頁 746 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF1535FNT1	NXP	FET RF 40V 520MHZ TO272-6 Transistor Type: LDMOS Frequency: 520MHz Gain: 13.5dB Voltage - Test: 12.5V Current Rating: 6A Noise Figure: - Current - Test: 500mA Power - Output: 35W Voltage - Rated: 40V Package / Case: TO-272BA Supplier Device Package: TO-272-6	封裝: TO-272BA	庫存5,120
MRF1535NT1	NXP	FET RF 40V 520MHZ TO272-6 WRAP Transistor Type: LDMOS Frequency: 520MHz Gain: 13.5dB Voltage - Test: 12.5V Current Rating: 6A Noise Figure: - Current - Test: 500mA Power - Output: 35W Voltage - Rated: 40V Package / Case: TO-272AA Supplier Device Package: TO-272-6	封裝: TO-272AA	庫存20,616
BB184,135	NXP	DIODE UHF VAR CAP 13V SOD523 Capacitance @ Vr, F: 2.13pF @ 10V, 1MHz Capacitance Ratio: 7 Capacitance Ratio Condition: C1/C10 Voltage - Peak Reverse (Max): 13V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	封裝: SC-79, SOD-523	庫存3,488
LD6806CX4/25H,315	NXP	IC REG LINEAR 2.5V 200MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	封裝: 4-XFBGA, WLCSP	庫存7,008
TEA1892TS/1H	NXP	IC SECONDARY SIDE CTRLR 6TSOP Applications: Secondary-Side Controller, Synchronous Rectifier Voltage - Input: - Voltage - Supply: 8.5 V ~ 38 V Current - Supply: 1mA Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: SC-74, SOT-457 Supplier Device Package: 6-TSOP	封裝: SC-74, SOT-457	庫存2,848
74AVC16834ADGV,112	NXP	IC UNIV BUS DVR 18BIT 56TVSOP Logic Type: Universal Bus Driver Number of Circuits: 18-Bit Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.173", 4.40mm Width) Supplier Device Package: 56-TSSOP	封裝: 56-TFSOP (0.173", 4.40mm Width)	庫存3,952
HEF4043BP,652	NXP	IC R/S LATCH 3-STATE QUAD 16DIP Logic Type: S-R Latch Circuit: 1:1 Output Type: Tri-State Voltage - Supply: 3 V ~ 15 V Independent Circuits: 4 Delay Time - Propagation: 15ns Current - Output High, Low: 3mA, 3mA Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存2,064
BGE788,112	NXP	IC PUSH-PULL AMP 750MHZ SOT115J Applications: CATV Output Type: Push-Pull Number of Circuits: 1 -3db Bandwidth: - Slew Rate: - Current - Supply: 305mA Current - Output / Channel: - Voltage - Supply, Single/Dual (±): - Mounting Type: - Package / Case: SOT-115J Supplier Device Package: SOT115J	封裝: SOT-115J	庫存5,680
MPC8535AVTAKG	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 90°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,720
MPC8378EVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存5,248
KMPC8541VTAPF	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,864
P80C592FFA/00,518	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: CAN, EBI/EMI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: 48 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (24.23x24.23)	封裝: 68-LCC (J-Lead)	庫存6,384
XC68C812A4PVE5	NXP	IC MCU 16BIT 4KB EEPROM 112LQFP Core Processor: CPU12 Core Size: 16-Bit Speed: 5MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 83 Program Memory Size: 4KB (4K x 8) Program Memory Type: EEPROM EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存5,568
SPC5747CK1CMJ2R	NXP	IC MCU 32BIT 4MB FLASH 256MAPBGA Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Number of I/O: 178 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 80x10b, 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPPBGA (17x17)	封裝: 256-LBGA	庫存5,904
SPC5604CAMLH6	NXP	IC MCU 32BIT 512KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存6,928
S9S12P32J0MFT	NXP	IC MCU 16BIT 32KB FLASH 48QFN Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存4,016
MC9S08SH4CSC	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存5,648
MC908QT4ACDWER	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	封裝: 8-SOIC (0.209", 5.30mm Width)	庫存72,480
MC13850-2400EVK	NXP	IC PMU MC13850 EVB 2400MHZ Type: Amplifier Frequency: 2.4GHz For Use With/Related Products: MC13850 Supplied Contents: Board	封裝: -	庫存6,966
MC33FS4503NAER2	NXP	SYSTEM BASIS CHIP LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP Exposed Pad	庫存4,064
MCIMX6Q4AVT08AE	NXP	I.MX6Q ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封裝: 624-FBGA, FCBGA	庫存3,200
SPC5642AF2MLU3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z4 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 84 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP	庫存7,136
MK81FN256VDC15R	NXP	KINETIS K SERIES 32-BIT MCU ARM Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG Peripherals: DMA, I²S, LVD, POR, PWM Number of I/O: 85 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 17x16b, D/A 2x6b, 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-XFBGA Supplier Device Package: 121-MAPBGA (8x8)	封裝: 121-XFBGA	庫存2,240
S9S08AW16E7MFGE	NXP	9S08AW60 CU WIRE Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	封裝: 44-LQFP	庫存6,512
S912ZVL64F0MLFR	NXP	MAGNIV 16-BIT MCU S12Z CORE 64 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存4,448
MKE02Z32VLC2R	NXP	KINETIS KE02: 20MHZ CORTEX-M0+ 5 Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 20MHz Connectivity: I²C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存2,416
MC33FS8530A0ESR2	NXP	SYSTEM BASIS CHIP FS8500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
TEA18362T-2J	NXP	IC OFFLINE SWITCH FLYBACK 8SO Output Isolation: Isolated Internal Switch(s): No Voltage - Breakdown: - Topology: Flyback Voltage - Start Up: 14.9 V Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V Duty Cycle: - Frequency - Switching: 25kHz ~ 132.5kHz Power (Watts): 75 W Fault Protection: Over Power, Over Temperature, Over Voltage Control Features: - Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO Mounting Type: Surface Mount	封裝: -	Request a Quote

