頁 69 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BUK951R9-40E,127	NXP	MOSFET N-CH 40V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 120nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 16400pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 349W (Tc) Rds On (Max) @ Id, Vgs: 1.7 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存4,864
PHD66NQ03LT,118	NXP	MOSFET N-CH 25V 66A DPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 66A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 12nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 860pF @ 25V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 93W (Tc) Rds On (Max) @ Id, Vgs: 10.5 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: DPAK Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63	封裝: TO-252-3, DPak (2 Leads + Tab), SC-63	庫存7,632
MRF5S18060NR1	NXP	FET RF 1.88GHZ TO-270-4 Transistor Type: N-Channel Frequency: 1.88GHz Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: 60W Voltage - Rated: - Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	封裝: TO-270AB	庫存4,928
LD6806TD/20P,125	NXP	IC REG LINEAR 2V 200MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2V Voltage - Output (Max): - Voltage Dropout (Max): 0.13V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	封裝: SC-74A, SOT-753	庫存6,976
MCZ33810EKR2	NXP	IC DVR 8-CH ENGINE CTRL 32-SOIC Applications: Automotive Current - Supply: 10mA Voltage - Supply: 4.5 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存2,656
BUK109-50DL,118	NXP	MOSFET N-CH 50V 26A D2PAK Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: Low Side Output Type: N-Channel Interface: On/Off Voltage - Load: 50V (Max) Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 26A Rds On (Typ): 45 mOhm Input Type: Non-Inverting Features: - Fault Protection: Over Temperature, Over Voltage Operating Temperature: 150°C (TJ) Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB Supplier Device Package: D2PAK	封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	庫存3,792
74AHCT373D,112	NXP	IC OCT D TRANSP LATCH 3ST 20SOIC Logic Type: D-Type Transparent Latch Circuit: 8:8 Output Type: Tri-State Voltage - Supply: 4.5 V ~ 5.5 V Independent Circuits: 1 Delay Time - Propagation: 4ns Current - Output High, Low: 8mA, 8mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存4,144
SCC2691AC1D24,518	NXP	IC UART 24SOIC Features: Configurable GPIO, Internal Oscillator, Timer/Counter Number of Channels: 1, UART FIFO's: - Protocol: - Data Rate (Max): - Voltage - Supply: 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: - With False Start Bit Detection: Yes With Modem Control: - Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存2,000
SC16C652BIBS,128	NXP	IC ENCODER/DECODER IRDA 32HVQFN Features: - Number of Channels: 2, DUART FIFO's: 32 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存4,368
UJA1075ATW/5V0/WD,	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存7,808
AU5790D14,518	NXP	IC CAN TXRX SINGLE WIRE 14SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 5.3 V ~ 27 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存5,712
TJA1020T/N1,112	NXP	IC LIN TRANSCEIVER 8-SOIC Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 5 V ~ 27 V Operating Temperature: - Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存2,480
KXPC8240RVV250E	NXP	IC MPU MPC82XX 250MHZ 352TBGA Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 250MHz Co-Processors/DSP: - RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 352-LBGA Supplier Device Package: 352-TBGA (35x35)	封裝: 352-LBGA	庫存6,160
MC7448VS1400ND	NXP	IC MPU MPC74XX 1.4GHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	封裝: 360-CLGA, FCCLGA	庫存4,272
MCIMX512DJM8C	NXP	IC MPU I.MX51 800MHZ 529BGA Core Processor: ARM? Cortex?-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: 10/100 Mbps (1) SATA: - USB: USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature: -20°C ~ 85°C (TC) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case: 529-LFBGA Supplier Device Package: 529-BGA Case 2017 (19x19)	封裝: 529-LFBGA	庫存4,160
MC16Z3BCAG16	NXP	IC MCU 16BIT 8KB MROM 144LQFP Core Processor: CPU16 Core Size: 16-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 16 Program Memory Size: 8KB (8K x 8) Program Memory Type: Mask ROM EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存2,128
MC908GR16MFAE	NXP	IC MCU 8BIT 16KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存6,060
MCF5271CAB100	NXP	IC MCU 32BIT ROMLESS 160QFP Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 39 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 160-BQFP Supplier Device Package: 160-QFP (28x28)	封裝: 160-BQFP	庫存4,880
MK60FX512VMD15	NXP	IC MCU 32BIT 512KB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 58x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	封裝: 144-LBGA	庫存6,976
SL3S1203FUF,003	NXP	IC UCODE G2XL UNCASED FOIL Type: RFID Transponder Frequency: 840MHz ~ 960MHz Standards: EPC Interface: - Voltage - Supply: 1.8V Operating Temperature: -40°C ~ 85°C Package / Case: Die Supplier Device Package: Die	封裝: Die	庫存8,856
MMPF0100FCAEP	NXP	POWER MANAGEMENT IC I.MX6 NO-P Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存8,616
SPC5746BSK1AMKU2	NXP	SINGLE CORE 3M FLASH 384K RAM Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals: DMA, I²S, POR, WDT Number of I/O: 129 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 384K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-LQFP (24x24)	封裝: 176-LQFP Exposed Pad	庫存6,144
SPC5514EAMLQ66	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0, e200z1 Core Size: 32-Bit Dual-Core Speed: 66MHz Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 111 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V Data Converters: A/D 40x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存2,256
S9S12GN48F0WLF	NXP	16-BIT MCU S12 CORE 48KB FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存2,048
S912ZVMC64F3WKHR	NXP	S12Z CORE,64K FLASH,CAN,64LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	封裝: -	Request a Quote
FB32K146HAT0VLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
S9S12GN32J1VTJR	NXP	IC MCU 16BIT 32KB FLASH 20TSSOP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: -	Request a Quote
LPC55S66JBD64K	NXP	IC MCU 32BIT 256KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 144K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	封裝: -	Request a Quote

