頁 884 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRFG35010NT1	NXP	FET RF 15V 3.55GHZ 1.5-PLD Transistor Type: pHEMT FET Frequency: 3.55GHz Gain: 10dB Voltage - Test: 12V Current Rating: - Noise Figure: - Current - Test: 180mA Power - Output: 9W Voltage - Rated: 15V Package / Case: PLD-1.5 Supplier Device Package: PLD-1.5	封裝: PLD-1.5	庫存36,000
MC33780EG	NXP	IC DBUS MASTER DUAL DIFF 16-SOIC Type: - Applications: - Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存24,000
N74F573N,602	NXP	IC TRANSP LATCH OCTAL 3ST 20DIP Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 3.5ns Current - Output High, Low: 3mA, 24mA Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-DIP	封裝: 20-DIP (0.300", 7.62mm)	庫存5,232
TDA19988BET/C1,118	NXP	IC HDMI TRANSMITTER 64-TFBGA Type: HDMI Transmitter Applications: Mobile Phones, Cellular, Video Displays Mounting Type: Surface Mount Package / Case: 64-TFBGA Supplier Device Package: 64-TFBGA (4.5x4.5)	封裝: 64-TFBGA	庫存4,848
TDA1519/N2,112	NXP	IC AMP AUDIO PWR 6W STER B 9SIL Type: Class B Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: - Supplier Device Package: 9-SIL MPF Package / Case: 9-SIP Exposed Tab	封裝: 9-SIP Exposed Tab	庫存4,144
SC16C852VIET,151	NXP	IC UART DUAL W/FIFO 36TFBGA Features: - Number of Channels: 2, DUART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 36-TFBGA Supplier Device Package: 36-TFBGA (3.5x3.5)	封裝: 36-TFBGA	庫存6,528
TJA1028T/5V0/20,11	NXP	IC LIN TRANSCEIVER 8-SO Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,480
MCIMX537CVV8B	NXP	IC MPU I.MX53 800MHZ 529TEBGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: SATA 1.5Gbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 529-FBGA Supplier Device Package: -	封裝: 529-FBGA	庫存3,744
KMPC8313VRAFFB	NXP	IC MPU MPC83XX 333MHZ 516BGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Exposed Pad Supplier Device Package: 516-TEPBGA (27x27)	封裝: 516-BBGA Exposed Pad	庫存5,728
MPC8360ECZUAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存6,336
MPC8343EVRADD	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	封裝: 620-BBGA Exposed Pad	庫存2,368
KMPC8272ZQTMFA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存5,440
MCF5212LCVM80J	NXP	IC MCU 32BIT 256KB FLASH 81BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	封裝: 81-LBGA	庫存6,048
MC908GR8AMDWE	NXP	IC MCU 8BIT 7.5KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 17 Program Memory Size: 7.5KB (7.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存7,840
MC68HC908JL3CDW	NXP	IC MCU 8BIT 4KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 23 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存53,076
MK50DN512CMC10	NXP	IC MCU 32BIT 512KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 78 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 27x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	封裝: 121-LFBGA	庫存7,212
LPC2106FBD48/01,15	NXP	IC MCU 32BIT 128KB FLASH 48LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存13,344
SPAKDSP321VF275	NXP	IC DSP 24BIT 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 275MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-BGA Supplier Device Package: 196-MAPBGA (15x15)	封裝: 196-BGA	庫存3,232
TEF6659HN/V102Y	NXP	IC TUNER 1CHIP RADIO DSP 32HVQFN Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: - Current - Receiving: 37mA Data Interface: - Memory Size: - Antenna Connector: - Features: - Voltage - Supply: 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存4,230
TDF8599ATH/N2/S6CY	NXP	IC POWER AMP CLASS D I2C 36HSOP Type: Class D Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm Voltage - Supply: 8 V ~ 35 V Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection Mounting Type: - Operating Temperature: - Supplier Device Package: - Package / Case: -	封裝: -	庫存2,000
SP5748CSK0ACKU2R	NXP	DUAL CORE 6M FLASH 768K RAM F Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 6MB (6M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP Exposed Pad	庫存6,768
S912XES384F1MAAR	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存5,664
MKE02Z64VLD4R	NXP	KINETIS KE02: 40MHZ CORTEX-M0+ 5 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存3,136
MC34PF8100CEEP	NXP	IC POWER MANAGEMENT I.MX8QM Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: 56-VFQFN Exposed Pad	庫存7,888
FB32K144HFT0MLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SPC5602BK0MLH6R	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Single-Core Speed: 64MHz Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
MPF7100BVMA0ES	NXP	PF7100 PMIC OTP Applications: i.MX Processors Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	封裝: -	Request a Quote
S912ZVLA12F0MFM	NXP	MAGNIV 16-BIT MCU, S12Z CORE, 12 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 6x10b, 6x12b; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	封裝: -	Request a Quote

