頁 229 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  229/950
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BUK7540-100A,127
NXP

MOSFET N-CH 100V 37A TO220AB

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 100V
  • Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 10V
  • Vgs(th) (Max) @ Id: 4V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: -
  • Input Capacitance (Ciss) (Max) @ Vds: 2293pF @ 25V
  • Vgs (Max): ±20V
  • FET Feature: -
  • Power Dissipation (Max): 138W (Tc)
  • Rds On (Max) @ Id, Vgs: 40 mOhm @ 40A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: TO-220AB
  • Package / Case: TO-220-3
封裝: TO-220-3
庫存6,816
LD6815TD/25H,125
NXP

IC REG LINEAR 2.5V 150MA 5TSOP

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 2.5V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.25V @ 150mA (Typ)
  • Current - Output: 150mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 35µA ~ 150µA
  • PSRR: 75dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Transient Voltage
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: SC-74A, SOT-753
  • Supplier Device Package: 5-TSOP
封裝: SC-74A, SOT-753
庫存6,352
SSTUH32866EC,518
NXP

IC BUFFER 1.8V 25BIT SOT536

  • Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
  • Supply Voltage: 1.7 V ~ 1.9 V
  • Number of Bits: 25, 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 96-LFBGA
  • Supplier Device Package: 96-LFBGA (13.5x5.5)
封裝: 96-LFBGA
庫存6,320
74LV373D,112
NXP

IC OCTAL D TRANSP LATCH 20SOIC

  • Logic Type: D-Type Transparent Latch
  • Circuit: 8:8
  • Output Type: Tri-State
  • Voltage - Supply: 1 V ~ 5.5 V
  • Independent Circuits: 1
  • Delay Time - Propagation: 20ns
  • Current - Output High, Low: 16mA, 16mA
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存7,408
74LV14PW/AUJ
NXP

IC HEX INV SCHMITT TRIG 14TSSOP

  • Logic Type: Inverter
  • Number of Circuits: 6
  • Number of Inputs: 6
  • Features: Schmitt Trigger
  • Voltage - Supply: 1 V ~ 5.5 V
  • Current - Quiescent (Max): 20µA
  • Current - Output High, Low: 12mA, 12mA
  • Logic Level - Low: 0.3 V ~ 1.1 V
  • Logic Level - High: 1.4 V ~ 3.85 V
  • Max Propagation Delay @ V, Max CL: 18ns @ 5V, 50pF
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Supplier Device Package: 14-TSSOP
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
封裝: 14-TSSOP (0.173", 4.40mm Width)
庫存7,584
74AVC16836ADGV,112
NXP

IC RGSTRD DVR 3-ST 20BIT 56TVSOP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 20
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 1.2 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 56-TSSOP
封裝: 56-TFSOP (0.173", 4.40mm Width)
庫存7,344
74HCT9115D,112
NXP

IC BUFF NINE SCHMT TIG 20SOIC

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 9
  • Number of Bits per Element: 1
  • Input Type: Schmitt Trigger
  • Output Type: Open Drain
  • Current - Output High, Low: -, 4mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SO
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存2,432
PCA9646PW,118
NXP

IC BUS SWITCH BUFF 4CH 16TSSOP

  • Type: Buffer, ReDriver
  • Applications: I2C
  • Input: 2-Wire Bus
  • Output: 2-Wire Bus
  • Data Rate (Max): 1MHz
  • Number of Channels: 4
  • Delay Time: 100ns
  • Signal Conditioning: -
  • Capacitance - Input: -
  • Voltage - Supply: 2.7 V ~ 5.5 V
  • Current - Supply: 1µA
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
封裝: 16-TSSOP (0.173", 4.40mm Width)
庫存4,528
KMPC8270ZQMIBA
NXP

IC MPU MPC82XX 266MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
封裝: 516-BBGA
庫存3,760
hot MC68340FT25E
NXP

IC MPU M683XX 25MHZ 144QFP

  • Core Processor: CPU32
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 144-BQFP
  • Supplier Device Package: 144-QFP (28x28)
封裝: 144-BQFP
庫存7,272
MC68360VR25L
NXP

