頁 888 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6S21140HSR5	NXP	FET RF 68V 2.12GHZ NI-880S Transistor Type: LDMOS Frequency: 2.12GHz Gain: 15.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.2A Power - Output: 30W Voltage - Rated: 68V Package / Case: NI-880S Supplier Device Package: NI-880S	封裝: NI-880S	庫存3,408
BAP51-03,115	NXP	DIODE PIN GP 50V 50MA SOD-323 Diode Type: PIN - Single Voltage - Peak Reverse (Max): 50V Current - Max: 50mA Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz Power Dissipation (Max): 500mW Operating Temperature: -65°C ~ 150°C (TJ) Package / Case: SC-76, SOD-323 Supplier Device Package: SOD-323	封裝: SC-76, SOD-323	庫存103,764
BAS216,135	NXP	DIODE GEN PURP 75V 250MA SOD2 Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 75V Current - Average Rectified (Io): 250mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 1µA @ 75V Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110 Operating Temperature - Junction: 150°C (Max)	封裝: SOD-110	庫存5,280
MC13892AJVL	NXP	IC PMU I.MX51/37/35/27 186MAPBGA Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Current - Supply: - Voltage - Supply: - Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 186-LFBGA Supplier Device Package: 186-PBGA (12x12)	封裝: 186-LFBGA	庫存57,912
GTL2018PW/Q900,118	NXP	IC TRANSLATOR BIDIRECT 24-TSSOP Translator Type: Mixed Signal Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 8 Voltage - VCCA: - Voltage - VCCB: - Input Signal: LVTTL Output Signal: GTL Output Type: Non-Inverted Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存6,784
74HC670D,653	NXP	IC 4X4 REGISTER FILE 3ST 16SOIC Logic Type: Register File Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 4 Function: Universal Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存2,784
74HCT175N,652	NXP	IC D-TYPE POS TRG SNGL 16DIP Function: Master Reset Type: D-Type Output Type: Differential Number of Elements: 1 Number of Bits per Element: 4 Clock Frequency: 49MHz Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 8µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	封裝: 16-DIP (0.300", 7.62mm)	庫存7,872
74LVT574PW,118	NXP	IC D-TYPE POS TRG SNGL 20TSSOP Function: Standard Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 150MHz Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.7 V ~ 3.6 V Current - Quiescent (Iq): 190µA Input Capacitance: 4pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width)	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存4,352
SA5211D/01,118	NXP	IC OPAMP TRANSIMP 180MHZ 14SO Amplifier Type: Transimpedance Number of Circuits: 1 Output Type: Differential Slew Rate: - Gain Bandwidth Product: - -3db Bandwidth: 180MHz Current - Input Bias: - Voltage - Input Offset: - Current - Supply: 26mA Current - Output / Channel: 4mA Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存7,248
TDA8568Q/N3C,112	NXP	IC AMP AUDIO PWR 35W QUAD 23SIL Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	封裝: 23-SIP Formed Leads	庫存4,016
TDA8563Q/N2/S10,11	NXP	IC AMP AUDIO PWR 55W STER 13SIL Type: Class B Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 13-PDBS Package / Case: 13-SIP Formed Leads	封裝: 13-SIP Formed Leads	庫存3,824
MC34978AEK	NXP	IC INTERFACE SW DETECT 32-SOIC Applications: Multiple Switch Detection Interface: - Voltage - Supply: 4.5 V ~ 36 V Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	庫存7,696
MCIMX536AVV8B	NXP	IC MPU I.MX53 800MHZ 529TEBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 529-FBGA Supplier Device Package: -	封裝: 529-FBGA	庫存7,040
MC68MH360AI25VL	NXP	IC MPU M683XX 25MHZ 240FQFP Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32)	封裝: 240-BFQFP	庫存4,656
MC56F8011VFAE	NXP	IC MCU 16BIT 12KB FLASH 32LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 26 Program Memory Size: 12KB (6K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存61,152
SX2531KVWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,556
MF0UL2101DUF,005	NXP	IC MIFARE ULTRALIGHT EV1 UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: - Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存2,412
PN5331B3HN/C270,55	NXP	IC NFC CNTRL 40-HVQFN Type: RFID Reader/Transponder Frequency: 13.56MHz Standards: FeliCa, ISO 14443, MIFARE, NFC Interface: - Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -30°C ~ 85°C Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: 40-VFQFN Exposed Pad	庫存30,414
TEF6635HW/V106K	NXP	IC DGTL CHIP AUTO RADIO 100HTQFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: - Applications: - Current - Receiving: - Data Interface: - Memory Size: - Antenna Connector: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,012
SPC5517EAVMG80	NXP	NXP 32-BIT MCU POWER ARCH 1.5M Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	封裝: 208-BGA	庫存6,480
PCAL6534EVJ	NXP	IC GPIO EXPANDER 34B VFBGA42 Number of I/O: 34 Interface: I²C Interrupt Output: Yes Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: - Clock Frequency: 1MHz Voltage - Supply: 1.65V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 42-VFBGA Supplier Device Package: 42-VFBGA (2.6x3)	封裝: 42-VFBGA	庫存4,080
CBTL04083ABS-558	NXP	DIFFERENTIAL MULTIPLEXER, 4 FUNC Applications: - Multiplexer/Demultiplexer Circuit: - Switch Circuit: - Number of Channels: - On-State Resistance (Max): - Voltage - Supply, Single (V+): - Voltage - Supply, Dual (V±): - -3db Bandwidth: - Features: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MKM35Z256VLQ7R	NXP	KM35: 75MHZ CORTEX-M0+ METROLOGY Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 75MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LCD, RNG, WDT Number of I/O: 99 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: -	Request a Quote
ASL5015SHNZ	NXP	IC LED DRV CTRL PWM 1.5A 36HVQFN Type: DC DC Controller Topology: Switched Capacitor (Charge Pump) Internal Switch(s): Yes Number of Outputs: 12 Voltage - Supply (Min): 4.5V Voltage - Supply (Max): 5.5V Voltage - Output: - Current - Output / Channel: 1.5A Frequency: 200MHz Dimming: PWM Applications: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 36-VFQFN Exposed Pad Supplier Device Package: 36-HVQFN (6x6)	封裝: -	Request a Quote
FS32R294HBK0MJDT	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 269-LFBGA Supplier Device Package: 269-LFBGA (14x14)	封裝: -	Request a Quote
MKE13Z128VLF7	NXP	IC MCU 32BIT 128KB FLASH 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Speed: 72MHz Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 11x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote
S32G399AACK1VUCT	NXP	IC MPU S32G3 1.3GZ/400MHZ 525BGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: -	庫存720
FS32K142HRT0MLHR	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 58 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote

