頁 830 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF7S27130HSR5	NXP	FET RF 65V 2.7GHZ NI-780S Transistor Type: LDMOS Frequency: 2.7GHz Gain: 16.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 23W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	封裝: NI-780S	庫存7,152
BB145B,115	NXP	DIODE VAR CAP 6V SOD-523 Capacitance @ Vr, F: 2.95pF @ 4V, 1MHz Capacitance Ratio: 2.2 Capacitance Ratio Condition: C1/C4 Voltage - Peak Reverse (Max): 6V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封裝: SC-79, SOD-523	庫存22,104
TDA3681ATH/N1C,512	NXP	IC VOLT REG W/SW & IGNIT 20-HSOP Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	庫存2,256
MCZ33742EG	NXP	IC SYSTEM BASIS CHIP CAN 28-SOIC Applications: Automotive Current - Supply: 42mA Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存21,444
TEA1713T/N1,518	NXP	IC CTLR RESONANT PFC 24SOIC Mode: Discontinuous Conduction (DCM) Frequency - Switching: 125kHz Current - Startup: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存2,400
TEA1750T/N1,518	NXP	IC PFC CONTROLLER DCM16SOIC Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: 650V Topology: Flyback Voltage - Start Up: 22V Voltage - Supply (Vcc/Vdd): 15 V ~ 38 V Duty Cycle: - Frequency - Switching: 125kHz Power (Watts): 250W Fault Protection: Current Limiting, Over Temperature, Over Voltage Control Features: - Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO Mounting Type: Surface Mount	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存3,328
74HC670D,652	NXP	IC 4X4 REGISTER FILE 3ST 16SOIC Logic Type: Register File Output Type: Tri-State Number of Elements: 1 Number of Bits per Element: 4 Function: Universal Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: 16-SOIC (0.154", 3.90mm Width)	庫存7,424
74HCT163N,652	NXP	IC SYNC 4BIT BINARY COUNT 16-DIP Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 4 Reset: Synchronous Timing: Synchronous Count Rate: 45MHz Trigger Type: Positive Edge Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存3,760
TDA18250BHN/C1K	NXP	IC TUNER CABLE/STB 32HVQFN Type: Tuner Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存269,106
TDA8566TH1/N2S,118	NXP	IC AMP AUDIO BTL CAR 55W 24HSOP Type: Class B Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 24-HSOP Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	封裝: 24-BSOP (0.433", 11.00mm Width) Exposed Pad	庫存3,296
UJA1069TW24/3V3:51	NXP	IC LIN FAIL-SAFE 24-HTSSOP Applications: Automotive Interface: LIN (Local Interconnect Network) Voltage - Supply: 3.3V Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad Supplier Device Package: 24-HTSSOP Mounting Type: Surface Mount	封裝: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad	庫存4,784
MPC8535BVTANG	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存2,608
KMPC8270CVRMIBA	NXP	IC MPU MPC82XX 266MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存2,800
MCIMX6U7CVM08AB	NXP	IC MPU I.MX6DL 800MHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	封裝: 624-LFBGA	庫存6,800
MCIMX353DJQ5C	NXP	IC MPU I.MX35 532MHZ 400MAPBGA Core Processor: ARM1136JF-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 532MHz Co-Processors/DSP: Multimedia; GPU, IPU, VFP RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, KPP, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Secure Fusebox, Secure JTAG, Tamper Detection Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	封裝: 400-LFBGA	庫存28,728
MCHC908QY1MDWE	NXP	IC MCU 8BIT 1.5KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存6,480
MC68HC908QY1CP	NXP	IC MCU 8BIT 1.5KB FLASH 16DIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存7,168
LPC1768FET100,551	NXP	IC MCU 32BIT 512KB FLASH 100BGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-TFBGA Supplier Device Package: 100-TFBGA (9x9)	封裝: 100-TFBGA	庫存16,506
KMC8113TMP4800V	NXP	IC DSP 300/400MHZ 431FCBGA Type: SC140 Core Interface: Ethernet, I2C, TDM, UART Clock Rate: 400MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	封裝: 431-BFBGA, FCBGA	庫存7,104
TDA8763AM/3/C5,118	NXP	IC ADC 10BIT HS 28SSOP Number of Bits: 10 Sampling Rate (Per Second): 30M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: Sigma-Delta Reference Type: External Voltage - Supply, Analog: 5V Voltage - Supply, Digital: 5V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP Mounting Type: -	封裝: 28-SSOP (0.209", 5.30mm Width)	庫存3,088
IP4357CX17,135	NXP	IC ESD PROTECT HS MMC 17CSP Type: - Unidirectional Channels: - Bidirectional Channels: - Voltage - Reverse Standoff (Typ): - Voltage - Breakdown (Min): - Voltage - Clamping (Max) @ Ipp: - Current - Peak Pulse (10/1000µs): - Power - Peak Pulse: - Power Line Protection: - Applications: - Capacitance @ Frequency: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存8,946
MFRC63102HN,551	NXP	IC CONTACTLESS READER 32HVQFN Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: I2C, SPI, UART Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: -25°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存4,698
TDA9899HL/V2,118	NXP	IC IF PROCESSOR MULTISTD 48-LQFP Function: IF Processor Frequency: - RF Type: ATV, DVB, FM Secondary Attributes: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存6,084
MC33FS4505KAE	NXP	SYSTEM BASIS CHIP, LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
SAF7772EL-200Z100K	NXP	SAF7772EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	封裝: -	Request a Quote
MVR5510AMBA4ESR2	NXP	IC PMIC VR5510 ASIL-B Applications: - Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: -	Request a Quote
SAF4000EL-103Q23AK	NXP	IC Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MCIMX7U5DVK08SC	NXP	IC Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