IC MPU M683XX 25MHZ 357BGA

  • Core Processor: CPU32+
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
封裝: 357-BBGA
庫存5,712
hot MPC8247ZQTIEA
NXP

IC MPU MPC82XX 400MHZ 516BGA

  • Core Processor: PowerPC G2_LE
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (2)
  • SATA: -
  • USB: USB 2.0 (1)
  • Voltage - I/O: 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
封裝: 516-BBGA
庫存6,304
hot MC68LC302AF25CT
NXP

IC MPU M683XX 25MHZ 100LQFP

  • Core Processor: M68000
  • Number of Cores/Bus Width: 1 Core, 8/16-Bit
  • Speed: 25MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 5.0V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Security Features: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存9,492
P1014NSN5DFB
NXP

IC MPU Q OR IQ 800MHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
封裝: 425-FBGA
庫存6,848
hot MC7448HX1400ND
NXP

IC MPU MPC74XX 1.4GHZ 360FCCBGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.4GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-BCBGA, FCCBGA
  • Supplier Device Package: 360-FCCBGA (25x25)
封裝: 360-BCBGA, FCCBGA
庫存7,956
hot MCF52258VN80J
NXP

IC MCU 32BIT 512KB FLASH 144BGA

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 80MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 96
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
封裝: 144-LBGA
庫存3,952
LH7A400N0G000B5,55
NXP

IC MCU 32BIT ROMLESS 256BGA

  • Core Processor: ARM9?
  • Core Size: 32-Bit
  • Speed: 200MHz
  • Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
  • Number of I/O: 60
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-BGA (17x17)
封裝: 256-BGA
庫存4,112
PXAS30KFA,512
NXP

IC MCU 16BIT ROMLESS 68PLCC

  • Core Processor: XA
  • Core Size: 16-Bit
  • Speed: 30MHz
  • Connectivity: EBI/EMI, I2C, UART/USART
  • Peripherals: PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 8x8b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 68-LCC (J-Lead)
  • Supplier Device Package: 68-PLCC (24.23x24.23)
封裝: 68-LCC (J-Lead)
庫存6,752
hot MCF5249LCAG120
NXP

IC MCU 32BIT ROMLESS 144LQFP

  • Core Processor: Coldfire V2
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: I2C, IDE, Memory Card, SPI, UART/USART
  • Peripherals: DMA, I2S, POR, Serial Audio, WDT
  • Number of I/O: 34
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 96K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 4x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存5,056
SPC5604BF2CLL6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存3,456
MKL17Z256VLH4R
NXP

KINETIS KL17: 48MHZ CORTEX-M0+ U

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 20x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存2,000
LPC55S04JHI48QL
NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Single-Core
  • Speed: 96MHz
  • Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
  • Number of I/O: 30
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 80K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
  • Data Converters: A/D 7x16b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
封裝: -
Request a Quote
LPC2148FBD64-157
NXP

IC MCU 16/32B 512KB FLASH 64LQFP

  • Core Processor: ARM7®
  • Core Size: 16/32-Bit
  • Speed: 60MHz
  • Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 45
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 40K x 8
  • Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
  • Data Converters: A/D 14x10b SAR; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: -
庫存414
SAF7770EL-200Z170Y
NXP

SAF7770EL

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-LFBGA (15x15)
封裝: -
Request a Quote
MC33FS8430G1ES
NXP

SYSTEM BASIS CHIP FS8430

  • Applications: System Basis Chip
  • Current - Supply: 15mA
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
封裝: -
庫存399
S9S12GN48J0MLFR
NXP

S12 CORE,48K FLASH,AU

  • Core Processor: S12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 48KB (48K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1.5K x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
  • Data Converters: A/D 12x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: -
Request a Quote
BAT54-LF1R
NXP

DIODE SCHOTTKY TO-236AB

  • Diode Type: -
  • Voltage - DC Reverse (Vr) (Max): -
  • Current - Average Rectified (Io): -
  • Voltage - Forward (Vf) (Max) @ If: -
  • Speed: -
  • Reverse Recovery Time (trr): -
  • Current - Reverse Leakage @ Vr: -
  • Capacitance @ Vr, F: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
  • Operating Temperature - Junction: -
封裝: -
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MPF5023AMBA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 200µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
封裝: -
Request a Quote