MRF6S21140HSR5

NXP

FET RF 68V 2.12GHZ NI-880S

Transistor Type: LDMOS
Frequency: 2.12GHz
Gain: 15.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.2A
Power - Output: 30W
Voltage - Rated: 68V
Package / Case: NI-880S
Supplier Device Package: NI-880S

封裝: NI-880S

庫存3,408

BAP51-03,115

NXP

DIODE PIN GP 50V 50MA SOD-323

Diode Type: PIN - Single
Voltage - Peak Reverse (Max): 50V
Current - Max: 50mA
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Resistance @ If, F: 2.5 Ohm @ 10mA, 100MHz
Power Dissipation (Max): 500mW
Operating Temperature: -65°C ~ 150°C (TJ)
Package / Case: SC-76, SOD-323
Supplier Device Package: SOD-323

封裝: SC-76, SOD-323

庫存103,764

BAS216,135

NXP

DIODE GEN PURP 75V 250MA SOD2

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 75V
Current - Average Rectified (Io): 250mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 1µA @ 75V
Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110
Operating Temperature - Junction: 150°C (Max)

封裝: SOD-110

庫存5,280

MC13892AJVL

NXP

IC PMU I.MX51/37/35/27 186MAPBGA

Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 186-LFBGA
Supplier Device Package: 186-PBGA (12x12)

封裝: 186-LFBGA

庫存57,912

GTL2018PW/Q900,118

NXP

IC TRANSLATOR BIDIRECT 24-TSSOP

Translator Type: Mixed Signal
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 8
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: LVTTL
Output Signal: GTL
Output Type: Non-Inverted
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存6,784

74HC670D,653

NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

Logic Type: Register File
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 4
Function: Universal
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存2,784

74HCT175N,652

NXP

IC D-TYPE POS TRG SNGL 16DIP

Function: Master Reset
Type: D-Type
Output Type: Differential
Number of Elements: 1
Number of Bits per Element: 4
Clock Frequency: 49MHz
Max Propagation Delay @ V, Max CL: 33ns @ 4.5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 8µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)

封裝: 16-DIP (0.300", 7.62mm)

庫存7,872

74LVT574PW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

Function: Standard
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 150MHz
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.7 V ~ 3.6 V
Current - Quiescent (Iq): 190µA
Input Capacitance: 4pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存4,352

