頁 944 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BS108,126	NXP	MOSFET N-CH 200V 300MA SOT54 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 200V Current - Continuous Drain (Id) @ 25°C: 300mA (Ta) Drive Voltage (Max Rds On, Min Rds On): 2.8V Vgs(th) (Max) @ Id: 1.8V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 1W (Ta) Rds On (Max) @ Id, Vgs: 5 Ohm @ 100mA, 2.8V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-92-3 Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存3,440
MRF8S18120HSR3	NXP	FET RF 65V 1.81GHZ NI-780S Transistor Type: LDMOS Frequency: 1.81GHz Gain: 18.2dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 800mA Power - Output: 72W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	封裝: NI-780S	庫存6,576
PZM13NB3,115	NXP	DIODE ZENER 13V 300MW SMT3 Voltage - Zener (Nom) (Vz): 13V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 10V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存4,720
BAP63-02,115	NXP	DIODE PIN 50V 100MA SOD-523 Diode Type: PIN - Single Voltage - Peak Reverse (Max): 50V Current - Max: 100mA Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz Power Dissipation (Max): 715mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封裝: SC-79, SOD-523	庫存3,856
74ABT574AD,112	NXP	IC D-TYPE POS TRG SNGL 20SOIC Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 400MHz Max Propagation Delay @ V, Max CL: 4.7ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 250µA Input Capacitance: 3pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width)	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存6,224
74LVT240PW/AUJ	NXP	IC INVERTER 4-INP DUAL 20TSSOP Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存4,064
74ABT620N,602	NXP	IC TRANSCEIVER 3ST 8BIT 20DIP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封裝: 20-DIP (0.300", 7.62mm)	庫存5,376
TDA9885HN/V3,118	NXP	IC IF-PLL I2C-BUS DEMOD 32HVQFN Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存2,512
P5020NSE1MMB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存6,576
MC7448VS1420LC	NXP	IC MPU MPC74XX 1.42GHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.42GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	封裝: 360-CLGA, FCCLGA	庫存7,376
P4040NSN7MMC	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存5,200
MCIMX283DVM4BR2	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	封裝: 289-LFBGA	庫存5,328
MK10DX256VMB7	NXP	IC MCU 32BIT 256KB FLASH 81BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 57 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 39x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	封裝: 81-LBGA	庫存5,936
MCF5272VM66R2	NXP	IC MCU 32BIT 16KB ROM 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 32 Program Memory Size: 16KB (4K x 32) Program Memory Type: ROM EEPROM Size: - RAM Size: 1K x 32 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	封裝: 196-LBGA	庫存4,192
S912XDP512J1MAL	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存4,400
MC56F8356MFVE	NXP	IC MCU 16BIT 256KB FLASH 144LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 62 Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 10K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存3,696
MC56F8357VPYE	NXP	IC MCU 16BIT 256KB FLASH 160LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 76 Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 10K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 160-LQFP Supplier Device Package: 160-LQFP (24x24)	封裝: 160-LQFP	庫存6,464
SA8027DH,518	NXP	IC FREQ SYNTHESIZER 20-TSSOP Type: Fractional N Synthesizer PLL: Yes Input: Clock Output: Clock Number of Circuits: 1 Ratio - Input:Output: 2:3 Differential - Input:Output: Yes/No Frequency - Max: 2.5GHz Divider/Multiplier: Yes/No Voltage - Supply: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存7,312
SA615D/01,112	NXP	IC MIXER 500MHZ UP CONVRT 20SO RF Type: Cellular, ASK, FSK, UHF, VHF Frequency: 500MHz Number of Mixers: 3 Gain: 13dB Noise Figure: 5dB Secondary Attributes: Up Converter Current - Supply: 7.4mA Voltage - Supply: 4.5 V ~ 8 V Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存7,884
PN7120A0EV/C10801Y	NXP	IC NFC CTLR FW/NCI 49VFBGA Function: Controller Frequency: 13.56MHz RF Type: NFC, FeliCa Secondary Attributes: - Package / Case: 49-VFBGA Supplier Device Package: 49-VFBGA (4x4.3)	封裝: 49-VFBGA	庫存8,658
OM7691/BFU730F,598	NXP	EVAL BOARD FOR BFU730F Type: Amplifier Frequency: 5GHz ~ 6GHz For Use With/Related Products: BFU730F Supplied Contents: Board	封裝: -	庫存5,742
TJA1028T/3V3/10/2Z	NXP	LIN TRANSCEIVER WITH INTEGRATED Type: Transceiver Protocol: LINbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存5,136
MKM34Z256VLQ7	NXP	KINETIS KM34: 75MHZ CORTEX-M0+ M Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 75MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LCD, WDT Number of I/O: 99 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x16b, 4x24b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,736
FC32K144HFT0MLFT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
PCF8545BTT-AY	NXP	UNIVERSAL LCD DRIVER FOR MULTIPL Display Type: LCD Configuration: 320 Segment Interface: SPI Digits or Characters: 20 Characters, 40 Characters, 320 Elements Current - Supply: 30 µA Voltage - Supply: 1.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	封裝: -	Request a Quote
MC33FS6515KAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
SAF7750EL-N207ZY	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S32G234MSBK1VUCR	NXP	S32G234M ARM CORTEX-M7, HSE W/PR Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5Gbps (4) SATA: - USB: - Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: -	Request a Quote

