頁 906 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
ON5200,118	NXP	MOSFET RF SOT426 D2PAK Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB Supplier Device Package: SOT-426	封裝: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB	庫存2,912
MRF5S19130HSR3	NXP	FET RF 65V 1.99GHZ NI-880S Transistor Type: LDMOS Frequency: 1.99GHz Gain: 13dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.2A Power - Output: 26W Voltage - Rated: 65V Package / Case: NI-880S Supplier Device Package: NI-880S	封裝: NI-880S	庫存24,672
BZX284-B8V2,135	NXP	DIODE ZENER 8.2V 400MW SOD2 Voltage - Zener (Nom) (Vz): 8.2V Tolerance: ±2% Power - Max: 400mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 700nA @ 5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	封裝: SOD-110	庫存7,632
LD6935L/1828PX	NXP	IC REG LIN 1.8V/2.8V 8DFN Output Configuration: Positive Output Type: Fixed Number of Regulators: 2 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V, 2.8V Voltage - Output (Max): - Voltage Dropout (Max): 0.24V @ 300mA (Typ), 0.24V @ 300mA (Typ) Current - Output: 300mA, 300mA Current - Quiescent (Iq): - Current - Supply (Max): 50µA PSRR: 80dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature, Soft Start Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-XFDFN Exposed Pad Supplier Device Package: 8-DFN (1.6x1.2)	封裝: 8-XFDFN Exposed Pad	庫存5,200
N74F540N,602	NXP	IC BUFF INVERT 8BIT 5.5V 20DIP Logic Type: Buffer, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封裝: 20-DIP (0.300", 7.62mm)	庫存5,232
TDF8546AJ/N1ZU	NXP	IC AMP AUDIO BTL DBS27P Type: Class AB Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: DBS27P Package / Case: 27-SIP, Formed Leads	封裝: 27-SIP, Formed Leads	庫存6,752
PCA9541D/03,112	NXP	IC I2C 2:1 SELECTOR 16SOIC Applications: 2-Channel I2C Multiplexer Interface: I2C, SMBus Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Mounting Type: Surface Mount	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存5,584
TJA1041AT/V,512	NXP	IC TXRX CAN HS 5.25V 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 80°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存2,960
PPC8306CVMABDCA	NXP	IC MPU MPC83XX 133MHZ 369BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 369-LFBGA Supplier Device Package: 369-PBGA (19x19)	封裝: 369-LFBGA	庫存4,752
MPC8536AVTAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存4,352
MC9S08SH4MFK	NXP	IC MCU 8BIT 4KB FLASH 24QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 17 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4)	封裝: 24-VFQFN Exposed Pad	庫存6,368
MC908QL3MDTE	NXP	IC MCU 8BIT 6KB FLASH 16TSSOP Core Processor: HC08 Core Size: 8-Bit Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: 6KB (6K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存6,160
SCF5249LAG133	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 133MHz Connectivity: I2C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I2S, POR, Serial Audio, WDT Number of I/O: 34 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 4x12b Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存2,992
MVF51NN152CMK50	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 500MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,632
MC9S08AC16MFDE	NXP	IC MCU 8BIT 16KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存4,784
SPC5743RK1MLQ5	NXP	IC MCU 32BIT 2MB FLASH 144LQFP Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V Data Converters: A/D 12b SAR, 16b Sigma-Delta Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,480
MCF51JM64VLD	NXP	IC MCU 32BIT 64KB FLASH 44LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Number of I/O: 33 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存7,620
MPX4100A	NXP	SENSOR ABS PRESS 15.2 PSI MAX Pressure Type: Absolute Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa) Output Type: Analog Voltage Output: 0.3 V ~ 4.9 V Accuracy: ±1.8% Voltage - Supply: 4.85 V ~ 5.35 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	封裝: 6-SIP Module	庫存8,280
PJF7993ATW/D1CJ	NXP	IC IMMOBIL BASESTATION 20HTSSOP Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,420
SA639DH/01,118	NXP	IC MIXER 500MHZ UP CONV 24TSSOP RF Type: ASK, DECT, FSK Frequency: 500MHz Number of Mixers: 2 Gain: 9.2dB Noise Figure: 11dB Secondary Attributes: Up Converter Current - Supply: 10mA Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存20,370
MC13851-2140EVK	NXP	IC MC13851_2140_EVK Type: Amplifier Frequency: 2.14GHz For Use With/Related Products: MC13851 Supplied Contents: Board	封裝: -	庫存3,598
MWCT1013VLHSTR	NXP	32BIT256K FLASHSTR CTM Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,168
FS32K144URT0VLHT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存5,360
S9S12GN48BMLC	NXP	S12 CORE64K FLASHAU Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存3,232
PCF8577CU-F3-026	NXP	IC LCD DIRECT/DUPLEX DRIVER DIE Display Type: - Configuration: - Interface: - Digits or Characters: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MPF5020CMBA0ES	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: -	Request a Quote
FC32K118LFT0MLFR	NXP	S32K118, 48LQFP Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LPC55S66JBD64Y	NXP	IC MCU 32BIT 256KB FLASH 64TQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	封裝: -	Request a Quote

