頁 25 - Preci-Dip 產品 - IC、電晶體用插槽

510-87-036-06-000101

Preci-Dip

CONN SOCKET PGA 36POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 36 (6 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,312

36 (6 x 6)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

114-87-628-41-134191

Preci-Dip

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,326

28 (2 x 14)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

299-87-308-10-001101

Preci-Dip

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,876

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole, Right Angle, Horizontal

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

117-87-316-41-105101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,264

16 (2 x 8)

0.070" (1.78mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.070" (1.78mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-624-41-006101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,034

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-424-41-006101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,498

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-324-41-006101

Preci-Dip

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,020

24 (2 x 12)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-320-41-105161

Preci-Dip

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,502

20 (2 x 10)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-318-41-105191

Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,920

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-316-41-003101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,164

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-87-316-41-008101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,834

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

114-87-432-41-117101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,556

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

114-87-632-41-117101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,698

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-642-41-001101

Preci-Dip

CONN IC DIP SOCKET 42POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,046

42 (2 x 21)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

612-83-318-41-001101

Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,040

18 (2 x 9)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-312-41-009101

Preci-Dip

CONN IC DIP SOCKET 12POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 12 (2 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,752

12 (2 x 6)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

123-87-318-41-001101

Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存8,550

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

122-87-318-41-001101

Preci-Dip

CONN IC DIP SOCKET 18POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 18 (2 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,346

18 (2 x 9)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

614-83-316-31-012101

Preci-Dip

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,726

16 (2 x 8)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

114-83-422-41-117101

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存4,050

22 (2 x 11)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

114-83-322-41-117101

Preci-Dip

CONN IC DIP SOCKET 22POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 22 (2 x 11)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,358

22 (2 x 11)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Surface Mount

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-210-41-011101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,708

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-610-41-011101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存3,942

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

116-83-310-41-011101

Preci-Dip

CONN IC DIP SOCKET 10POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Elevated, Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,138

10 (2 x 5)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Elevated, Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-632-41-005101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,902

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-432-41-005101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,146

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

110-87-632-41-605101

Preci-Dip

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,538

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C

123-83-314-41-001101

Preci-Dip

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存5,382

14 (2 x 7)

0.100" (2.54mm)

Gold

29.5µin (0.75µm)

Beryllium Copper

Through Hole

Open Frame

Wire Wrap

0.100" (2.54mm)

Tin

-

Brass

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

-55°C ~ 125°C