頁 726 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF8HP21130HR3	NXP	FET RF 2CH 65V 2.17GHZ NI780-4 Transistor Type: LDMOS (Dual) Frequency: 2.17GHz Gain: 14dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 360mA Power - Output: 28W Voltage - Rated: 65V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	封裝: NI-780-4	庫存5,264
MRF6V14300HR3	NXP	FET RF 100V 1.4GHZ NI780 Transistor Type: LDMOS Frequency: 1.4GHz Gain: 18dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 330W Voltage - Rated: 100V Package / Case: NI-780 Supplier Device Package: NI-780	封裝: NI-780	庫存2,320
MD7P19130HR5	NXP	FET RF 2CH 65V 1.99GHZ NI780H-4 Transistor Type: LDMOS (Dual) Frequency: 1.99GHz Gain: 20dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.25A Power - Output: 40W Voltage - Rated: 65V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	封裝: NI-780-4	庫存6,256
LD6806TD/22H,125	NXP	IC REG LINEAR 2.2V 200MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	封裝: SC-74A, SOT-753	庫存4,416
MCZ33812EK	NXP	IC DVR IGNITION/INJECTOR 32-SOIC Applications: Automotive Current - Supply: 10mA Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存3,584
74LVC541APW/AUJ	NXP	IC BUFFER/DVR 3-ST 8BIT 20TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存5,424
MC14467P1	NXP	IC SMOKE DETECTOR 16-DIP Type: Smoke Detector Input Type: Ionization Output Type: Voltage Interface: - Current - Supply: 12µA Operating Temperature: -10°C ~ 60°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-PDIP	封裝: 16-DIP (0.300", 7.62mm)	庫存669,816
TJA1054AT/S900M:51	NXP	IC CAN TXRX FAULT-TOL 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存2,992
MPC8547EVTATGD	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,000
P1010NXN5HFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封裝: 425-FBGA	庫存9,852
KMC8360CZUAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存7,664
KMPC8541EVTAQF	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,528
P4040NXE7MMC	NXP	IC MPU Q OR IQ 1.5GHZ 1295FCBGA Core Processor: PowerPC e500mc Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 10 Gbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存5,376
MC68HC11D0CFBE3	NXP	IC MCU 8BIT ROMLESS 44QFP Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	封裝: 44-QFP	庫存7,552
MC68332GCPV20	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,144
S9S08SG32E1VTLR	NXP	IC MCU 8BIT 32KB FLASH 28TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	封裝: 28-TSSOP (0.173", 4.40mm Width)	庫存50,520
TDA9955HL/17/C1,55	NXP	IC ADC 8BIT 170MSPS 100-LQFP Type: ADC, Video Number of Channels: - Resolution (Bits): 8 b Sampling Rate (Per Second): 170M Data Interface: Serial Voltage Supply Source: Analog and Digital Voltage - Supply: 1.75 V ~ 1.85 V, 3.15 V ~ 3.45 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存7,680
MW6IC2015GNBR1	NXP	IC PWR AMP RF 26V 15W TO272-16GW Frequency: 1.8GHz ~ 1.99GHz P1dB: - Gain: 26dB Noise Figure: - RF Type: Cellular, W-CDMA, GSM, EDGE, TDMA, CDMA Voltage - Supply: 26V Current - Supply: 100mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	封裝: TO-272-16 Variant, Gull Wing	庫存27,192
MCZ33903DS5EK	NXP	SYSTEM BASIS CHIPLIN 2X 5.0 V/ Applications: System Basis Chip Interface: CAN, LIN Voltage - Supply: 5.5 V ~ 28 V Package / Case: - Supplier Device Package: - Mounting Type: -	封裝: -	庫存5,136
SC18IS600IPW/S8HP	NXP	SC18IS600I Protocol: I²C Function: Controller Interface: SPI Standards: - Voltage - Supply: 2.4 V ~ 3.6 V Current - Supply: 11mA Operating Temperature: -40°C ~ 85°C Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存4,816
MKS22FN256VLH12	NXP	KINETIS S 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 1x16b. D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存6,192
FS32K146HNT0VLLT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存7,280
S9S12P128J0MLHR	NXP	16-BIT MCU S12 CORE 128KB FLAS Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 49 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存4,720
MIMX9322DVXXMAB	NXP	IC Architecture: - Core Processor: - Flash Size: - RAM Size: - Peripherals: - Connectivity: - Speed: - Primary Attributes: - Operating Temperature: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LPC2364FBD100K	NXP	IC MCU 16/32B 128KB FLSH 100LQFP Core Processor: ARM7® Core Size: 16/32-Bit Speed: 72MHz Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 34K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Data Converters: A/D 6x10b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	庫存792
S32G379AACK1VUCR	NXP	4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2 Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1.3GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	封裝: -	Request a Quote
MWCT2D16SHVPB	NXP	MWCT2D16S, MAXQFP172 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S912ZVLA96F0VFM	NXP	S12Z CPU, 96K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

