頁 754 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BUK9E1R6-30E,127	NXP	MOSFET N-CH 30V 120A I2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 349W (Tc) Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I2PAK Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA	封裝: TO-262-3 Long Leads, I2Pak, TO-262AA	庫存3,248
PHB112N06T,118	NXP	MOSFET N-CH 55V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 10V Vgs(th) (Max) @ Id: 4V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 87nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 4352pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 200W (Tc) Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	庫存3,968
MRF5S9150HSR5	NXP	FET RF 68V 880MHZ NI-780S Transistor Type: LDMOS Frequency: 880MHz Gain: 19.7dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.5A Power - Output: 33W Voltage - Rated: 68V Package / Case: NI-780S Supplier Device Package: NI-780S	封裝: NI-780S	庫存7,632
PZM15NB3,115	NXP	DIODE ZENER 15V 300MW SMT3 Voltage - Zener (Nom) (Vz): 15V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 15 Ohms Current - Reverse Leakage @ Vr: 70nA @ 11V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存5,184
74LV138N,112	NXP	IC 3-8 LINE DECODER/DEMUX 16-DIP Type: Decoder/Demultiplexer Circuit: 1 x 3:8 Independent Circuits: 1 Current - Output High, Low: 12mA, 12mA Voltage Supply Source: Single Supply Voltage - Supply: 1 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存4,368
74LV32DB,112	NXP	IC GATE OR 4CH 2-INP 14-SSOP Logic Type: OR Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.3 V ~ 0.8 V Logic Level - High: 0.9 V ~ 2 V Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SSOP Package / Case: 14-SSOP (0.209", 5.30mm Width)	封裝: 14-SSOP (0.209", 5.30mm Width)	庫存4,736
PCA9557PW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: No Features: POR Output Type: Open Drain, Push-Pull Current - Output Source/Sink: 10mA, 20mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存52,056
KMPC8358VVAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存5,728
KMC7448VS1400NC	NXP	IC MPU MPC74XX 1.4GHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	封裝: 360-CLGA, FCCLGA	庫存3,008
MPC8260ACZUMIBB	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	封裝: 480-LBGA	庫存7,792
MPC8343CZQADDB	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	封裝: 620-BBGA Exposed Pad	庫存4,800
PCF51AC256BCFUE	NXP	IC MCU 32BIT 256KB FLASH 64QFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 20x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存2,064
MC68HC11E1VFNE3	NXP	IC MCU 8BIT ROMLESS 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	封裝: 52-LCC (J-Lead)	庫存4,704
MCF5212LCVM80	NXP	IC MCU 32BIT 256KB FLASH 81BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 80MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 81-LBGA Supplier Device Package: 81-MAPBGA (10x10)	封裝: 81-LBGA	庫存6,480
S912XET256J2CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存12,372
S9S12GA48F0MLF	NXP	IC MCU 16BIT 48KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存3,728
MC9S12E128MFUE	NXP	IC MCU 16BIT 128KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V Data Converters: A/D 16x10b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	封裝: 80-QFP	庫存9,396
NCF29A4VHN/0500IJ	NXP	IC REMOTE KEYLESS ENTRY 32HVQFN Type: - Frequency: - Standards: - Interface: - Voltage - Supply: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	庫存8,028
TEF6901AH/V3,557	NXP	IC INTEGRATED CAR RADIO 64-QFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM, WB Applications: AM/FM Radio Receiver Current - Receiving: 102mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C Package / Case: 64-BQFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-BQFP	庫存8,514
SP5747CHK0AVKU6R	NXP	DUAL CORE 4M FLASH 512K RAM F Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/160MHz Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 129 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP Exposed Pad	庫存6,048
S9S08RN60W1MLFR	NXP	8-BIT MCU S08 CORE 60KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I²C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,840
MC33PF8200CXES	NXP	IC POWER MANAGEMENT LS1043A Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	封裝: 56-VFQFN Exposed Pad	庫存3,504
MC33FS6507LAER2	NXP	SYSTEM BASIS CHIP, DCDC 0.8A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
TEF7006HN-V1-518	NXP	IC CONSUMER CIRC PQCC32 Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
MIMXRT1171DVMAAR	NXP	IC MCU 32BIT EXT MEM 289MAPBGA Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Speed: 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Number of I/O: 13 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 2M x 8 Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	封裝: -	Request a Quote
SAF4000EL-101S57BY	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S9S12G128J0VLH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
SAF7754HV-N208W-SY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

