頁 195 - NXP 產品 | 黑森爾電子
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NXP 產品

記錄 26,590
頁  195/950
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BF1101WR,135
NXP

MOSFET N-CH 7V DUAL SOT343R

  • Transistor Type: N-Channel Dual Gate
  • Frequency: 800MHz
  • Gain: -
  • Voltage - Test: 5V
  • Current Rating: 30mA
  • Noise Figure: 1.7dB
  • Current - Test: 12mA
  • Power - Output: -
  • Voltage - Rated: 7V
  • Package / Case: SC-82A, SOT-343
  • Supplier Device Package: CMPAK-4
封裝: SC-82A, SOT-343
庫存3,648
LD6806F/14H,115
NXP

IC REG LINEAR 1.4V 200MA 6-XSON

  • Output Configuration: Positive
  • Output Type: Fixed
  • Number of Regulators: 1
  • Voltage - Input (Max): 5.5V
  • Voltage - Output (Min/Fixed): 1.4V
  • Voltage - Output (Max): -
  • Voltage Dropout (Max): 0.13V @ 200mA
  • Current - Output: 200mA
  • Current - Quiescent (Iq): -
  • Current - Supply (Max): 100µA ~ 250µA
  • PSRR: 55dB (1kHz)
  • Control Features: Enable
  • Protection Features: Over Current, Over Temperature
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 6-XFDFN
  • Supplier Device Package: 6-XSON, SOT886 (1.45x1)
封裝: 6-XFDFN
庫存3,840
GTL2010PW/N,118
NXP

IC XLATR LV BI-DIREC 24-TSSOP

  • Translator Type: Voltage Level
  • Channel Type: Bidirectional
  • Number of Circuits: 1
  • Channels per Circuit: 10
  • Voltage - VCCA: 1V ~ 5.5V
  • Voltage - VCCB: 1V ~ 5.5V
  • Input Signal: -
  • Output Signal: -
  • Output Type: Open Drain
  • Data Rate: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Features: Auto-Direction Sensing
  • Mounting Type: Surface Mount
  • Package / Case: 24-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 24-TSSOP
封裝: 24-TSSOP (0.173", 4.40mm Width)
庫存4,544
N74F257AD,623
NXP

IC DATA SELECTOR/MUX 16-SOIC

  • Type: Multiplexer
  • Circuit: 4 x 2:1
  • Independent Circuits: 1
  • Current - Output High, Low: 3mA, 24mA
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封裝: 16-SOIC (0.154", 3.90mm Width)
庫存2,352
PTN5100BSMP
NXP

IC USB PD PHY TYPE C 20HVQFN

  • Protocol: USB
  • Function: Controller
  • Interface: USB
  • Standards: -
  • Voltage - Supply: -
  • Current - Supply: -
  • Operating Temperature: -20°C ~ 85°C
  • Package / Case: 20-VFQFN Exposed Pad
  • Supplier Device Package: 20-HVQFN (4x4)
封裝: 20-VFQFN Exposed Pad
庫存6,624
HEF4952BT,118
NXP

IC MUX/DEMUX 3X8 16SOIC

  • Switch Circuit: -
  • Multiplexer/Demultiplexer Circuit: 8:2
  • Number of Circuits: 1
  • On-State Resistance (Max): 360 Ohm
  • Channel-to-Channel Matching (ΔRon): 10 Ohm
  • Voltage - Supply, Single (V+): 5 V ~ 15 V
  • Voltage - Supply, Dual (V±): ±15V
  • Switch Time (Ton, Toff) (Max): -
  • -3db Bandwidth: -
  • Charge Injection: -
  • Channel Capacitance (CS(off), CD(off)): 7.5pF
  • Current - Leakage (IS(off)) (Max): 200nA
  • Crosstalk: -
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SO
封裝: 16-SOIC (0.154", 3.90mm Width)
庫存7,584
MC7448VS1250ND
NXP

IC MPU MPC74XX 1.25GHZ 360FCCLGA

  • Core Processor: PowerPC G4
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.25GHz
  • Co-Processors/DSP: Multimedia; SIMD
  • RAM Controllers: -
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.5V, 1.8V, 2.5V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 360-CLGA, FCCLGA
  • Supplier Device Package: 360-FCCLGA (25x25)
封裝: 360-CLGA, FCCLGA
庫存5,072
KMPC8347EZUAJFB
NXP

IC MPU MPC83XX 533MHZ 672TBGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 672-LBGA
  • Supplier Device Package: 672-TBGA (35x35)
封裝: 672-LBGA
庫存3,104
KMPC8343CZQAGD
NXP

IC MPU MPC83XX 400MHZ 620BGA

  • Core Processor: PowerPC e300
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 400MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 620-BBGA Exposed Pad
  • Supplier Device Package: 620-PBGA (29x29)
封裝: 620-BBGA Exposed Pad
庫存5,088
MPC8541CVTAJD
NXP

IC MPU MPC85XX 533MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 533MHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存4,960
hot PK10X256VLQ100
NXP

IC MCU 32BIT 256KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 104
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 37x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存5,088
MPC562CZP66
NXP

