頁 275 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PH5525L,115	NXP	MOSFET N-CH 25V 81.7A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 81.7A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 16.6nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 2150pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 5.5 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	封裝: SC-100, SOT-669	庫存3,264
BUK762R9-40E/GFJ	NXP	MOSFET N-CH D2PAK Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,200
PZM5.6NB1,115	NXP	DIODE ZENER 5.6V 300MW SMT3 Voltage - Zener (Nom) (Vz): 5.6V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 40 Ohms Current - Reverse Leakage @ Vr: 2µA @ 2.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存3,840
GTL2002DC,125	NXP	IC XLATR 2BIT BI-DIREC OD 8VSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 5.5V Voltage - VCCB: 1V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-VFSOP (0.091", 2.30mm Width) Supplier Device Package: 8-VSSOP, US8	封裝: 8-VFSOP (0.091", 2.30mm Width)	庫存24,510
74ALVT162240DGG,51	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存6,192
TDA9886T/V4,112	NXP	IC IF-PLL I2C-BUS DEMOD 24-SOIC Type: Demodulator Applications: TV Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存7,824
UJA1079TW/3V3,118	NXP	IC SBC LINE 3.3V 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存2,928
PCA9617ATPZ	NXP	IC REDRIVER I2C 1CH 1MHZ 8HWSON Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 1MHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 7pF Voltage - Supply: 0.8 V ~ 5.5 V, 2.2 V ~ 5.5 V Current - Supply: 50µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	封裝: 8-WFDFN Exposed Pad	庫存5,232
TJA1055T/3/C,518	NXP	IC CAN TXRX FAULT-TOL 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: - Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	封裝: 14-SOIC (0.154", 3.90mm Width)	庫存24,066
P1010NSN5HFA	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	封裝: 425-FBGA	庫存7,596
MC8610VT1333JB	NXP	IC MPU MPC86XX 1.333GHZ 783BGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,848
MPC860DPCZQ66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存3,232
MPC860ENVR50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存6,768
MK10DX128ZVMD10R	NXP	IC MCU 32BIT 128KB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 46x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	封裝: 144-LBGA	庫存6,384
LPC11U37FBD48/501,	NXP	IC MCU 32BIT 128KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存3,168
MC9S08GT32ACBE	NXP	IC MCU 8BIT 32KB FLASH 42PSDIP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 33 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 42-SDIP (0.600", 15.24mm) Supplier Device Package: 42-PSDIP	封裝: 42-SDIP (0.600", 15.24mm)	庫存7,328
MC68HC908JK1ECDW	NXP	IC MCU 8BIT 1.5KB FLASH 20SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LED, LVD, POR, PWM Number of I/O: 15 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	封裝: 20-SOIC (0.295", 7.50mm Width)	庫存7,140
MC68332ACPV20	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: CPU32 Core Size: 32-Bit Speed: 20MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,208
MKV42F256VLH16	NXP	IC MCU 32BIT 256KB FLASH LQFP 64 Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 168MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 48 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 29x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存4,048
MC9S08LL16CGT	NXP	IC MCU 8BIT 16KB FLASH 48QFN Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	封裝: 48-VFQFN Exposed Pad	庫存6,224
MK20DN128VLH5	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 13x16b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存26,928
KMSC8122VT8000	NXP	DSP 16BIT QUAD 500MHZ 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 500MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	封裝: 431-BFBGA, FCBGA	庫存5,136
PCF8591P,112	NXP	IC ADC/DAC 8-BIT I2C 16-DIP Type: ADC, DAC Number of Channels: - Resolution (Bits): 8 b Sampling Rate (Per Second): 11.1k Data Interface: I2C, Serial Voltage Supply Source: Single Supply Voltage - Supply: 2.5 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	封裝: 16-DIP (0.300", 7.62mm)	庫存5,680
MRF1K50H-TF1	NXP	MRF1K50H 87.5-108 MHZ EVAL BOARD Type: Transistor Frequency: 87.5MHz ~ 108MHz For Use With/Related Products: MRF1K50H Supplied Contents: Board	封裝: -	庫存4,860
SPC5605BK0VLQ4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 121 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 15x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,816
S9S12VR64AF0CLC	NXP	MAGNIV 16-BIT MCU S12 CORE 64K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 2x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存7,408
LPC4330FBD144Y	NXP	IC MCU 32BIT ROMLESS 144LQFP Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 83 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 264K x 8 Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: -	Request a Quote
MC33FS8510B6ESR2	NXP	FS8500 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

PH5525L,115

NXP

MOSFET N-CH 25V 81.7A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 81.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 16.6nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 2150pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 62.5W (Tc)
Rds On (Max) @ Id, Vgs: 5.5 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