BS108,126

NXP

MOSFET N-CH 200V 300MA SOT54

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 200V
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Drive Voltage (Max Rds On, Min Rds On): 2.8V
Vgs(th) (Max) @ Id: 1.8V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 1W (Ta)
Rds On (Max) @ Id, Vgs: 5 Ohm @ 100mA, 2.8V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-92-3
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存3,440

MRF8S18120HSR3

NXP

FET RF 65V 1.81GHZ NI-780S

Transistor Type: LDMOS
Frequency: 1.81GHz
Gain: 18.2dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 800mA
Power - Output: 72W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

封裝: NI-780S

庫存6,576

PZM13NB3,115

NXP

DIODE ZENER 13V 300MW SMT3

Voltage - Zener (Nom) (Vz): 13V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 10V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存4,720

BAP63-02,115

NXP

DIODE PIN 50V 100MA SOD-523

Diode Type: PIN - Single
Voltage - Peak Reverse (Max): 50V
Current - Max: 100mA
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Resistance @ If, F: 1.5 Ohm @ 100mA, 100MHz
Power Dissipation (Max): 715mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封裝: SC-79, SOD-523

庫存3,856

74ABT574AD,112

NXP

IC D-TYPE POS TRG SNGL 20SOIC

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 400MHz
Max Propagation Delay @ V, Max CL: 4.7ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 250µA
Input Capacitance: 3pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存6,224

74LVT240PW/AUJ

NXP

IC INVERTER 4-INP DUAL 20TSSOP

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存4,064

74ABT620N,602

NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

庫存5,376

TDA9885HN/V3,118

NXP

IC IF-PLL I2C-BUS DEMOD 32HVQFN

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存2,512

P5020NSE1MMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存6,576

MC7448VS1420LC

NXP

IC MPU MPC74XX 1.42GHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.42GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

封裝: 360-CLGA, FCCLGA

庫存7,376

P4040NSN7MMC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存5,200

MCIMX283DVM4BR2

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -20°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Hardware ID
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

封裝: 289-LFBGA

庫存5,328

MK10DX256VMB7

NXP

IC MCU 32BIT 256KB FLASH 81BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 57
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 39x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

封裝: 81-LBGA

庫存5,936

MCF5272VM66R2

NXP

IC MCU 32BIT 16KB ROM 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Number of I/O: 32
Program Memory Size: 16KB (4K x 32)
Program Memory Type: ROM
EEPROM Size: -
RAM Size: 1K x 32
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

封裝: 196-LBGA

庫存4,192

S912XDP512J1MAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存4,400

MC56F8356MFVE

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 62
Program Memory Size: 256KB (128K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 10K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存3,696

MC56F8357VPYE

NXP

IC MCU 16BIT 256KB FLASH 160LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 76
Program Memory Size: 256KB (128K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 10K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 160-LQFP
Supplier Device Package: 160-LQFP (24x24)

封裝: 160-LQFP

庫存6,464

SA8027DH,518

NXP

IC FREQ SYNTHESIZER 20-TSSOP

Type: Fractional N Synthesizer
PLL: Yes
Input: Clock
Output: Clock
Number of Circuits: 1
Ratio - Input:Output: 2:3
Differential - Input:Output: Yes/No
Frequency - Max: 2.5GHz
Divider/Multiplier: Yes/No
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存7,312

SA615D/01,112

NXP

IC MIXER 500MHZ UP CONVRT 20SO

RF Type: Cellular, ASK, FSK, UHF, VHF
Frequency: 500MHz
Number of Mixers: 3
Gain: 13dB
Noise Figure: 5dB
Secondary Attributes: Up Converter
Current - Supply: 7.4mA
Voltage - Supply: 4.5 V ~ 8 V
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存7,884

PN7120A0EV/C10801Y

NXP

IC NFC CTLR FW/NCI 49VFBGA

Function: Controller
Frequency: 13.56MHz
RF Type: NFC, FeliCa
Secondary Attributes: -
Package / Case: 49-VFBGA
Supplier Device Package: 49-VFBGA (4x4.3)

封裝: 49-VFBGA

庫存8,658

OM7691/BFU730F,598

NXP

EVAL BOARD FOR BFU730F

Type: Amplifier
Frequency: 5GHz ~ 6GHz
For Use With/Related Products: BFU730F
Supplied Contents: Board

封裝: -

庫存5,742

TJA1028T/3V3/10/2Z

NXP

LIN TRANSCEIVER WITH INTEGRATED

Type: Transceiver
Protocol: LINbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存5,136

MKM34Z256VLQ7

NXP

KINETIS KM34: 75MHZ CORTEX-M0+ M

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 75MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LCD, WDT
Number of I/O: 99
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x16b, 4x24b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,736

FC32K144HFT0MLFT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

PCF8545BTT-AY

NXP

UNIVERSAL LCD DRIVER FOR MULTIPL

Display Type: LCD
Configuration: 320 Segment
Interface: SPI
Digits or Characters: 20 Characters, 40 Characters, 320 Elements
Current - Supply: 30 µA
Voltage - Supply: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

封裝: -

Request a Quote

MC33FS6515KAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

Request a Quote

SAF7750EL-N207ZY

NXP

CAR DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

S32G234MSBK1VUCR

NXP

S32G234M ARM CORTEX-M7, HSE W/PR

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Speed: 400MHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5Gbps (4)
SATA: -
USB: -
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: -

Request a Quote