頁 855 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PHX14NQ20T,127	NXP	MOSFET N-CH 200V 7.6A TO220F FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 200V Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 38nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1500pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 30W (Tc) Rds On (Max) @ Id, Vgs: 230 mOhm @ 7A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220-3 Package / Case: TO-220-3 Full Pack, Isolated Tab	封裝: TO-220-3 Full Pack, Isolated Tab	庫存4,144
MRFE6VP8600HR5	NXP	FET RF 2CH 130V 860MHZ NI-1230 Transistor Type: LDMOS (Dual) Frequency: 860MHz Gain: 19.3dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 125W Voltage - Rated: 130V Package / Case: NI-1230 Supplier Device Package: NI-1230	封裝: NI-1230	庫存5,616
LD6806F/16H,115	NXP	IC REG LINEAR 1.6V 200MA 6-XSON Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.6V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	封裝: 6-XFDFN	庫存2,496
SSTUB32868ET/S,518	NXP	IC REG BUFFER CONFIG 176TFBGA Logic Type: 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 28 Operating Temperature: 0°C ~ 85°C Mounting Type: Surface Mount Package / Case: 176-TFBGA Supplier Device Package: 176-TFBGA (6x15)	封裝: 176-TFBGA	庫存2,336
74LV595D/AUJ	NXP	IC SHIFT REGISTER 8BIT 16SOIC Logic Type: Shift Register Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 8 Function: Serial to Parallel, Serial Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存2,352
TDA9881HN/V5,118	NXP	IC IF-PLL DEMOD 32HVQFN Type: Demodulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存7,200
SC18IS601IBS,157	NXP	IC I2C BUS INTERFACE 24-HVQFN Protocol: I2C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4)	封裝: 24-VFQFN Exposed Pad	庫存4,720
P1010PSN5FFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA1	封裝: 425-FBGA	庫存4,400
KMPC8343ECZQAGDB	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	封裝: 620-BBGA Exposed Pad	庫存5,824
MCIMX6Y2DVM09AA	NXP	I.MX 6ULL 900 MHZ CONSUMER W/O E Core Processor: ARM? Cortex?-A7 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 900MHz Co-Processors/DSP: Multimedia; NEON? MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Electrophoretic, LCD Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.8V, 3.3V Operating Temperature: 0°C ~ 95°C (TJ) Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	封裝: 289-LFBGA	庫存3,040
S912ZVML64F2MKHR	NXP	IC MCU 16BIT 64KB FLASH 64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP EP (10x10)	封裝: 64-LQFP Exposed Pad	庫存7,472
SVF511R3K1CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 364-LFBGA Supplier Device Package: 364-MAPBGA (17x17)	封裝: 364-LFBGA	庫存2,960
MC9RS08LA8CFT	NXP	IC MCU 8BIT 8KB FLASH 48QFN Core Processor: RS08 Core Size: 8-Bit Speed: 20MHz Connectivity: SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存2,720
MKV30F128VLF10P	NXP	IC MCU 32BIT 128KB FLASH 48LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Number of I/O: 35 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 24x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,296
LPC2367FBD100,551	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM7? Core Size: 16/32-Bit Speed: 72MHz Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 58K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 6x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存16,224
BZA956AVL,115	NXP	TVS DIODE 5.6VWM SOT665 Type: Zener Unidirectional Channels: 4 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5.6V Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: 6W Power Line Protection: No Applications: General Purpose Capacitance @ Frequency: 22pF @ 1MHz Operating Temperature: - Mounting Type: Surface Mount Package / Case: SOT-665 Supplier Device Package: SOT-665	封裝: SOT-665	庫存2,340
SA58643DP,118	NXP	IC RF SWITCH SPDT 8-TSSOP Frequency - Lower: DC Frequency - Upper: 1GHz Isolation @ Frequency: 30dB @ 900MHz (typ) Insertion Loss @ Frequency: 2dB @ 900Mhz IIP3: 33dBm (typ) Topology: Absorptive Circuit: SPDT P1dB: 18dBm (typ) OP1dB Features: Single Line Control Impedance: 50 Ohm Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3 V ~ 5.5 V RF Type: 802.11a/b/g/WiFi, WLAN Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	庫存7,470
MC32PF1510A7EP	NXP	PF1510 Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	封裝: 40-VFQFN Exposed Pad	庫存7,840
TDA8034HN/C2QL	NXP	LOW POWER SMART CARD INTERFACE Applications: - Interface: Analog Voltage - Supply: 1.8V, 3V, 5V Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (4x4) Mounting Type: Surface Mount	封裝: 24-VFQFN Exposed Pad	庫存2,432
LPC54618J512BD208E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT Number of I/O: 171 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	封裝: 208-LQFP	庫存4,048
S9S12P32J0VLH	NXP	16-BIT MCU S12 CORE 32KB FLASH Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 49 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存2,864
S912ZVL12F0MLFR	NXP	S12Z CPU 128K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,680
MKE15Z64VLF4	NXP	IC MCU 5V CM0+ TOUCH 48LQFP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,360
MIMXRT106SCVL5B	NXP	IC MCU 32BIT EXT MEM 196MAPBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 528MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT Number of I/O: 127 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 1M x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 20x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-LFBGA Supplier Device Package: 196-MAPBGA (10x10)	封裝: -	庫存2,880
FS32R294JAK0MJDR	NXP	S32R29 MULTICORE POWER ARCHITECT Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 269-LFBGA Supplier Device Package: 269-LFBGA (14x14)	封裝: -	Request a Quote
MGD3162AM550EKT	NXP	GATE DRIVER Driven Configuration: - Channel Type: - Number of Drivers: - Gate Type: - Voltage - Supply: - Logic Voltage - VIL, VIH: - Current - Peak Output (Source, Sink): - Input Type: - High Side Voltage - Max (Bootstrap): - Rise / Fall Time (Typ): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
SAF7770EL-101S120K	NXP	SOFTWARE DEFINED RADIO Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	封裝: -	Request a Quote
SAF7770EL-101Z130K	NXP	SAF7770EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	封裝: -	Request a Quote

