頁 773 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BFU520XAR	NXP	TRANS RF NPN 12V 30MA SOT-143B Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 10.5GHz Noise Figure (dB Typ @ f): 0.7dB @ 900MHz Gain: 20dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Current - Collector (Ic) (Max): 30mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	封裝: TO-253-4, TO-253AA	庫存6,480
PRLL5817,115	NXP	DIODE SCHOTTKY 20V 1A MELF Diode Type: Schottky Voltage - DC Reverse (Vr) (Max): 20V Current - Average Rectified (Io): 1A Voltage - Forward (Vf) (Max) @ If: 450mV @ 1A Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: 1mA @ 20V Capacitance @ Vr, F: 70pF @ 4V, 1MHz Mounting Type: Surface Mount Package / Case: SOD-87 Supplier Device Package: MELF Operating Temperature - Junction: 125°C (Max)	封裝: SOD-87	庫存2,624
LD6836TD/33H,125	NXP	IC REG LINEAR 3.3V 300MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 3.3V Voltage - Output (Max): - Voltage Dropout (Max): 0.2V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	封裝: SC-74A, SOT-753	庫存5,232
TDA3664TT/N1,118	NXP	IC REG LINEAR 5V 100MA 8TSSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 45V Voltage - Output (Min/Fixed): 5V Voltage - Output (Max): - Voltage Dropout (Max): 0.3V @ 50mA Current - Output: 100mA Current - Quiescent (Iq): - Current - Supply (Max): 30µA ~ 2.5mA PSRR: 60dB (120Hz) Control Features: - Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	庫存7,920
MCZ33999EK	NXP	IC SW 16OUTPT PWM & SPI 54-SOIC Switch Type: General Purpose Number of Outputs: 16 Ratio - Input:Output: 1:16 Output Configuration: Low Side Output Type: N-Channel Interface: SPI Voltage - Load: 5 V ~ 27 V Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V Current - Output (Max): 900mA Rds On (Typ): 550 mOhm Input Type: - Features: PWM Input Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存4,464
GTL1655DGG,518	NXP	IC TXRX BUS 16BIT 3-3.6V TSSOP64 Translator Type: Mixed Signal Channel Type: Bidirectional Number of Circuits: 2 Channels per Circuit: 8 Voltage - VCCA: - Voltage - VCCB: - Input Signal: LVTTL Output Signal: GTL Output Type: Tri-State, Non-Inverted Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 64-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 64-TSSOP	封裝: 64-TFSOP (0.240", 6.10mm Width)	庫存6,416
N74F573D,602	NXP	IC DTYPE LATCH OCTAL 20SOIC Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 3.5ns Current - Output High, Low: 3mA, 24mA Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存4,384
MC33972ATEWR2	NXP	IC SWITCH DETECT SPI 32-SOIC Applications: Switch Monitoring Interface: SPI Serial Voltage - Supply: 3.1 V ~ 5.25 V Package / Case: 32-BSSOP Exposed Pad Supplier Device Package: 32-SOIC Mounting Type: Surface Mount	封裝: 32-BSSOP Exposed Pad	庫存96,000
PCA9675PW,118	NXP	IC I/O EXPANDER I2C 16B 24TSSOP Number of I/O: 16 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	封裝: 24-TSSOP (0.173", 4.40mm Width)	庫存6,496
PTN3331DH,112	NXP	IC DIFF LINE DRVR HI-SPD 16TSSOP Type: Driver Protocol: LVDS Number of Drivers/Receivers: 4/0 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存5,984
MPC8545PXANGD	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存2,288
MPC8360CVVAJDG	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存5,280
MPC866TVR133A	NXP	IC MPU MPC8XX 133MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存6,880
MPC8308VMAGDA	NXP	IC MPU MPC83XX 400MHZ 473MAPBGA Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 473-LFBGA Supplier Device Package: 473-MAPBGA (19x19)	封裝: 473-LFBGA	庫存16,476
MC9S08DV48AMLC	NXP	IC MCU 8BIT 48KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存5,376
MC908AS32ACFNER	NXP	IC MCU 8BIT 32KB FLASH 52PLCC Core Processor: HC08 Core Size: 8-Bit Speed: 8.4MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	封裝: 52-LCC (J-Lead)	庫存3,040
MK20DX64VMC7	NXP	IC MCU 32BIT 64KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 35x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	封裝: 121-LFBGA	庫存5,680
MC9S12XEQ512CAL	NXP	IC MCU 16BIT 512KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存3,520
MMA5112NPIKWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,196
SL3S1203FUD/BG,003	NXP	IC U-CODE G2IL DIE WAFER Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: EPC Interface: - Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Wafer	封裝: Die	庫存8,640
MC33493ADTBE	NXP	IC RF TRANSMITTER UHF 14-TSSOP Frequency: 315 ~ 434MHz, 868 ~ 928MHz Applications: General Data Transfer Modulation or Protocol: FSK, OOK Data Rate (Max): 10 kbps Power - Output: -3dBm Current - Transmitting: 11.6mA Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: - Features: - Voltage - Supply: 1.9 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 14-TSSOP (0.173", 4.40mm Width)	封裝: 14-TSSOP (0.173", 4.40mm Width)	庫存5,454
MWCT1011AVLH	NXP	15W MULTI-COIL AUTO STANDARD Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,312
SPC5743PFK1AMLQ9	NXP	32-BIT MCU DUAL CORE POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,416
FS32K142HRT0VLHR	NXP	S32K142 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存5,664
S9S12GN16BCLCR	NXP	16-BIT16K FLASH2K RAM Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存4,352
S32K314NHT1MMMST	NXP	S32K344 PHANTOM, 257MAPBGA, PROD Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 160MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Number of I/O: 218 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 257-LFBGA Supplier Device Package: 257-LFBGA (14x14)	封裝: -	Request a Quote
LPC5516JBD100K	NXP	IC MCU 32BIT 256KB FLSH 100LQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	封裝: -	Request a Quote
S32K311NHT0MLFST	NXP	S32K311, CES, 48 LQFP Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 112K x 8 Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Data Converters: A/D 24x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: -	Request a Quote