BUK9E1R6-30E,127

NXP

MOSFET N-CH 30V 120A I2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: I2PAK
Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

封裝: TO-262-3 Long Leads, I2Pak, TO-262AA

庫存3,248

PHB112N06T,118

NXP

MOSFET N-CH 55V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 87nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 4352pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 200W (Tc)
Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

庫存3,968

MRF5S9150HSR5

NXP

FET RF 68V 880MHZ NI-780S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 19.7dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.5A
Power - Output: 33W
Voltage - Rated: 68V
Package / Case: NI-780S
Supplier Device Package: NI-780S

封裝: NI-780S

庫存7,632

PZM15NB3,115

NXP

DIODE ZENER 15V 300MW SMT3

Voltage - Zener (Nom) (Vz): 15V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 15 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 11V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存5,184

74LV138N,112

NXP

IC 3-8 LINE DECODER/DEMUX 16-DIP

Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Independent Circuits: 1
Current - Output High, Low: 12mA, 12mA
Voltage Supply Source: Single Supply
Voltage - Supply: 1 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存4,368

74LV32DB,112

NXP

IC GATE OR 4CH 2-INP 14-SSOP

Logic Type: OR Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.3 V ~ 0.8 V
Logic Level - High: 0.9 V ~ 2 V
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SSOP
Package / Case: 14-SSOP (0.209", 5.30mm Width)

封裝: 14-SSOP (0.209", 5.30mm Width)

庫存4,736

PCA9557PW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: No
Features: POR
Output Type: Open Drain, Push-Pull
Current - Output Source/Sink: 10mA, 20mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存52,056

KMPC8358VVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存5,728

KMC7448VS1400NC

NXP

IC MPU MPC74XX 1.4GHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.4GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

封裝: 360-CLGA, FCCLGA

庫存3,008

MPC8260ACZUMIBB

NXP

IC MPU MPC82XX 266MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

封裝: 480-LBGA

庫存7,792

MPC8343CZQADDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

封裝: 620-BBGA Exposed Pad

庫存4,800

PCF51AC256BCFUE

NXP

IC MCU 32BIT 256KB FLASH 64QFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 20x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存2,064

MC68HC11E1VFNE3

NXP

IC MCU 8BIT ROMLESS 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

封裝: 52-LCC (J-Lead)

庫存4,704

MCF5212LCVM80

NXP

IC MCU 32BIT 256KB FLASH 81BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 80MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 81-LBGA
Supplier Device Package: 81-MAPBGA (10x10)

封裝: 81-LBGA

庫存6,480

S912XET256J2CAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存12,372

S9S12GA48F0MLF

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存3,728

MC9S12E128MFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 2.75 V
Data Converters: A/D 16x10b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

封裝: 80-QFP

庫存9,396

NCF29A4VHN/0500IJ

NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

Type: -
Frequency: -
Standards: -
Interface: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存8,028

TEF6901AH/V3,557

NXP

IC INTEGRATED CAR RADIO 64-QFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM, WB
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-BQFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-BQFP

庫存8,514

SP5747CHK0AVKU6R

NXP

DUAL CORE 4M FLASH 512K RAM F

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP Exposed Pad

庫存6,048

S9S08RN60W1MLFR

NXP

8-BIT MCU S08 CORE 60KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,840

MC33PF8200CXES

NXP

IC POWER MANAGEMENT LS1043A

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

封裝: 56-VFQFN Exposed Pad

庫存3,504

MC33FS6507LAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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TEF7006HN-V1-518

NXP

IC CONSUMER CIRC PQCC32

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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MIMXRT1171DVMAAR

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Single-Core
Speed: 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 13
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 2M x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters: A/D 20x12b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 95°C (TJ)
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Supplier Device Package: 289-LFBGA (14x14)

封裝: -

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SAF4000EL-101S57BY

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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S9S12G128J0VLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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SAF7754HV-N208W-SY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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