封裝: SC-100, SOT-669

庫存3,264

BUK762R9-40E/GFJ

NXP

MOSFET N-CH D2PAK

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Power - Max: -
Frequency - Transition: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,200

PZM5.6NB1,115

NXP

DIODE ZENER 5.6V 300MW SMT3

Voltage - Zener (Nom) (Vz): 5.6V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 40 Ohms
Current - Reverse Leakage @ Vr: 2µA @ 2.5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存3,840

GTL2002DC,125

NXP

IC XLATR 2BIT BI-DIREC OD 8VSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 2
Voltage - VCCA: 1V ~ 5.5V
Voltage - VCCB: 1V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Supplier Device Package: 8-VSSOP, US8

封裝: 8-VFSOP (0.091", 2.30mm Width)

庫存24,510

74ALVT162240DGG,51

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存6,192

TDA9886T/V4,112

NXP

IC IF-PLL I2C-BUS DEMOD 24-SOIC

Type: Demodulator
Applications: TV
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存7,824

UJA1079TW/3V3,118

NXP

IC SBC LINE 3.3V 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存2,928

PCA9617ATPZ

NXP

IC REDRIVER I2C 1CH 1MHZ 8HWSON

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 1MHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 7pF
Voltage - Supply: 0.8 V ~ 5.5 V, 2.2 V ~ 5.5 V
Current - Supply: 50µA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-WFDFN Exposed Pad
Supplier Device Package: 8-HWSON (2x3)

封裝: 8-WFDFN Exposed Pad

庫存5,232

TJA1055T/3/C,518

NXP

IC CAN TXRX FAULT-TOL 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

封裝: 14-SOIC (0.154", 3.90mm Width)

庫存24,066

P1010NSN5HFA

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

封裝: 425-FBGA

庫存7,596

MC8610VT1333JB

NXP

IC MPU MPC86XX 1.333GHZ 783BGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,848

MPC860DPCZQ66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存3,232

MPC860ENVR50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存6,768

MK10DX128ZVMD10R

NXP

IC MCU 32BIT 128KB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 46x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

封裝: 144-LBGA

庫存6,384

LPC11U37FBD48/501,

NXP

IC MCU 32BIT 128KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 40
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存3,168

MC9S08GT32ACBE

NXP

IC MCU 8BIT 32KB FLASH 42PSDIP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 33
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 42-SDIP (0.600", 15.24mm)
Supplier Device Package: 42-PSDIP

封裝: 42-SDIP (0.600", 15.24mm)

庫存7,328

MC68HC908JK1ECDW

NXP

IC MCU 8BIT 1.5KB FLASH 20SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LED, LVD, POR, PWM
Number of I/O: 15
Program Memory Size: 1.5KB (1.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
Data Converters: A/D 12x8b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

封裝: 20-SOIC (0.295", 7.50mm Width)

庫存7,140

MC68332ACPV20

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 20MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,208

MKV42F256VLH16

NXP

IC MCU 32BIT 256KB FLASH LQFP 64

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 168MHz
Connectivity: CAN, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 48
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 29x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存4,048

MC9S08LL16CGT

NXP

IC MCU 8BIT 16KB FLASH 48QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

封裝: 48-VFQFN Exposed Pad

庫存6,224

MK20DN128VLH5

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 13x16b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存26,928

KMSC8122VT8000

NXP

DSP 16BIT QUAD 500MHZ 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 500MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

封裝: 431-BFBGA, FCBGA

庫存5,136

PCF8591P,112

NXP

IC ADC/DAC 8-BIT I2C 16-DIP

Type: ADC, DAC
Number of Channels: -
Resolution (Bits): 8 b
Sampling Rate (Per Second): 11.1k
Data Interface: I2C, Serial
Voltage Supply Source: Single Supply
Voltage - Supply: 2.5 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

封裝: 16-DIP (0.300", 7.62mm)

庫存5,680

MRF1K50H-TF1

NXP

MRF1K50H 87.5-108 MHZ EVAL BOARD

Type: Transistor
Frequency: 87.5MHz ~ 108MHz
For Use With/Related Products: MRF1K50H
Supplied Contents: Board

封裝: -

庫存4,860

SPC5605BK0VLQ4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 121
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 15x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,816

S9S12VR64AF0CLC

NXP

MAGNIV 16-BIT MCU S12 CORE 64K

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存7,408

LPC4330FBD144Y

NXP

IC MCU 32BIT ROMLESS 144LQFP

Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
Core Size: 32-Bit Dual-Core
Speed: 204MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 264K x 8
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: -

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MC33FS8510B6ESR2

NXP

FS8500

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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