BFU520XAR

NXP

TRANS RF NPN 12V 30MA SOT-143B

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.7dB @ 900MHz
Gain: 20dB
Power - Max: 450mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Current - Collector (Ic) (Max): 30mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

封裝: TO-253-4, TO-253AA

庫存6,480

PRLL5817,115

NXP

DIODE SCHOTTKY 20V 1A MELF

Diode Type: Schottky
Voltage - DC Reverse (Vr) (Max): 20V
Current - Average Rectified (Io): 1A
Voltage - Forward (Vf) (Max) @ If: 450mV @ 1A
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: 1mA @ 20V
Capacitance @ Vr, F: 70pF @ 4V, 1MHz
Mounting Type: Surface Mount
Package / Case: SOD-87
Supplier Device Package: MELF
Operating Temperature - Junction: 125°C (Max)

封裝: SOD-87

庫存2,624

LD6836TD/33H,125

NXP

IC REG LINEAR 3.3V 300MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 3.3V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.2V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

封裝: SC-74A, SOT-753

庫存5,232

TDA3664TT/N1,118

NXP

IC REG LINEAR 5V 100MA 8TSSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 45V
Voltage - Output (Min/Fixed): 5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.3V @ 50mA
Current - Output: 100mA
Current - Quiescent (Iq): -
Current - Supply (Max): 30µA ~ 2.5mA
PSRR: 60dB (120Hz)
Control Features: -
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

庫存7,920

MCZ33999EK

NXP

IC SW 16OUTPT PWM & SPI 54-SOIC

Switch Type: General Purpose
Number of Outputs: 16
Ratio - Input:Output: 1:16
Output Configuration: Low Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 5 V ~ 27 V
Voltage - Supply (Vcc/Vdd): 3.1 V ~ 5.5 V
Current - Output (Max): 900mA
Rds On (Typ): 550 mOhm
Input Type: -
Features: PWM Input
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存4,464