ON5200,118

NXP

MOSFET RF SOT426 D2PAK

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB
Supplier Device Package: SOT-426

封裝: TO-263-5, D2Pak (4 Leads + Tab), TO-263BB

庫存2,912

MRF5S19130HSR3

NXP

FET RF 65V 1.99GHZ NI-880S

Transistor Type: LDMOS
Frequency: 1.99GHz
Gain: 13dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.2A
Power - Output: 26W
Voltage - Rated: 65V
Package / Case: NI-880S
Supplier Device Package: NI-880S

封裝: NI-880S

庫存24,672

BZX284-B8V2,135

NXP

DIODE ZENER 8.2V 400MW SOD2

Voltage - Zener (Nom) (Vz): 8.2V
Tolerance: ±2%
Power - Max: 400mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 700nA @ 5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

封裝: SOD-110

庫存7,632

LD6935L/1828PX

NXP

IC REG LIN 1.8V/2.8V 8DFN

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 2
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V, 2.8V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.24V @ 300mA (Typ), 0.24V @ 300mA (Typ)
Current - Output: 300mA, 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 50µA
PSRR: 80dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature, Soft Start
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-XFDFN Exposed Pad
Supplier Device Package: 8-DFN (1.6x1.2)

封裝: 8-XFDFN Exposed Pad

庫存5,200

N74F540N,602

NXP

IC BUFF INVERT 8BIT 5.5V 20DIP

Logic Type: Buffer, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

庫存5,232

TDF8546AJ/N1ZU

NXP

IC AMP AUDIO BTL DBS27P

Type: Class AB
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 25W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: DBS27P
Package / Case: 27-SIP, Formed Leads

封裝: 27-SIP, Formed Leads

庫存6,752

PCA9541D/03,112

NXP

IC I2C 2:1 SELECTOR 16SOIC

Applications: 2-Channel I2C Multiplexer
Interface: I2C, SMBus
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO
Mounting Type: Surface Mount

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存5,584

TJA1041AT/V,512

NXP

IC TXRX CAN HS 5.25V 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 80°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存2,960

PPC8306CVMABDCA

NXP

IC MPU MPC83XX 133MHZ 369BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 369-LFBGA
Supplier Device Package: 369-PBGA (19x19)

封裝: 369-LFBGA

庫存4,752

MPC8536AVTAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存4,352

MC9S08SH4MFK

NXP

IC MCU 8BIT 4KB FLASH 24QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 17
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN-EP (4x4)

封裝: 24-VFQFN Exposed Pad

庫存6,368

MC908QL3MDTE

NXP

IC MCU 8BIT 6KB FLASH 16TSSOP

Core Processor: HC08
Core Size: 8-Bit
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: 6KB (6K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存6,160

SCF5249LAG133

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 133MHz
Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I2S, POR, Serial Audio, WDT
Number of I/O: 34
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 4x12b
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存2,992

MVF51NN152CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 500MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,632

MC9S08AC16MFDE

NXP

IC MCU 8BIT 16KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存4,784

SPC5743RK1MLQ5

NXP

IC MCU 32BIT 2MB FLASH 144LQFP

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,480

MCF51JM64VLD

NXP

IC MCU 32BIT 64KB FLASH 44LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Number of I/O: 33
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存7,620

MPX4100A

NXP

SENSOR ABS PRESS 15.2 PSI MAX

Pressure Type: Absolute
Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
Output Type: Analog Voltage
Output: 0.3 V ~ 4.9 V
Accuracy: ±1.8%
Voltage - Supply: 4.85 V ~ 5.35 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

封裝: 6-SIP Module

庫存8,280

PJF7993ATW/D1CJ

NXP

IC IMMOBIL BASESTATION 20HTSSOP

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,420

SA639DH/01,118

NXP

IC MIXER 500MHZ UP CONV 24TSSOP

RF Type: ASK, DECT, FSK
Frequency: 500MHz
Number of Mixers: 2
Gain: 9.2dB
Noise Figure: 11dB
Secondary Attributes: Up Converter
Current - Supply: 10mA
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存20,370

MC13851-2140EVK

NXP

IC MC13851_2140_EVK

Type: Amplifier
Frequency: 2.14GHz
For Use With/Related Products: MC13851
Supplied Contents: Board

封裝: -

庫存3,598

MWCT1013VLHSTR

NXP

32BIT256K FLASHSTR CTM

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,168

FS32K144URT0VLHT

NXP

S32K144 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存5,360

S9S12GN48BMLC

NXP

S12 CORE64K FLASHAU

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存3,232

PCF8577CU-F3-026

NXP

IC LCD DIRECT/DUPLEX DRIVER DIE

Display Type: -
Configuration: -
Interface: -
Digits or Characters: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MPF5020CMBA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: -

Request a Quote

FC32K118LFT0MLFR

NXP

S32K118, 48LQFP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LPC55S66JBD64Y

NXP

IC MCU 32BIT 256KB FLASH 64TQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封裝: -

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