頁 938 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BUK9516-55A,127	NXP	MOSFET N-CH 55V 66A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 66A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 3085pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 138W (Tc) Rds On (Max) @ Id, Vgs: 15 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存4,960
BUK7524-55A,127	NXP	MOSFET N-CH 55V 47A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 47A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 1310pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 106W (Tc) Rds On (Max) @ Id, Vgs: 24 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存6,112
MRF377HR3	NXP	FET RF 65V 860MHZ NI-860C Transistor Type: LDMOS Frequency: 860MHz Gain: 18.2dB Voltage - Test: 32V Current Rating: 17A Noise Figure: - Current - Test: 2A Power - Output: 45W Voltage - Rated: 65V Package / Case: NI-860C3 Supplier Device Package: NI-860C3	封裝: NI-860C3	庫存3,968
BFU530WF	NXP	TRANS RF NPN 12V 40MA SOT-323 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz Gain: 12.5dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Current - Collector (Ic) (Max): 40mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	封裝: SC-70, SOT-323	庫存6,752
NTS0101GW,125	NXP	TXRX TRANSLATING DUAL 6TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1.65V ~ 3.6V Voltage - VCCB: 2.3V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain, Tri-State Data Rate: 50Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	封裝: 6-TSSOP, SC-88, SOT-363	庫存5,360
N74F32D,623	NXP	IC GATE OR 4CH 2-INP 14-SO Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存30,000
N74F374N,602	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 165MHz Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 3mA, 24mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 86mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	封裝: 20-DIP (0.300", 7.62mm)	庫存6,336
TDA18274HD/C1,557	NXP	IC TUNER TERR/CATV 48HLQFN Type: Tuner Applications: TV Mounting Type: Surface Mount Package / Case: 48-LFQFN Exposed Pad Supplier Device Package: 48-HLQFN (7x7)	封裝: 48-LFQFN Exposed Pad	庫存6,080
P5020NSN1TNB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存5,744
P1014NSN5DFA	NXP	IC MPU Q OR IQ 800MHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封裝: 425-FBGA	庫存2,128
MPC8536AVTAUL	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存2,816
KMPC8555EPXALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存7,152
MCF52233CVM60	NXP	IC MCU 32BIT 256KB FLASH 121BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 60MHz Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 73 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LBGA Supplier Device Package: 121-MAPBGA (12x12)	封裝: 121-LBGA	庫存3,376
SPC5602PEF0VLL6	NXP	IC MCU 32BIT 256KB FLASH 100LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 20K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存5,776
MC9S08SE8VTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LIN, SCI Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存6,480
S9S08SG4E2CSC	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 4 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存7,472
S9S12ZVL32F0MLC	NXP	IC MCU 16BIT 32KB FLASH 32LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存2,096
SPC5743RK1MLU5	NXP	IC MCU 32BIT 2MB FLASH 176LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP	庫存7,380
MK64FX512VLQ12	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 41x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存5,648
SPAKDSP303VF100	NXP	IC DSP 24BIT 100MHZ 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	封裝: 196-LBGA	庫存3,664
JN5168-001-M05Z	NXP	RF TXRX MODULE 802.15.4 U.FL ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: O-QPSK Frequency: 2.4GHz Data Rate: - Power - Output: 9.5dBm Sensitivity: -96dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Not Included, U.FL Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 22mA Current - Transmitting: 35mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: 27-SMD Module	封裝: 27-SMD Module	庫存16,944
TWR-KW24D512	NXP	TOWER SYSTEM KIT Type: Transceiver; 802.15.4 Frequency: 2.4GHz For Use With/Related Products: KW2x Supplied Contents: Board, Cable	封裝: -	庫存6,084
BGU7051,118	NXP	IC AMP LNA FOR WIRELESS 10HVSON Frequency: 500MHz ~ 1.5GHz P1dB: 16.5dB Gain: 21dB Noise Figure: 0.65dB RF Type: General Purpose Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 65mA Test Frequency: 900MHz Package / Case: 10-VFDFN Exposed Pad Supplier Device Package: 10-HVSON (3x3)	封裝: 10-VFDFN Exposed Pad	庫存6,480
BGA2716,115	NXP	MMIC AMPLIFIER 6TSSOP Frequency: 50MHz ~ 3.6GHz P1dB: 8.9dBm (7.8mW) Gain: 22.9dB Noise Figure: 5.3dB RF Type: ISM Voltage - Supply: 5 V ~ 6 V Current - Supply: 15.9mA Test Frequency: 1GHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	封裝: 6-TSSOP, SC-88, SOT-363	庫存4,410
MKL17Z256VMP4R	NXP	KINETIS KL17: 48MHZ CORTEX-M0+ U Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 20x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LFBGA Supplier Device Package: 64-MAPBGA (5x5)	封裝: 64-LFBGA	庫存3,152
SAF4000EL-101Z275K	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LX2160CC72232B	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	封裝: -	Request a Quote
MIMX8DX6GVLFZAC	NXP	I.MX 8X FIPS Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F Number of Cores/Bus Width: 3 Core, 64-Bit Speed: 1.2GHz, 264MHz Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: Yes Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Ethernet: 10/100/1000Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS Package / Case: 609-BFBGA Supplier Device Package: 609-FBGA (21x21)	封裝: -	Request a Quote