PHX14NQ20T,127

NXP

MOSFET N-CH 200V 7.6A TO220F

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 200V
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 38nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1500pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 30W (Tc)
Rds On (Max) @ Id, Vgs: 230 mOhm @ 7A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220-3
Package / Case: TO-220-3 Full Pack, Isolated Tab

封裝: TO-220-3 Full Pack, Isolated Tab

庫存4,144

MRFE6VP8600HR5

NXP

FET RF 2CH 130V 860MHZ NI-1230

Transistor Type: LDMOS (Dual)
Frequency: 860MHz
Gain: 19.3dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 125W
Voltage - Rated: 130V
Package / Case: NI-1230
Supplier Device Package: NI-1230

封裝: NI-1230

庫存5,616

LD6806F/16H,115

NXP

IC REG LINEAR 1.6V 200MA 6-XSON

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.6V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

封裝: 6-XFDFN

庫存2,496

SSTUB32868ET/S,518

NXP

IC REG BUFFER CONFIG 176TFBGA

Logic Type: 1:2 Configurable Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 2 V
Number of Bits: 28
Operating Temperature: 0°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 176-TFBGA
Supplier Device Package: 176-TFBGA (6x15)

封裝: 176-TFBGA

庫存2,336

74LV595D/AUJ

NXP

IC SHIFT REGISTER 8BIT 16SOIC

Logic Type: Shift Register
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 8
Function: Serial to Parallel, Serial
Voltage - Supply: 1 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存2,352

TDA9881HN/V5,118

NXP

IC IF-PLL DEMOD 32HVQFN

Type: Demodulator
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存7,200

SC18IS601IBS,157

NXP

IC I2C BUS INTERFACE 24-HVQFN

Protocol: I2C
Function: Controller
Interface: SPI
Standards: -
Voltage - Supply: 2.4 V ~ 3.6 V
Current - Supply: 11mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)

