NXP 產品

PMBFJ620,115

NXP

JFET 2N-CH 25V 0.19W 6TSSOP

• FET Type: 2 N-Channel (Dual)
• Voltage - Breakdown (V(BR)GSS): 25V
• Drain to Source Voltage (Vdss): 25V
• Current - Drain (Idss) @ Vds (Vgs=0): 24mA @ 10V
• Current Drain (Id) - Max: -
• Voltage - Cutoff (VGS off) @ Id: 2V @ 1µA
• Input Capacitance (Ciss) (Max) @ Vds: 5pF @ 10V
• Resistance - RDS(On): 50 Ohm
• Power - Max: 190mW
• Operating Temperature: 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 6-TSSOP, SC-88, SOT-363
• Supplier Device Package: 6-TSSOP

封裝: 6-TSSOP, SC-88, SOT-363

MRF6S21050LSR5

NXP

FET RF 68V 2.16GHZ NI-400S

• Transistor Type: LDMOS
• Frequency: 2.16GHz
• Gain: 16dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 11.5W
• Voltage - Rated: 68V
• Package / Case: NI-400S
• Supplier Device Package: NI-400S

封裝: NI-400S

BZX84-C2V7/LF1R

NXP

DIODE ZENER TO-236AB SOT23

• Voltage - Zener (Nom) (Vz): 2.7V
• Tolerance: ±5%
• Power - Max: 250mW
• Impedance (Max) (Zzt): 100 Ohms
• Current - Reverse Leakage @ Vr: 20µA @ 1V
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

MC10XS3412CPNA

NXP

IC SWITCH HIGH SIDE QUAD 24-QFN

• Switch Type: General Purpose
• Number of Outputs: 4
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 6 V ~ 20 V
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Current - Output (Max): -
• Rds On (Typ): 10 mOhm, 12 mOhm
• Input Type: -
• Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
• Operating Temperature: -40°C ~ 150°C (TJ)
• Package / Case: 24-PowerQFN
• Supplier Device Package: 24-PQFN (12x12)

封裝: 24-PowerQFN

74HC640N,652

NXP

IC TRANSCEIVER 3ST 8BIT 20DIP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Supplier Device Package: 20-DIP

封裝: 20-DIP (0.300", 7.62mm)

TDA9983BHW/15/C1:5

NXP

IC HDMI TX 150MHZ 80-HTQFP

• Type: Transmitter
• Applications: Recorders, Set-Top Boxes
• Mounting Type: Surface Mount
• Package / Case: 80-TQFP Exposed Pad
• Supplier Device Package: 80-HTQFP (12x12)

封裝: 80-TQFP Exposed Pad

TDA19988BET/C1,157

NXP

IC HDMI TRANSMITTER 64-TFBGA

• Type: HDMI Transmitter
• Applications: Mobile Phones, Cellular, Video Displays
• Mounting Type: Surface Mount
• Package / Case: 64-TFBGA
• Supplier Device Package: 64-TFBGA (4.5x4.5)

封裝: 64-TFBGA

74LVC1284DB,118

NXP

IC PRINTR INTFC TXRX/BUFF 20SSOP

• Type: Transceiver
• Protocol: IEEE 1284
• Number of Drivers/Receivers: 4/4
• Duplex: Full
• Receiver Hysteresis: 400mV
• Data Rate: -
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

封裝: 20-SSOP (0.209", 5.30mm Width)

P1020PSE2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Security; SEC 3.3
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (3)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 125°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 689-BBGA Exposed Pad
• Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

MPC860TVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

PCF51JF128VLH

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM
• Number of I/O: 48
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 17x12b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

MC68F375MZP33R2

NXP

IC MCU 32BIT 256KB FLASH 217BGA

• Core Processor: CPU32
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: CAN, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 48
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 10K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 217-BBGA
• Supplier Device Package: 217-PBGA (23x23)