BUK9516-55A,127

NXP

MOSFET N-CH 55V 66A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 3085pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 138W (Tc)
Rds On (Max) @ Id, Vgs: 15 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存4,960

BUK7524-55A,127

NXP

MOSFET N-CH 55V 47A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 47A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 1310pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 106W (Tc)
Rds On (Max) @ Id, Vgs: 24 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存6,112

MRF377HR3

NXP

FET RF 65V 860MHZ NI-860C

Transistor Type: LDMOS
Frequency: 860MHz
Gain: 18.2dB
Voltage - Test: 32V
Current Rating: 17A
Noise Figure: -
Current - Test: 2A
Power - Output: 45W
Voltage - Rated: 65V
Package / Case: NI-860C3
Supplier Device Package: NI-860C3

封裝: NI-860C3

庫存3,968

BFU530WF

NXP

TRANS RF NPN 12V 40MA SOT-323

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.1dB @ 1.8GHz
Gain: 12.5dB
Power - Max: 450mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Current - Collector (Ic) (Max): 40mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

封裝: SC-70, SOT-323

庫存6,752

NTS0101GW,125

NXP

TXRX TRANSLATING DUAL 6TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: 1.65V ~ 3.6V
Voltage - VCCB: 2.3V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain, Tri-State
Data Rate: 50Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

庫存5,360

N74F32D,623

NXP

IC GATE OR 4CH 2-INP 14-SO

Logic Type: OR Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存30,000

N74F374N,602

NXP

IC D-TYPE POS TRG SNGL 20DIP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 165MHz
Max Propagation Delay @ V, Max CL: 7.5ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 3mA, 24mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 86mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)

封裝: 20-DIP (0.300", 7.62mm)

庫存6,336

TDA18274HD/C1,557

NXP

IC TUNER TERR/CATV 48HLQFN

Type: Tuner
Applications: TV
Mounting Type: Surface Mount
Package / Case: 48-LFQFN Exposed Pad
Supplier Device Package: 48-HLQFN (7x7)

封裝: 48-LFQFN Exposed Pad

庫存6,080

P5020NSN1TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存5,744

P1014NSN5DFA

NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封裝: 425-FBGA

庫存2,128

MPC8536AVTAUL

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存2,816

KMPC8555EPXALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存7,152

MCF52233CVM60

NXP

IC MCU 32BIT 256KB FLASH 121BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 60MHz
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 73
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LBGA
Supplier Device Package: 121-MAPBGA (12x12)

封裝: 121-LBGA

庫存3,376

SPC5602PEF0VLL6

NXP

IC MCU 32BIT 256KB FLASH 100LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 20K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存5,776

MC9S08SE8VTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LIN, SCI
Peripherals: LVD, POR, PWM
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存6,480

S9S08SG4E2CSC

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 4
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存7,472

S9S12ZVL32F0MLC

NXP

IC MCU 16BIT 32KB FLASH 32LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存2,096

SPC5743RK1MLU5

NXP

IC MCU 32BIT 2MB FLASH 176LQFP

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

庫存7,380

MK64FX512VLQ12

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 41x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存5,648

SPAKDSP303VF100

NXP

IC DSP 24BIT 100MHZ 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 100MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

封裝: 196-LBGA

庫存3,664

JN5168-001-M05Z

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate: -
Power - Output: 9.5dBm
Sensitivity: -96dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Not Included, U.FL
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 22mA
Current - Transmitting: 35mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: 27-SMD Module

封裝: 27-SMD Module

庫存16,944

TWR-KW24D512

NXP

TOWER SYSTEM KIT

Type: Transceiver; 802.15.4
Frequency: 2.4GHz
For Use With/Related Products: KW2x
Supplied Contents: Board, Cable

封裝: -

庫存6,084

BGU7051,118

NXP

IC AMP LNA FOR WIRELESS 10HVSON

Frequency: 500MHz ~ 1.5GHz
P1dB: 16.5dB
Gain: 21dB
Noise Figure: 0.65dB
RF Type: General Purpose
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 65mA
Test Frequency: 900MHz
Package / Case: 10-VFDFN Exposed Pad
Supplier Device Package: 10-HVSON (3x3)

封裝: 10-VFDFN Exposed Pad

庫存6,480

BGA2716,115

NXP

MMIC AMPLIFIER 6TSSOP

Frequency: 50MHz ~ 3.6GHz
P1dB: 8.9dBm (7.8mW)
Gain: 22.9dB
Noise Figure: 5.3dB
RF Type: ISM
Voltage - Supply: 5 V ~ 6 V
Current - Supply: 15.9mA
Test Frequency: 1GHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

庫存4,410

MKL17Z256VMP4R

NXP

KINETIS KL17: 48MHZ CORTEX-M0+ U

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 20x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LFBGA
Supplier Device Package: 64-MAPBGA (5x5)

封裝: 64-LFBGA

庫存3,152

SAF4000EL-101Z275K

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LX2160CC72232B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

封裝: -

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MIMX8DX6GVLFZAC

NXP

I.MX 8X FIPS

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4F
Number of Cores/Bus Width: 3 Core, 64-Bit
Speed: 1.2GHz, 264MHz
Co-Processors/DSP: Multimedia; NEON, Hi-Fi4 DSP
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet: 10/100/1000Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
Package / Case: 609-BFBGA
Supplier Device Package: 609-FBGA (21x21)

封裝: -

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