封裝: 24-VFQFN Exposed Pad

庫存4,720

P1010PSN5FFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA1

封裝: 425-FBGA

庫存4,400

KMPC8343ECZQAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

封裝: 620-BBGA Exposed Pad

庫存5,824

MCIMX6Y2DVM09AA

NXP

I.MX 6ULL 900 MHZ CONSUMER W/O E

Core Processor: ARM? Cortex?-A7
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 900MHz
Co-Processors/DSP: Multimedia; NEON? MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Electrophoretic, LCD
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.8V, 3.3V
Operating Temperature: 0°C ~ 95°C (TJ)
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

封裝: 289-LFBGA

庫存3,040

S912ZVML64F2MKHR

NXP

IC MCU 16BIT 64KB FLASH 64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP EP (10x10)

封裝: 64-LQFP Exposed Pad

庫存7,472

SVF511R3K1CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 364-LFBGA
Supplier Device Package: 364-MAPBGA (17x17)

封裝: 364-LFBGA

庫存2,960

MC9RS08LA8CFT

NXP

IC MCU 8BIT 8KB FLASH 48QFN

Core Processor: RS08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存2,720

MKV30F128VLF10P

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Number of I/O: 35
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 24x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,296

LPC2367FBD100,551

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 58K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 6x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存16,224

BZA956AVL,115

NXP

TVS DIODE 5.6VWM SOT665

Type: Zener
Unidirectional Channels: 4
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 5.6V
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: 6W
Power Line Protection: No
Applications: General Purpose
Capacitance @ Frequency: 22pF @ 1MHz
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: SOT-665
Supplier Device Package: SOT-665

封裝: SOT-665

庫存2,340

SA58643DP,118

NXP

IC RF SWITCH SPDT 8-TSSOP

Frequency - Lower: DC
Frequency - Upper: 1GHz
Isolation @ Frequency: 30dB @ 900MHz (typ)
Insertion Loss @ Frequency: 2dB @ 900Mhz
IIP3: 33dBm (typ)
Topology: Absorptive
Circuit: SPDT
P1dB: 18dBm (typ) OP1dB
Features: Single Line Control
Impedance: 50 Ohm
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3 V ~ 5.5 V
RF Type: 802.11a/b/g/WiFi, WLAN
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

庫存7,470

MC32PF1510A7EP

NXP

PF1510

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

封裝: 40-VFQFN Exposed Pad

庫存7,840

TDA8034HN/C2QL

NXP

LOW POWER SMART CARD INTERFACE

Applications: -
Interface: Analog
Voltage - Supply: 1.8V, 3V, 5V
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (4x4)
Mounting Type: Surface Mount

封裝: 24-VFQFN Exposed Pad

庫存2,432

LPC54618J512BD208E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number of I/O: 171
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

封裝: 208-LQFP

庫存4,048

S9S12P32J0VLH

NXP

16-BIT MCU S12 CORE 32KB FLASH

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 49
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存2,864

S912ZVL12F0MLFR

NXP

S12Z CPU 128K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,680

MKE15Z64VLF4

NXP

IC MCU 5V CM0+ TOUCH 48LQFP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x12b; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,360

MIMXRT106SCVL5B

NXP

IC MCU 32BIT EXT MEM 196MAPBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 528MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Number of I/O: 127
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 20x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-LFBGA
Supplier Device Package: 196-MAPBGA (10x10)

封裝: -

庫存2,880

FS32R294JAK0MJDR

NXP

S32R29 MULTICORE POWER ARCHITECT

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 269-LFBGA
Supplier Device Package: 269-LFBGA (14x14)

封裝: -

Request a Quote

MGD3162AM550EKT

NXP

GATE DRIVER

Driven Configuration: -
Channel Type: -
Number of Drivers: -
Gate Type: -
Voltage - Supply: -
Logic Voltage - VIL, VIH: -
Current - Peak Output (Source, Sink): -
Input Type: -
High Side Voltage - Max (Bootstrap): -
Rise / Fall Time (Typ): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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SAF7770EL-101S120K

NXP

SOFTWARE DEFINED RADIO

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

封裝: -

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SAF7770EL-101Z130K

NXP

SAF7770EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

封裝: -

Request a Quote