封裝: 217-BBGA

PXAG49KBA/00,512

NXP

IC MCU 16BIT 64KB FLASH 44PLCC

• Core Processor: XA
• Core Size: 16-Bit
• Speed: 30MHz
• Connectivity: UART/USART
• Peripherals: PWM, WDT
• Number of I/O: 32
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

SPC5668EK0VMG

NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

• Core Processor: e200z650
• Core Size: 32-Bit
• Speed: 116MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 155
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
• Data Converters: A/D 64x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

封裝: 208-BGA

MC9S12DT512CPVE

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 14K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

SPC5602BK0CLQ4R

NXP

IC MCU 32BIT 256KB FLASH 144LQFP

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: CAN, I2C, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 123
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 16
• RAM Size: 24K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (15x15)

封裝: 144-LQFP

MC908QB8CDWER

NXP

IC MCU 8BIT 8KB FLASH 16SOIC

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

MPXM2202D

NXP

SENS PRESSURE 29 PSI MAX MPAK

• Pressure Type: Differential
• Operating Pressure: 29.01 PSI (200 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -
• Voltage - Supply: 10 V ~ 16 V
• Port Size: -
• Port Style: No Port
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 5-SMD Module
• Supplier Device Package: 5-MPAK

封裝: 5-SMD Module

MMA2201KEG

NXP

ACCELEROMETER 40G ANALOG 16SOIC

• Type: Analog
• Axis: X
• Acceleration Range: ±40g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 50
• Bandwidth: 400Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

NT2H0301G0DUD,005

NXP

IC SMART TAG NFC TYPE 2 UNCASED

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Wafer

封裝: Die

SA676DK/01,112

NXP

IC MIXER 100MHZ UP CONVRT 20SSOP

• RF Type: Cordless Phones
• Frequency: 100MHz
• Number of Mixers: 2
• Gain: 17dB
• Noise Figure: 7dB
• Secondary Attributes: Up Converter
• Current - Supply: 5mA
• Voltage - Supply: 2.7 V ~ 7 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

封裝: 20-LSSOP (0.173", 4.40mm Width)

SA616DK/01,118

NXP

IC MIXR 150MHZ RSSI EQUIP 20SSOP

• RF Type: Cellular, ASK, FSK
• Frequency: 150MHz
• Number of Mixers: 2
• Gain: 17dB
• Noise Figure: 6.8dB
• Secondary Attributes: RSSI Equipped
• Current - Supply: 3.5mA
• Voltage - Supply: 2.7 V ~ 7 V
• Package / Case: 20-LSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-SSOP

封裝: 20-LSSOP (0.173", 4.40mm Width)

SPC5607BAVLU6

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0h
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 149
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 29x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

S9S12XS256J0VAA

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

S912ZVC19F0VKH

NXP

MAGNIV 16-BIT MCU S12Z CORE 19

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CANbus, I²C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 192KB (192K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 16x10b, D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP Exposed Pad

MCIMX7U3DVK07SC

NXP

IC I.MX 7ULP VFBGA 361

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 720MHz
• Co-Processors/DSP: ARM® Cortex®-M4
• RAM Controllers: LPDDR2, LPDDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-DSI
• Ethernet: -
• SATA: -
• USB: USB 2.0 (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C
• Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
• Package / Case: -
• Supplier Device Package: -

封裝: -

LPC54S018J4MET180E

NXP

IC MCU CORTEX M4 BGA183

• Core Processor: ARM® Cortex®-M4
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number of I/O: 137
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 360K x 8
• Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 180-TFBGA
• Supplier Device Package: 180-TFBGA (12x12)

封裝: 180-TFBGA

MFS2613AMDA6AD

NXP

SAFETY SYSTEM BASIS CHIP WITH LO

• Applications: -
• Current - Supply: -
• Voltage - Supply: 3.2V ~ 40V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP-EP (7x7)

封裝: -

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