MRF7S27130HSR5

NXP

FET RF 65V 2.7GHZ NI-780S

Transistor Type: LDMOS
Frequency: 2.7GHz
Gain: 16.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 23W
Voltage - Rated: 65V
Package / Case: NI-780S
Supplier Device Package: NI-780S

封裝: NI-780S

庫存7,152

BB145B,115

NXP

DIODE VAR CAP 6V SOD-523

Capacitance @ Vr, F: 2.95pF @ 4V, 1MHz
Capacitance Ratio: 2.2
Capacitance Ratio Condition: C1/C4
Voltage - Peak Reverse (Max): 6V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封裝: SC-79, SOD-523

庫存22,104

TDA3681ATH/N1C,512

NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

Applications: Ignition Buffer, Regulator
Current - Supply: 110µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

庫存2,256

MCZ33742EG

NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

Applications: Automotive
Current - Supply: 42mA
Voltage - Supply: 5.5 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存21,444

TEA1713T/N1,518

NXP

IC CTLR RESONANT PFC 24SOIC

Mode: Discontinuous Conduction (DCM)
Frequency - Switching: 125kHz
Current - Startup: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存2,400

TEA1750T/N1,518

NXP

IC PFC CONTROLLER DCM16SOIC

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: 650V
Topology: Flyback
Voltage - Start Up: 22V
Voltage - Supply (Vcc/Vdd): 15 V ~ 38 V
Duty Cycle: -
Frequency - Switching: 125kHz
Power (Watts): 250W
Fault Protection: Current Limiting, Over Temperature, Over Voltage
Control Features: -
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO
Mounting Type: Surface Mount

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存3,328

74HC670D,652

NXP

IC 4X4 REGISTER FILE 3ST 16SOIC

Logic Type: Register File
Output Type: Tri-State
Number of Elements: 1
Number of Bits per Element: 4
Function: Universal
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: 16-SOIC (0.154", 3.90mm Width)

庫存7,424

74HCT163N,652

NXP

IC SYNC 4BIT BINARY COUNT 16-DIP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 4
Reset: Synchronous
Timing: Synchronous
Count Rate: 45MHz
Trigger Type: Positive Edge
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存3,760

TDA18250BHN/C1K

NXP

IC TUNER CABLE/STB 32HVQFN

Type: Tuner
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存269,106

TDA8566TH1/N2S,118

NXP

IC AMP AUDIO BTL CAR 55W 24HSOP

Type: Class B
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 55W x 2 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 24-HSOP
Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

封裝: 24-BSOP (0.433", 11.00mm Width) Exposed Pad

庫存3,296

UJA1069TW24/3V3:51

NXP

IC LIN FAIL-SAFE 24-HTSSOP

Applications: Automotive
Interface: LIN (Local Interconnect Network)
Voltage - Supply: 3.3V
Package / Case: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad
Supplier Device Package: 24-HTSSOP
Mounting Type: Surface Mount

封裝: 24-TSSOP (0.173", 4.40mm Width) Exposed Pad

庫存4,784

MPC8535BVTANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存2,608

KMPC8270CVRMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存2,800

MCIMX6U7CVM08AB

NXP

IC MPU I.MX6DL 800MHZ 624MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

封裝: 624-LFBGA

庫存6,800

MCIMX353DJQ5C

NXP

IC MPU I.MX35 532MHZ 400MAPBGA

Core Processor: ARM1136JF-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 532MHz
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Operating Temperature: -20°C ~ 70°C (TA)
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

封裝: 400-LFBGA

庫存28,728

MCHC908QY1MDWE

NXP

IC MCU 8BIT 1.5KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存6,480

MC68HC908QY1CP

NXP

IC MCU 8BIT 1.5KB FLASH 16DIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存7,168

LPC1768FET100,551

NXP

IC MCU 32BIT 512KB FLASH 100BGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x12b, D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-TFBGA
Supplier Device Package: 100-TFBGA (9x9)

封裝: 100-TFBGA

庫存16,506

KMC8113TMP4800V

NXP

IC DSP 300/400MHZ 431FCBGA

Type: SC140 Core
Interface: Ethernet, I2C, TDM, UART
Clock Rate: 400MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

封裝: 431-BFBGA, FCBGA

庫存7,104

TDA8763AM/3/C5,118

NXP

IC ADC 10BIT HS 28SSOP

Number of Bits: 10
Sampling Rate (Per Second): 30M
Number of Inputs: 1
Input Type: Single Ended
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: Sigma-Delta
Reference Type: External
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP
Mounting Type: -

封裝: 28-SSOP (0.209", 5.30mm Width)

庫存3,088

IP4357CX17,135

NXP

IC ESD PROTECT HS MMC 17CSP

Type: -
Unidirectional Channels: -
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): -
Voltage - Breakdown (Min): -
Voltage - Clamping (Max) @ Ipp: -
Current - Peak Pulse (10/1000µs): -
Power - Peak Pulse: -
Power Line Protection: -
Applications: -
Capacitance @ Frequency: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存8,946

MFRC63102HN,551

NXP

IC CONTACTLESS READER 32HVQFN

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: I2C, SPI, UART
Voltage - Supply: 3 V ~ 5.5 V
Operating Temperature: -25°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存4,698

TDA9899HL/V2,118

NXP

IC IF PROCESSOR MULTISTD 48-LQFP

Function: IF Processor
Frequency: -
RF Type: ATV, DVB, FM
Secondary Attributes: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存6,084

MC33FS4505KAE

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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SAF7772EL-200Z100K

NXP

SAF7772EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

封裝: -

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MVR5510AMBA4ESR2

NXP

IC PMIC VR5510 ASIL-B

Applications: -
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: -

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SAF4000EL-103Q23AK

NXP

IC

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MCIMX7U5DVK08SC

NXP

IC

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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