BUK951R9-40E,127

NXP

MOSFET N-CH 40V 120A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 40V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 120nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 16400pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 1.7 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存4,864

PHD66NQ03LT,118

NXP

MOSFET N-CH 25V 66A DPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 66A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 12nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 860pF @ 25V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 93W (Tc)
Rds On (Max) @ Id, Vgs: 10.5 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: DPAK
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63

封裝: TO-252-3, DPak (2 Leads + Tab), SC-63

庫存7,632

MRF5S18060NR1

NXP

FET RF 1.88GHZ TO-270-4

Transistor Type: N-Channel
Frequency: 1.88GHz
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 60W
Voltage - Rated: -
Package / Case: TO-270AB
Supplier Device Package: TO-270 WB-4

封裝: TO-270AB

庫存4,928

LD6806TD/20P,125

NXP

IC REG LINEAR 2V 200MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.13V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

封裝: SC-74A, SOT-753

庫存6,976

MCZ33810EKR2

NXP

IC DVR 8-CH ENGINE CTRL 32-SOIC

Applications: Automotive
Current - Supply: 10mA
Voltage - Supply: 4.5 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存2,656

BUK109-50DL,118

NXP

MOSFET N-CH 50V 26A D2PAK

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: Low Side
Output Type: N-Channel
Interface: On/Off
Voltage - Load: 50V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 26A
Rds On (Typ): 45 mOhm
Input Type: Non-Inverting
Features: -
Fault Protection: Over Temperature, Over Voltage
Operating Temperature: 150°C (TJ)
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Supplier Device Package: D2PAK

封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

庫存3,792

74AHCT373D,112

NXP

IC OCT D TRANSP LATCH 3ST 20SOIC

Logic Type: D-Type Transparent Latch
Circuit: 8:8
Output Type: Tri-State
Voltage - Supply: 4.5 V ~ 5.5 V
Independent Circuits: 1
Delay Time - Propagation: 4ns
Current - Output High, Low: 8mA, 8mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存4,144