SA5211D/01,118

NXP

IC OPAMP TRANSIMP 180MHZ 14SO

Amplifier Type: Transimpedance
Number of Circuits: 1
Output Type: Differential
Slew Rate: -
Gain Bandwidth Product: -
-3db Bandwidth: 180MHz
Current - Input Bias: -
Voltage - Input Offset: -
Current - Supply: 26mA
Current - Output / Channel: 4mA
Voltage - Supply, Single/Dual (±): 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存7,248

TDA8568Q/N3C,112

NXP

IC AMP AUDIO PWR 35W QUAD 23SIL

Type: Class B
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS23P
Package / Case: 23-SIP Formed Leads

封裝: 23-SIP Formed Leads

庫存4,016

TDA8563Q/N2/S10,11

NXP

IC AMP AUDIO PWR 55W STER 13SIL

Type: Class B
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 13-PDBS
Package / Case: 13-SIP Formed Leads

封裝: 13-SIP Formed Leads

庫存3,824

MC34978AEK

NXP

IC INTERFACE SW DETECT 32-SOIC

Applications: Multiple Switch Detection
Interface: -
Voltage - Supply: 4.5 V ~ 36 V
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

庫存7,696

MCIMX536AVV8B

NXP

IC MPU I.MX53 800MHZ 529TEBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: SATA 1.5Gbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 529-FBGA
Supplier Device Package: -

封裝: 529-FBGA

庫存7,040

MC68MH360AI25VL

NXP

IC MPU M683XX 25MHZ 240FQFP

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 240-BFQFP
Supplier Device Package: 240-FQFP (32x32)

封裝: 240-BFQFP

庫存4,656

MC56F8011VFAE

NXP

IC MCU 16BIT 12KB FLASH 32LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 12KB (6K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存61,152

SX2531KVWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,556

MF0UL2101DUF,005

NXP

IC MIFARE ULTRALIGHT EV1 UNCASED

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: -
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存2,412

PN5331B3HN/C270,55

NXP

IC NFC CNTRL 40-HVQFN

Type: RFID Reader/Transponder
Frequency: 13.56MHz
Standards: FeliCa, ISO 14443, MIFARE, NFC
Interface: -
Voltage - Supply: 2.5 V ~ 3.6 V
Operating Temperature: -30°C ~ 85°C
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

庫存30,414

TEF6635HW/V106K

NXP

IC DGTL CHIP AUTO RADIO 100HTQFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: -
Applications: -
Current - Receiving: -
Data Interface: -
Memory Size: -
Antenna Connector: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,012

SPC5517EAVMG80

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

封裝: 208-BGA

庫存6,480

PCAL6534EVJ

NXP

IC GPIO EXPANDER 34B VFBGA42

Number of I/O: 34
Interface: I²C
Interrupt Output: Yes
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: -
Clock Frequency: 1MHz
Voltage - Supply: 1.65V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 42-VFBGA
Supplier Device Package: 42-VFBGA (2.6x3)

封裝: 42-VFBGA

庫存4,080

CBTL04083ABS-558

NXP

DIFFERENTIAL MULTIPLEXER, 4 FUNC

Applications: -
Multiplexer/Demultiplexer Circuit: -
Switch Circuit: -
Number of Channels: -
On-State Resistance (Max): -
Voltage - Supply, Single (V+): -
Voltage - Supply, Dual (V±): -
-3db Bandwidth: -
Features: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MKM35Z256VLQ7R

NXP

KM35: 75MHZ CORTEX-M0+ METROLOGY

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 75MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Number of I/O: 99
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 16x16b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: -

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ASL5015SHNZ

NXP

IC LED DRV CTRL PWM 1.5A 36HVQFN

Type: DC DC Controller
Topology: Switched Capacitor (Charge Pump)
Internal Switch(s): Yes
Number of Outputs: 12
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Voltage - Output: -
Current - Output / Channel: 1.5A
Frequency: 200MHz
Dimming: PWM
Applications: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 36-VFQFN Exposed Pad
Supplier Device Package: 36-HVQFN (6x6)

封裝: -

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FS32R294HBK0MJDT

NXP

S32R29 MULTICORE POWER ARCHITECT

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 269-LFBGA
Supplier Device Package: 269-LFBGA (14x14)

封裝: -

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MKE13Z128VLF7

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit Single-Core
Speed: 72MHz
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 11x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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S32G399AACK1VUCT

NXP

IC MPU S32G3 1.3GZ/400MHZ 525BGA

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 64-Bit/8 Core, 32-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: -

庫存720

FS32K142HRT0MLHR

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 58
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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