MRFG35010NT1

NXP

FET RF 15V 3.55GHZ 1.5-PLD

Transistor Type: pHEMT FET
Frequency: 3.55GHz
Gain: 10dB
Voltage - Test: 12V
Current Rating: -
Noise Figure: -
Current - Test: 180mA
Power - Output: 9W
Voltage - Rated: 15V
Package / Case: PLD-1.5
Supplier Device Package: PLD-1.5

封裝: PLD-1.5

庫存36,000

MC33780EG

NXP

IC DBUS MASTER DUAL DIFF 16-SOIC

Type: -
Applications: -
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存24,000

N74F573N,602

NXP

IC TRANSP LATCH OCTAL 3ST 20DIP

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 3.5ns
Current - Output High, Low: 3mA, 24mA
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

庫存5,232

TDA19988BET/C1,118

NXP

IC HDMI TRANSMITTER 64-TFBGA

Type: HDMI Transmitter
Applications: Mobile Phones, Cellular, Video Displays
Mounting Type: Surface Mount
Package / Case: 64-TFBGA
Supplier Device Package: 64-TFBGA (4.5x4.5)

封裝: 64-TFBGA

庫存4,848

TDA1519/N2,112

NXP

IC AMP AUDIO PWR 6W STER B 9SIL

Type: Class B
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 6W x 2 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -
Supplier Device Package: 9-SIL MPF
Package / Case: 9-SIP Exposed Tab

封裝: 9-SIP Exposed Tab

庫存4,144

SC16C852VIET,151

NXP

IC UART DUAL W/FIFO 36TFBGA

Features: -
Number of Channels: 2, DUART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 36-TFBGA
Supplier Device Package: 36-TFBGA (3.5x3.5)

封裝: 36-TFBGA

庫存6,528

TJA1028T/5V0/20,11

NXP

IC LIN TRANSCEIVER 8-SO

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,480

MCIMX537CVV8B

NXP

IC MPU I.MX53 800MHZ 529TEBGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: SATA 1.5Gbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 529-FBGA
Supplier Device Package: -

封裝: 529-FBGA

庫存3,744

KMPC8313VRAFFB

NXP

IC MPU MPC83XX 333MHZ 516BGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA Exposed Pad
Supplier Device Package: 516-TEPBGA (27x27)

封裝: 516-BBGA Exposed Pad

庫存5,728

MPC8360ECZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存6,336

MPC8343EVRADD

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

封裝: 620-BBGA Exposed Pad

庫存2,368

KMPC8272ZQTMFA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存5,440

MCF5212LCVM80J

NXP

IC MCU 32BIT 256KB FLASH 81BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 80MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

封裝: 81-LBGA

庫存6,048

MC908GR8AMDWE

NXP

IC MCU 8BIT 7.5KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 17
Program Memory Size: 7.5KB (7.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存7,840

MC68HC908JL3CDW

NXP

IC MCU 8BIT 4KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 23
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存53,076

MK50DN512CMC10

NXP

IC MCU 32BIT 512KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 78
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 27x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封裝: 121-LFBGA

庫存7,212

LPC2106FBD48/01,15

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存13,344

SPAKDSP321VF275

NXP

IC DSP 24BIT 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 275MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-BGA
Supplier Device Package: 196-MAPBGA (15x15)

封裝: 196-BGA

庫存3,232

TEF6659HN/V102Y

NXP

IC TUNER 1CHIP RADIO DSP 32HVQFN

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: -
Current - Receiving: 37mA
Data Interface: -
Memory Size: -
Antenna Connector: -
Features: -
Voltage - Supply: 3.3V
Operating Temperature: -40°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存4,230

TDF8599ATH/N2/S6CY

NXP

IC POWER AMP CLASS D I2C 36HSOP

Type: Class D
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 250W x 1 @ 2 Ohm; 135W x 2 @ 4 Ohm
Voltage - Supply: 8 V ~ 35 V
Features: Depop, Differential Inputs, I²C, Mute, Short-Circuit and Thermal Protection
Mounting Type: -
Operating Temperature: -
Supplier Device Package: -
Package / Case: -

封裝: -

庫存2,000

SP5748CSK0ACKU2R

NXP

DUAL CORE 6M FLASH 768K RAM F

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP Exposed Pad

庫存6,768

S912XES384F1MAAR

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存5,664

MKE02Z64VLD4R

NXP

KINETIS KE02: 40MHZ CORTEX-M0+ 5

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 40MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 37
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存3,136

MC34PF8100CEEP

NXP

IC POWER MANAGEMENT I.MX8QM

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: 56-VFQFN Exposed Pad

庫存7,888

FB32K144HFT0MLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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SPC5602BK0MLH6R

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit Single-Core
Speed: 64MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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MPF7100BVMA0ES

NXP

PF7100 PMIC OTP

Applications: i.MX Processors
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

封裝: -

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S912ZVLA12F0MFM

NXP

MAGNIV 16-BIT MCU, S12Z CORE, 12

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

封裝: -

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