GTL1655DGG,518

NXP

IC TXRX BUS 16BIT 3-3.6V TSSOP64

Translator Type: Mixed Signal
Channel Type: Bidirectional
Number of Circuits: 2
Channels per Circuit: 8
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: LVTTL
Output Signal: GTL
Output Type: Tri-State, Non-Inverted
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 64-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 64-TSSOP

封裝: 64-TFSOP (0.240", 6.10mm Width)

庫存6,416

N74F573D,602

NXP

IC DTYPE LATCH OCTAL 20SOIC

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 3.5ns
Current - Output High, Low: 3mA, 24mA
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存4,384

MC33972ATEWR2

NXP

IC SWITCH DETECT SPI 32-SOIC

Applications: Switch Monitoring
Interface: SPI Serial
Voltage - Supply: 3.1 V ~ 5.25 V
Package / Case: 32-BSSOP Exposed Pad
Supplier Device Package: 32-SOIC
Mounting Type: Surface Mount

封裝: 32-BSSOP Exposed Pad

庫存96,000

PCA9675PW,118

NXP

IC I/O EXPANDER I2C 16B 24TSSOP

Number of I/O: 16
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

封裝: 24-TSSOP (0.173", 4.40mm Width)

庫存6,496

PTN3331DH,112

NXP

IC DIFF LINE DRVR HI-SPD 16TSSOP

Type: Driver
Protocol: LVDS
Number of Drivers/Receivers: 4/0
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存5,984

MPC8545PXANGD

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存2,288

MPC8360CVVAJDG

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存5,280

MPC866TVR133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存6,880

MPC8308VMAGDA

NXP

IC MPU MPC83XX 400MHZ 473MAPBGA

Core Processor: PowerPC e300c3
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封裝: 473-LFBGA

庫存16,476

MC9S08DV48AMLC

NXP

IC MCU 8BIT 48KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存5,376

MC908AS32ACFNER

NXP

IC MCU 8BIT 32KB FLASH 52PLCC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8.4MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 15x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

封裝: 52-LCC (J-Lead)

庫存3,040

MK20DX64VMC7

NXP

IC MCU 32BIT 64KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 35x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封裝: 121-LFBGA

庫存5,680

MC9S12XEQ512CAL

NXP

IC MCU 16BIT 512KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存3,520

MMA5112NPIKWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,196

SL3S1203FUD/BG,003

NXP

IC U-CODE G2IL DIE WAFER

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: EPC
Interface: -
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Wafer

封裝: Die

庫存8,640

MC33493ADTBE

NXP

IC RF TRANSMITTER UHF 14-TSSOP

Frequency: 315 ~ 434MHz, 868 ~ 928MHz
Applications: General Data Transfer
Modulation or Protocol: FSK, OOK
Data Rate (Max): 10 kbps
Power - Output: -3dBm
Current - Transmitting: 11.6mA
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: -
Features: -
Voltage - Supply: 1.9 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

封裝: 14-TSSOP (0.173", 4.40mm Width)

庫存5,454

MWCT1011AVLH

NXP

15W MULTI-COIL AUTO STANDARD

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,312

SPC5743PFK1AMLQ9

NXP

32-BIT MCU DUAL CORE POWER ARCH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,416

FS32K142HRT0VLHR

NXP

S32K142 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存5,664

S9S12GN16BCLCR

NXP

16-BIT16K FLASH2K RAM

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存4,352

S32K314NHT1MMMST

NXP

S32K344 PHANTOM, 257MAPBGA, PROD

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Supplier Device Package: 257-LFBGA (14x14)

封裝: -

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LPC5516JBD100K

NXP

IC MCU 32BIT 256KB FLSH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封裝: -

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S32K311NHT0MLFST

NXP

S32K311, CES, 48 LQFP

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 112K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: A/D 24x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: -

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