IC MCU 32BIT ROMLESS 388PBGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 66MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 64
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 388-BBGA
  • Supplier Device Package: 388-PBGA (27x27)
封裝: 388-BBGA
庫存5,216
MC9S12DG256CCFU
NXP

IC MCU 16BIT 256KB FLASH 80QFP

  • Core Processor: HCS12
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
  • Data Converters: A/D 16x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
封裝: 80-QFP
庫存5,808
LPC1313FHN33/01,55
NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 72MHz
  • Connectivity: I2C, Microwire, SPI, SSI, UART/USART
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 28
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (7x7)
封裝: 32-VQFN Exposed Pad
庫存7,416
hot DSPB56362AG120
NXP

IC DSP 24BIT AUD 120MHZ 144-LQFP

  • Type: Audio Processor
  • Interface: Host Interface, I2C, SAI, SPI
  • Clock Rate: 120MHz
  • Non-Volatile Memory: ROM (126 kB)
  • On-Chip RAM: 42kB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存50,196
UDA1334TS/N1,118
NXP

IC LOW POWER AUDIO DAC 16SSOP

  • Type: DAC, Audio
  • Number of Channels: -
  • Resolution (Bits): 24 b
  • Sampling Rate (Per Second): 100k
  • Data Interface: I2S
  • Voltage Supply Source: Analog and Digital
  • Voltage - Supply: 1.8 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-LSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-SSOP
封裝: 16-LSSOP (0.173", 4.40mm Width)
庫存7,568
MHT2000NR1
NXP

IC AMP RF LDMOS 2450MHZ TO270-16

  • Frequency: 2.45GHz
  • P1dB: -
  • Gain: 30.5dB
  • Noise Figure: -
  • RF Type: -
  • Voltage - Supply: 26 V ~ 32 V
  • Current - Supply: 195mA
  • Test Frequency: 2.45GHz
  • Package / Case: TO-270-16 Variant, Flat Leads
  • Supplier Device Package: TO-272 WB-16
封裝: TO-270-16 Variant, Flat Leads
庫存3,454
MCZ33905DS5EK
NXP

SYSTEM BASIS CHIP LIN 2X 5.0 V

  • Applications: System Basis Chip
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
封裝: -
庫存6,016
SPC5604CAMLL6R
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z0h
  • Core Size: 32-Bit
  • Speed: 64MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 79
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 28x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
封裝: 100-LQFP
庫存4,656
S9S08RNA8W2VTJ
NXP

8-BIT MCU S08 CORE 8KB FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 10x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
封裝: 20-TSSOP (0.173", 4.40mm Width)
庫存6,864
MC9S08MP16VLCR
NXP

8 BIT .25U SGF FLASH

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 51.34MHz
  • Connectivity: I²C, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 25
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 13x12b, D/A 3x5b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存5,664
S9S12ZVL32F0CLC
NXP

MAGNIV 16-BIT MCU S12Z CORE 32

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 19
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存5,600
PN7412AUHN/C300E
NXP

IC SMART CARD READER 64HVQFN

  • Applications: -
  • Core Processor: -
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: -
  • Number of I/O: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存8,244
MCIMX536AVV8CR2
NXP

IMX53 REV 2.1 AUTO

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: 529-FBGA
  • Supplier Device Package: 529-FBGA (19x19)
封裝: 529-FBGA
庫存6,512
MIMXRT555SFAWCR
NXP

IC MCU 32BIT 192KB ROM 141WLCSP

  • Core Processor: ARM® Cortex®-M33
  • Core Size: 32-Bit Dual-Core
  • Speed: 200MHz
  • Connectivity: eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
  • Peripherals: DMA, I2S, LCD, POR, PWM, WDT
  • Number of I/O: 136
  • Program Memory Size: 192KB (192K x 8)
  • Program Memory Type: ROM
  • EEPROM Size: -
  • RAM Size: 5M x 8
  • Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
  • Data Converters: A/D 10x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -20°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 141-XFBGA, WLCSP
  • Supplier Device Package: 141-WLCSP (4.53x4.53)
封裝: -
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NAFE13388B40BSK
NXP

UNIVERSAL 25 V 8-INPUT LOW POWER

  • Number of Bits: 24
  • Number of Channels: 8
  • Power (Watts): 150 mW
  • Voltage - Supply, Analog: 3V ~ 3.6V
  • Voltage - Supply, Digital: 3V ~ 3.6V
  • Package / Case: 64-VFQFN Exposed Pad
  • Supplier Device Package: 64-HVQFN (9x9)
封裝: -
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MIMXRT1176AVM8A
NXP

IC MCU 32BIT EXT MEM 289MAPBGA

  • Core Processor: ARM® Cortex®-M4, Cortex®-M7
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz, 800MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
  • Number of I/O: 13
  • Program Memory Size: -
  • Program Memory Type: External Program Memory
  • EEPROM Size: -
  • RAM Size: 2M x 8
  • Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
  • Data Converters: A/D 20x12b SAR; D/A 1x12b
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-LFBGA (14x14)
封裝: -
庫存753
MFS2621AMDABADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
封裝: -
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