MRF8HP21130HR3

NXP

FET RF 2CH 65V 2.17GHZ NI780-4

Transistor Type: LDMOS (Dual)
Frequency: 2.17GHz
Gain: 14dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 360mA
Power - Output: 28W
Voltage - Rated: 65V
Package / Case: NI-780-4
Supplier Device Package: NI-780-4

封裝: NI-780-4

庫存5,264

MRF6V14300HR3

NXP

FET RF 100V 1.4GHZ NI780

Transistor Type: LDMOS
Frequency: 1.4GHz
Gain: 18dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 330W
Voltage - Rated: 100V
Package / Case: NI-780
Supplier Device Package: NI-780

封裝: NI-780

庫存2,320

MD7P19130HR5

NXP

FET RF 2CH 65V 1.99GHZ NI780H-4

Transistor Type: LDMOS (Dual)
Frequency: 1.99GHz
Gain: 20dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.25A
Power - Output: 40W
Voltage - Rated: 65V
Package / Case: NI-780-4
Supplier Device Package: NI-780-4

封裝: NI-780-4

庫存6,256

LD6806TD/22H,125

NXP

IC REG LINEAR 2.2V 200MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

封裝: SC-74A, SOT-753

庫存4,416

MCZ33812EK

NXP

IC DVR IGNITION/INJECTOR 32-SOIC

Applications: Automotive
Current - Supply: 10mA
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存3,584

74LVC541APW/AUJ

NXP

IC BUFFER/DVR 3-ST 8BIT 20TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存5,424

MC14467P1

NXP

IC SMOKE DETECTOR 16-DIP

Type: Smoke Detector
Input Type: Ionization
Output Type: Voltage
Interface: -
Current - Supply: 12µA
Operating Temperature: -10°C ~ 60°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-PDIP

封裝: 16-DIP (0.300", 7.62mm)

庫存669,816

TJA1054AT/S900M:51

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存2,992

MPC8547EVTATGD

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,000

P1010NXN5HFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封裝: 425-FBGA

庫存9,852

KMC8360CZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存7,664

KMPC8541EVTAQF

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,528

P4040NXE7MMC

NXP

IC MPU Q OR IQ 1.5GHZ 1295FCBGA

Core Processor: PowerPC e500mc
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Security; SEC 4.0
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 10 Gbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存5,376

MC68HC11D0CFBE3

NXP

IC MCU 8BIT ROMLESS 44QFP

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 26
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-QFP (10x10)

封裝: 44-QFP

庫存7,552

MC68332GCPV20

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,144

S9S08SG32E1VTLR

NXP

IC MCU 8BIT 32KB FLASH 28TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

封裝: 28-TSSOP (0.173", 4.40mm Width)

庫存50,520

TDA9955HL/17/C1,55

NXP

IC ADC 8BIT 170MSPS 100-LQFP

Type: ADC, Video
Number of Channels: -
Resolution (Bits): 8 b
Sampling Rate (Per Second): 170M
Data Interface: Serial
Voltage Supply Source: Analog and Digital
Voltage - Supply: 1.75 V ~ 1.85 V, 3.15 V ~ 3.45 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存7,680

MW6IC2015GNBR1

NXP

IC PWR AMP RF 26V 15W TO272-16GW

Frequency: 1.8GHz ~ 1.99GHz
P1dB: -
Gain: 26dB
Noise Figure: -
RF Type: Cellular, W-CDMA, GSM, EDGE, TDMA, CDMA
Voltage - Supply: 26V
Current - Supply: 100mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Gull Wing
Supplier Device Package: TO-272 WB-16 GULL

封裝: TO-272-16 Variant, Gull Wing

庫存27,192

MCZ33903DS5EK

NXP

SYSTEM BASIS CHIPLIN 2X 5.0 V/

Applications: System Basis Chip
Interface: CAN, LIN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: -
Supplier Device Package: -
Mounting Type: -

封裝: -

庫存5,136

SC18IS600IPW/S8HP

NXP

SC18IS600I

Protocol: I²C
Function: Controller
Interface: SPI
Standards: -
Voltage - Supply: 2.4 V ~ 3.6 V
Current - Supply: 11mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存4,816

MKS22FN256VLH12

NXP

KINETIS S 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 1x16b. D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存6,192

FS32K146HNT0VLLT

NXP

S32K144 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存7,280

S9S12P128J0MLHR

NXP

16-BIT MCU S12 CORE 128KB FLAS

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 49
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存4,720

MIMX9322DVXXMAB

NXP

IC

Architecture: -
Core Processor: -
Flash Size: -
RAM Size: -
Peripherals: -
Connectivity: -
Speed: -
Primary Attributes: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LPC2364FBD100K

NXP

IC MCU 16/32B 128KB FLSH 100LQFP

Core Processor: ARM7®
Core Size: 16/32-Bit
Speed: 72MHz
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 70
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 34K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 6x10b SAR; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

庫存792

S32G379AACK1VUCR

NXP

4XA53 - 1.3GHZ, 4XM7 - 400MHZ, 2

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 400MHz, 1.3GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

封裝: -

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MWCT2D16SHVPB

NXP

MWCT2D16S, MAXQFP172

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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S912ZVLA96F0VFM

NXP

S12Z CPU, 96K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote