頁 215 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF6VP11KGSR5	NXP	FET RF 2CH 110V 130MHZ NI-1230S Transistor Type: LDMOS (Dual) Frequency: 130MHz Gain: 26dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 150mA Power - Output: 1000W Voltage - Rated: 110V Package / Case: NI-1230S-4 GW Supplier Device Package: NI-1230S-4 GullWing	封裝: NI-1230S-4 GW	庫存5,696
PBSS5350S,126	NXP	TRANS PNP 50V 3A TO92 Transistor Type: PNP Current - Collector (Ic) (Max): 3A Voltage - Collector Emitter Breakdown (Max): 50V Vce Saturation (Max) @ Ib, Ic: 300mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 2A, 2V Power - Max: 830mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	庫存3,008
LD6806CX4/22P,315	NXP	IC REG LINEAR 2.2V 200MA 4WLCSP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.1V @ 200mA Current - Output: 200mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA, WLCSP Supplier Device Package: 4-WLCSP (0.76x0.76)	封裝: 4-XFBGA, WLCSP	庫存6,304
MCZ33742SEGR2	NXP	IC SYSTEM BASIS CHIP CAN 28-SOIC Applications: Automotive Current - Supply: 42mA Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	封裝: 28-SOIC (0.295", 7.50mm Width)	庫存104,940
SSL5251T/1J	NXP	IC LED DRIVER DIMMABLE 8HSO Type: AC DC Offline Switcher Topology: Step-Down (Buck), Step-Up (Boost) Internal Switch(s): No Number of Outputs: 1 Voltage - Supply (Min): 9.9V Voltage - Supply (Max): 16V Voltage - Output: - Current - Output / Channel: - Frequency: - Dimming: Triac Applications: Lighting Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存2,032
TEA1721DT/N1,118	NXP	IC SMPS CTLR W/PWR SWITCH 7-SOIC Output Isolation: - Internal Switch(s): Yes Voltage - Breakdown: 700V Topology: Flyback Voltage - Start Up: 17V Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V Duty Cycle: 75% Frequency - Switching: 22.5kHz ~ 50.5kHz Power (Watts): 5W Fault Protection: Over Temperature, Over Voltage, Short Circuit Control Features: - Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads Supplier Device Package: 7-SO Mounting Type: Surface Mount	封裝: 8-SOIC (0.154", 3.90mm Width) 7 leads	庫存6,144
74ABT823D,623	NXP	IC D-TYPE POS TRG SNGL 24SOIC Function: Master Reset Type: D-Type Output Type: Tri-State, Non-Inverted Number of Elements: 1 Number of Bits per Element: 9 Clock Frequency: 200MHz Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 250µA Input Capacitance: 4pF Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width)	封裝: 24-SOIC (0.295", 7.50mm Width)	庫存5,888
74LVCH322244AEC;55	NXP	IC BUFF DVR TRI-ST 32BIT 96LFBGA Logic Type: Buffer, Non-Inverting Number of Elements: 8 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	封裝: 96-LFBGA	庫存3,440
74HCT640DB,118	NXP	IC TRANSCEIVER 3ST 8BIT 20SSOP Logic Type: Transceiver, Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 6mA, 6mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	封裝: 20-SSOP (0.209", 5.30mm Width)	庫存2,304
KMPC8540PX667LC	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 784-BBGA, FCBGA	庫存2,624
MC68MH360VR25L	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	封裝: 357-BBGA	庫存6,864
P1011NSN2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存7,264
S912XDQ256F1MAG	NXP	IC MCU 16BIT 256KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存7,792
MC68L11D0CFBE2	NXP	IC MCU 8BIT ROMLESS 44QFP Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 26 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	封裝: 44-QFP	庫存5,360
MC9S12DB128BCPV	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	封裝: 112-LQFP	庫存21,120
SVF522R2K2CMK4	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 + Cortex?-M4 Core Size: 32-Bit Dual-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG Peripherals: LCD, SAI Number of I/O: 136 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,928
MPC9608FA	NXP	IC CLOCK BUFFER 1:10 32-LQFP Type: Fanout Distribution, Multiplexer, Zero Delay Buffer PLL: Yes with Bypass Input: LVCMOS Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Frequency - Max: 200MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存7,664
PESD9X5.0L,315	NXP	TVS DIODE 5VWM 18VC SOD882 Type: Zener Unidirectional Channels: 1 Bidirectional Channels: - Voltage - Reverse Standoff (Typ): 5V (Max) Voltage - Breakdown (Min): 6.2V Voltage - Clamping (Max) @ Ipp: 18V Current - Peak Pulse (10/1000µs): 10A (8/20µs) Power - Peak Pulse: 150W Power Line Protection: No Applications: Automotive Capacitance @ Frequency: 68pF @ 1MHz Operating Temperature: -55°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: SOD-882 Supplier Device Package: DFN1006-2	封裝: SOD-882	庫存3,492
KMZ41,118	NXP	SENSOR LINEAR ANALOG 8SO Type: Linear Technology: Magnetoresistive Axis: X, Y Output Type: Analog Voltage Sensing Range: - Voltage - Supply: 5 V ~ 9 V Current - Supply (Max): - Current - Output (Max): - Resolution: - Bandwidth: - Operating Temperature: -40°C ~ 150°C (TA) Features: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: 8-SOIC (0.154", 3.90mm Width)	庫存4,806
TDA6651TT/C3,118	NXP	IC MXR/OSC AND SYNTH 38-TSSOP Function: Mixer Frequency: - RF Type: - Secondary Attributes: - Package / Case: 38-TFSOP (0.173", 4.40mm Width) Supplier Device Package: 38-TSSOP	封裝: 38-TFSOP (0.173", 4.40mm Width)	庫存7,362
S9S12VR32F0CLCR	NXP	MAGNIV 16-BIT MCU S12 CORE 32K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 2x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存3,536
TEA8919AAT-1Y	NXP	TEA8919AAT Applications: - Voltage - Input: - Voltage - Supply: - Current - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	封裝: -	Request a Quote
LPC54605J512BD100K	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 180MHz Connectivity: I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: -	Request a Quote
SAF7755EL-N207ZY	NXP	CAR DSP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
TJA1441BTK-0Z	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 50 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	封裝: -	庫存35,937
SAF7772EL-200Z13AK	NXP	SAF7772EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	封裝: -	Request a Quote
MC33FS6515NAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	封裝: -	Request a Quote
FB32K142HAT0MLHR	NXP	S32K142 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

MRF6VP11KGSR5

NXP

FET RF 2CH 110V 130MHZ NI-1230S

Transistor Type: LDMOS (Dual)
Frequency: 130MHz
Gain: 26dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 150mA
Power - Output: 1000W
Voltage - Rated: 110V
Package / Case: NI-1230S-4 GW
Supplier Device Package: NI-1230S-4 GullWing

封裝: NI-1230S-4 GW

庫存5,696

PBSS5350S,126

NXP

TRANS PNP 50V 3A TO92

Transistor Type: PNP
Current - Collector (Ic) (Max): 3A
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 2A, 2V
Power - Max: 830mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

庫存3,008

LD6806CX4/22P,315

NXP

IC REG LINEAR 2.2V 200MA 4WLCSP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.1V @ 200mA
Current - Output: 200mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA, WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)

封裝: 4-XFBGA, WLCSP

庫存6,304

MCZ33742SEGR2

NXP

IC SYSTEM BASIS CHIP CAN 28-SOIC

Applications: Automotive
Current - Supply: 42mA
Voltage - Supply: 5.5 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

封裝: 28-SOIC (0.295", 7.50mm Width)

庫存104,940

SSL5251T/1J

NXP

IC LED DRIVER DIMMABLE 8HSO

Type: AC DC Offline Switcher
Topology: Step-Down (Buck), Step-Up (Boost)
Internal Switch(s): No
Number of Outputs: 1
Voltage - Supply (Min): 9.9V
Voltage - Supply (Max): 16V
Voltage - Output: -
Current - Output / Channel: -
Frequency: -
Dimming: Triac
Applications: Lighting
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存2,032

TEA1721DT/N1,118

NXP

IC SMPS CTLR W/PWR SWITCH 7-SOIC

Output Isolation: -
Internal Switch(s): Yes
Voltage - Breakdown: 700V
Topology: Flyback
Voltage - Start Up: 17V
Voltage - Supply (Vcc/Vdd): 8.5 V ~ 35 V
Duty Cycle: 75%
Frequency - Switching: 22.5kHz ~ 50.5kHz
Power (Watts): 5W
Fault Protection: Over Temperature, Over Voltage, Short Circuit
Control Features: -
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 8-SOIC (0.154", 3.90mm Width) 7 leads
Supplier Device Package: 7-SO
Mounting Type: Surface Mount

封裝: 8-SOIC (0.154", 3.90mm Width) 7 leads

庫存6,144

74ABT823D,623

NXP

IC D-TYPE POS TRG SNGL 24SOIC

Function: Master Reset
Type: D-Type
Output Type: Tri-State, Non-Inverted
Number of Elements: 1
Number of Bits per Element: 9
Clock Frequency: 200MHz
Max Propagation Delay @ V, Max CL: 6.1ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 250µA
Input Capacitance: 4pF
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)

封裝: 24-SOIC (0.295", 7.50mm Width)

庫存5,888

74LVCH322244AEC;55

NXP

IC BUFF DVR TRI-ST 32BIT 96LFBGA

Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

封裝: 96-LFBGA

庫存3,440

74HCT640DB,118

NXP

IC TRANSCEIVER 3ST 8BIT 20SSOP

Logic Type: Transceiver, Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 6mA, 6mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 20-SSOP

封裝: 20-SSOP (0.209", 5.30mm Width)

庫存2,304

KMPC8540PX667LC

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 784-BBGA, FCBGA

庫存2,624

MC68MH360VR25L

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

封裝: 357-BBGA

庫存6,864

P1011NSN2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存7,264

S912XDQ256F1MAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存7,792

MC68L11D0CFBE2

NXP

IC MCU 8BIT ROMLESS 44QFP

Core Processor: HC11
Core Size: 8-Bit
Speed: 2MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 26
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-QFP (10x10)

封裝: 44-QFP

庫存5,360

MC9S12DB128BCPV

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

封裝: 112-LQFP

庫存21,120

SVF522R2K2CMK4

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5 + Cortex?-M4
Core Size: 32-Bit Dual-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
Peripherals: LCD, SAI
Number of I/O: 136
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,928

MPC9608FA

NXP

IC CLOCK BUFFER 1:10 32-LQFP

Type: Fanout Distribution, Multiplexer, Zero Delay Buffer
PLL: Yes with Bypass
Input: LVCMOS
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Frequency - Max: 200MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存7,664

PESD9X5.0L,315

NXP

TVS DIODE 5VWM 18VC SOD882

Type: Zener
Unidirectional Channels: 1
Bidirectional Channels: -
Voltage - Reverse Standoff (Typ): 5V (Max)
Voltage - Breakdown (Min): 6.2V
Voltage - Clamping (Max) @ Ipp: 18V
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Power - Peak Pulse: 150W
Power Line Protection: No
Applications: Automotive
Capacitance @ Frequency: 68pF @ 1MHz
Operating Temperature: -55°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: SOD-882
Supplier Device Package: DFN1006-2

封裝: SOD-882

庫存3,492

KMZ41,118

NXP

SENSOR LINEAR ANALOG 8SO

Type: Linear
Technology: Magnetoresistive
Axis: X, Y
Output Type: Analog Voltage
Sensing Range: -
Voltage - Supply: 5 V ~ 9 V
Current - Supply (Max): -
Current - Output (Max): -
Resolution: -
Bandwidth: -
Operating Temperature: -40°C ~ 150°C (TA)
Features: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: 8-SOIC (0.154", 3.90mm Width)

庫存4,806

TDA6651TT/C3,118

NXP

IC MXR/OSC AND SYNTH 38-TSSOP

Function: Mixer
Frequency: -
RF Type: -
Secondary Attributes: -
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Supplier Device Package: 38-TSSOP

封裝: 38-TFSOP (0.173", 4.40mm Width)

庫存7,362

S9S12VR32F0CLCR

NXP

MAGNIV 16-BIT MCU S12 CORE 32K

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存3,536

TEA8919AAT-1Y

NXP

TEA8919AAT

Applications: -
Voltage - Input: -
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

封裝: -

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LPC54605J512BD100K

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 180MHz
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

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SAF7755EL-N207ZY

NXP

CAR DSP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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TJA1441BTK-0Z

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 50 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

封裝: -

庫存35,937

SAF7772EL-200Z13AK

NXP

SAF7772EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

封裝: -

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MC33FS6515NAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

封裝: -

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FB32K142HAT0MLHR

NXP

S32K142 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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