MRF1535FNT1

NXP

FET RF 40V 520MHZ TO272-6

Transistor Type: LDMOS
Frequency: 520MHz
Gain: 13.5dB
Voltage - Test: 12.5V
Current Rating: 6A
Noise Figure: -
Current - Test: 500mA
Power - Output: 35W
Voltage - Rated: 40V
Package / Case: TO-272BA
Supplier Device Package: TO-272-6

封裝: TO-272BA

庫存5,120

MRF1535NT1

NXP

FET RF 40V 520MHZ TO272-6 WRAP

Transistor Type: LDMOS
Frequency: 520MHz
Gain: 13.5dB
Voltage - Test: 12.5V
Current Rating: 6A
Noise Figure: -
Current - Test: 500mA
Power - Output: 35W
Voltage - Rated: 40V
Package / Case: TO-272AA
Supplier Device Package: TO-272-6

封裝: TO-272AA

庫存20,616

BB184,135

NXP

DIODE UHF VAR CAP 13V SOD523

Capacitance @ Vr, F: 2.13pF @ 10V, 1MHz
Capacitance Ratio: 7
Capacitance Ratio Condition: C1/C10
Voltage - Peak Reverse (Max): 13V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

封裝: SC-79, SOD-523

庫存3,488

LD6806CX4/25H,315

NXP

IC REG LINEAR 2.5V 200MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.1V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

封裝: 4-XFBGA, WLCSP

庫存7,008

TEA1892TS/1H

NXP

IC SECONDARY SIDE CTRLR 6TSOP

Applications: Secondary-Side Controller, Synchronous Rectifier
Voltage - Input: -
Voltage - Supply: 8.5 V ~ 38 V
Current - Supply: 1mA
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SC-74, SOT-457
Supplier Device Package: 6-TSOP

封裝: SC-74, SOT-457

庫存2,848

74AVC16834ADGV,112

NXP

IC UNIV BUS DVR 18BIT 56TVSOP

Logic Type: Universal Bus Driver
Number of Circuits: 18-Bit
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.173", 4.40mm Width)
Supplier Device Package: 56-TSSOP

