (31 x 31) | 0.050" (1.27mm) | Gold | 15µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 15µin (0.38µm) | Copper Alloy | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN SOCKET PQFP 100POS TIN-LEAD
|
封裝: - |
庫存2,412 |
|
100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | 200µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 28POS GOLD
|
封裝: - |
庫存7,992 |
|
28 (2 x 14) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 32POS GOLD
|
封裝: - |
庫存8,712 |
|
32 (2 x 16) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 40POS GOLD
|
封裝: - |
庫存3,852 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存6,876 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存5,706 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 24POS GOLD
|
封裝: - |
庫存4,374 |
|
24 (2 x 12) | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS GOLD
|
封裝: - |
庫存4,860 |
|
14 (2 x 7) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS GOLD
|
封裝: - |
庫存3,490 |
|
20 (2 x 10) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 36POS GOLD
|
封裝: - |
庫存7,938 |
|
36 (2 x 18) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 23POS TIN
|
封裝: - |
庫存7,884 |
|
23 (1 x 23) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 11POS TIN
|
封裝: - |
庫存8,730 |
|
11 (1 x 11) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 10POS TIN
|
封裝: - |
庫存5,094 |
|
10 (1 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS GOLD
|
封裝: - |
庫存6,300 |
|
16 (2 x 8) | 0.100" (2.54mm) | Gold | 25µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 64POS TIN
|
封裝: - |
庫存8,658 |
|
64 (2 x 32) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 16POS TIN
|
封裝: - |
庫存8,982 |
|
16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Copper Alloy | - | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 3POS GOLD
|
封裝: - |
庫存2,412 |
|
3 (1 x 3) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS GOLD
|
封裝: - |
庫存5,904 |
|
3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN SOCKET SIP 16POS GOLD
|
封裝: - |
庫存6,210 |
|
16 (1 x 16) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic | - |
||
TE Connectivity AMP Connectors |
CONN TRANSIST TO-3 3POS TIN
|
封裝: - |
庫存2,214 |
|
3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 20POS TIN
|
封裝: - |
庫存8,622 |
|
20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 18POS GOLD
|
封裝: - |
庫存3,168 |
|
18 (2 x 9) | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
||
TE Connectivity AMP Connectors |
CONN IC DIP SOCKET 14POS TIN
|
封裝: - |
庫存3,400 |
|
14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Copper Alloy | - | -55°C ~ 105°C |