SCC2691AC1D24,518

NXP

IC UART 24SOIC

Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Number of Channels: 1, UART
FIFO's: -
Protocol: -
Data Rate (Max): -
Voltage - Supply: 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: -
With False Start Bit Detection: Yes
With Modem Control: -
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存2,000

SC16C652BIBS,128

NXP

IC ENCODER/DECODER IRDA 32HVQFN

Features: -
Number of Channels: 2, DUART
FIFO's: 32 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存4,368

UJA1075ATW/5V0/WD,

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存7,808

AU5790D14,518

NXP

IC CAN TXRX SINGLE WIRE 14SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 5.3 V ~ 27 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存5,712

TJA1020T/N1,112

NXP

IC LIN TRANSCEIVER 8-SOIC

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 5 V ~ 27 V
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存2,480

KXPC8240RVV250E

NXP

IC MPU MPC82XX 250MHZ 352TBGA

Core Processor: PowerPC 603e
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 250MHz
Co-Processors/DSP: -
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 352-LBGA
Supplier Device Package: 352-TBGA (35x35)

封裝: 352-LBGA

庫存6,160

MC7448VS1400ND

NXP

IC MPU MPC74XX 1.4GHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.4GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

封裝: 360-CLGA, FCCLGA

庫存4,272

MCIMX512DJM8C

NXP

IC MPU I.MX51 800MHZ 529BGA

Core Processor: ARM? Cortex?-A8
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature: -20°C ~ 85°C (TC)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Package / Case: 529-LFBGA
Supplier Device Package: 529-BGA Case 2017 (19x19)

封裝: 529-LFBGA

庫存4,160

MC16Z3BCAG16

NXP

IC MCU 16BIT 8KB MROM 144LQFP

Core Processor: CPU16
Core Size: 16-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 8KB (8K x 8)
Program Memory Type: Mask ROM
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存2,128

MC908GR16MFAE

NXP

IC MCU 8BIT 16KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 37
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存6,060

MCF5271CAB100

NXP

IC MCU 32BIT ROMLESS 160QFP

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 39
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 160-BQFP
Supplier Device Package: 160-QFP (28x28)

封裝: 160-BQFP

庫存4,880

MK60FX512VMD15

NXP

IC MCU 32BIT 512KB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 58x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

封裝: 144-LBGA

庫存6,976

SL3S1203FUF,003

NXP

IC UCODE G2XL UNCASED FOIL

Type: RFID Transponder
Frequency: 840MHz ~ 960MHz
Standards: EPC
Interface: -
Voltage - Supply: 1.8V
Operating Temperature: -40°C ~ 85°C
Package / Case: Die
Supplier Device Package: Die

封裝: Die

庫存8,856

MMPF0100FCAEP

NXP

POWER MANAGEMENT IC I.MX6 NO-P

Applications: -
Voltage - Input: -
Number of Outputs: -
Voltage - Output: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存8,616

SPC5746BSK1AMKU2

NXP

SINGLE CORE 3M FLASH 384K RAM

Core Processor: e200z4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, I²S, POR, WDT
Number of I/O: 129
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 36x10b, 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封裝: 176-LQFP Exposed Pad

庫存6,144

SPC5514EAMLQ66

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0, e200z1
Core Size: 32-Bit Dual-Core
Speed: 66MHz
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 111
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
Data Converters: A/D 40x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存2,256

S9S12GN48F0WLF

NXP

16-BIT MCU S12 CORE 48KB FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存2,048

S912ZVMC64F3WKHR

NXP

S12Z CORE,64K FLASH,CAN,64LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Data Converters: A/D 9x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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FB32K146HAT0VLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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S9S12GN32J1VTJR

NXP

IC MCU 16BIT 32KB FLASH 20TSSOP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: -

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LPC55S66JBD64K

NXP

IC MCU 32BIT 256KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 144K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

封裝: -

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