封裝: 56-TFSOP (0.173", 4.40mm Width)

庫存3,952

HEF4043BP,652

NXP

IC R/S LATCH 3-STATE QUAD 16DIP

Logic Type: S-R Latch
Circuit: 1:1
Output Type: Tri-State
Voltage - Supply: 3 V ~ 15 V
Independent Circuits: 4
Delay Time - Propagation: 15ns
Current - Output High, Low: 3mA, 3mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存2,064

BGE788,112

NXP

IC PUSH-PULL AMP 750MHZ SOT115J

Applications: CATV
Output Type: Push-Pull
Number of Circuits: 1
-3db Bandwidth: -
Slew Rate: -
Current - Supply: 305mA
Current - Output / Channel: -
Voltage - Supply, Single/Dual (±): -
Mounting Type: -
Package / Case: SOT-115J
Supplier Device Package: SOT115J

封裝: SOT-115J

庫存5,680

MPC8535AVTAKG

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 90°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,720

MPC8378EVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存5,248

KMPC8541VTAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 833MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,864

P80C592FFA/00,518

NXP

IC MCU 8BIT ROMLESS 68PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: CAN, EBI/EMI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (24.23x24.23)

封裝: 68-LCC (J-Lead)

庫存6,384

XC68C812A4PVE5

NXP

IC MCU 16BIT 4KB EEPROM 112LQFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 5MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 83
Program Memory Size: 4KB (4K x 8)
Program Memory Type: EEPROM
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存5,568

SPC5747CK1CMJ2R

NXP

IC MCU 32BIT 4MB FLASH 256MAPBGA

Core Processor: e200z2, e200z4
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封裝: 256-LBGA

庫存5,904

SPC5604CAMLH6

NXP

IC MCU 32BIT 512KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存6,928

S9S12P32J0MFT

NXP

IC MCU 16BIT 32KB FLASH 48QFN

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存4,016

MC9S08SH4CSC

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存5,648

MC908QT4ACDWER

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.209", 5.30mm Width)

庫存72,480

MC13850-2400EVK

NXP

IC PMU MC13850 EVB 2400MHZ

Type: Amplifier
Frequency: 2.4GHz
For Use With/Related Products: MC13850
Supplied Contents: Board

封裝: -

庫存6,966

MC33FS4503NAER2

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP Exposed Pad

庫存4,064

MCIMX6Q4AVT08AE

NXP

I.MX6Q ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封裝: 624-FBGA, FCBGA

庫存3,200

SPC5642AF2MLU3

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z4
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 84
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP

庫存7,136

MK81FN256VDC15R

NXP

KINETIS K SERIES 32-BIT MCU ARM

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 150MHz
Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB OTG
Peripherals: DMA, I²S, LVD, POR, PWM
Number of I/O: 85
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 17x16b, D/A 2x6b, 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-XFBGA
Supplier Device Package: 121-MAPBGA (8x8)

封裝: 121-XFBGA

庫存2,240

S9S08AW16E7MFGE

NXP

9S08AW60 CU WIRE

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

封裝: 44-LQFP

庫存6,512

S912ZVL64F0MLFR

NXP

MAGNIV 16-BIT MCU S12Z CORE 64

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存4,448

MKE02Z32VLC2R

NXP

KINETIS KE02: 20MHZ CORTEX-M0+ 5

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 20MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存2,416

MC33FS8530A0ESR2

NXP

SYSTEM BASIS CHIP FS8500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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TEA18362T-2J

NXP

IC OFFLINE SWITCH FLYBACK 8SO

Output Isolation: Isolated
Internal Switch(s): No
Voltage - Breakdown: -
Topology: Flyback
Voltage - Start Up: 14.9 V
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Duty Cycle: -
Frequency - Switching: 25kHz ~ 132.5kHz
Power (Watts): 75 W
Fault Protection: Over Power, Over Temperature, Over Voltage
Control Features: -
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO
Mounting Type: Surface Mount

封裝: -

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