頁 19 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BUK951R6-30E,127	NXP	MOSFET N-CH 30V 120A TO220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 349W (Tc) Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	封裝: TO-220-3	庫存3,888
BUK9623-75A,118	NXP	MOSFET N-CH 75V 53A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 75V Current - Continuous Drain (Id) @ 25°C: 53A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 3120pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 138W (Tc) Rds On (Max) @ Id, Vgs: 22 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	庫存6,944
BF420,112	NXP	TRANS NPN 300V 0.05A SOT54 Transistor Type: NPN Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 300V Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 30mA Current - Collector Cutoff (Max): 10nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V Power - Max: 830mW Frequency - Transition: 60MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	封裝: TO-226-3, TO-92-3 (TO-226AA)	庫存6,144
PDTA143XE,135	NXP	TRANS PREBIAS PNP 150MW SC75 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 4.7k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 150mW Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	封裝: SC-75, SOT-416	庫存3,664
BFT25,215	NXP	TRANS RF NPN 5V 2.3GHZ SOT23-3 Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 5V Frequency - Transition: 2.3GHz Noise Figure (dB Typ @ f): 5.5dB @ 500MHz Gain: - Power - Max: 30mW DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V Current - Collector (Ic) (Max): 6.5mA Operating Temperature: 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	封裝: TO-236-3, SC-59, SOT-23-3	庫存4,736
MC33874BPNA	NXP	IC SW QUAD HI SIDE 35MOHM 24PQFN Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 27 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): - Rds On (Typ): 35 mOhm Input Type: - Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 150°C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12)	封裝: 24-PowerQFN	庫存7,232
TDA18219HN/C1,518	NXP	IC TV SILICON TUNER 40HVQFN Type: Tuner Applications: CATV Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	封裝: 40-VFQFN Exposed Pad	庫存3,168
UJA1075ATW/5V0WD,1	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	庫存4,432
TDA8035HN/C1/S1QL	NXP	IC SMART CARD LP 32HVQFN Applications: - Interface: Analog Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5) Mounting Type: Surface Mount	封裝: 32-VFQFN Exposed Pad	庫存3,856
TJA1028TK/3V3/10,1	NXP	IC TXRX LIN SAE J2602 8HVSON Type: Transceiver Protocol: LIN Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 200mV Data Rate: - Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	封裝: 8-VDFN Exposed Pad	庫存2,192
P5020NXE1TNB	NXP	IC MPU Q OR IQ 2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (5), 10 Gbps (1) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存8,436
MPC8535CVTAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (1) USB: USB 2.0 (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存3,344
KMPC8541PXAPF	NXP	IC MPU MPC85XX 833MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 833MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存3,680
MC908LK24CPKE	NXP	IC MCU 8BIT 24KB FLASH 80LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Number of I/O: 40 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存6,640
MC9S12XDT256MAG	NXP	IC MCU 16BIT 256KB FLASH 144LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 24x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存7,764
MC9S12C96CPBE	NXP	IC MCU 16BIT 96KB FLASH 52LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 35 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LQFP Supplier Device Package: 52-LQFP (10x10)	封裝: 52-LQFP	庫存5,856
MKL16Z256VLH4	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存46,260
DSP56303AG100R2	NXP	IC DSP 24BIT 100MHZ 144-LQFP Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 100MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存4,064
LM75BTP,147	NXP	SENSOR TEMPERATURE I2C 8HWSON Sensor Type: Digital, Local Sensing Temperature - Local: -55°C ~ 125°C Sensing Temperature - Remote: - Output Type: I2C Voltage - Supply: 2.8 V ~ 5.5 V Resolution: 11 b Features: Output Switch, Programmable Limit, Shutdown Mode Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: -25°C ~ 100°C (-55°C ~ 125°C) Operating Temperature: -55°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	封裝: 8-WFDFN Exposed Pad	庫存600,000
TEA6849H/V1,557	NXP	IC CAR RADIO TUNER 80-LQFP Frequency: AM, FM, WB Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM Applications: AM/FM Radio Receiver Current - Receiving: 88mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 7.8 V ~ 9.2 V Operating Temperature: -40°C ~ 85°C Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12)	封裝: 80-LQFP	庫存3,204
MCIMX6X3CVN08AC	NXP	I.MX 6SX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 800MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -40°C ~ 105°C (TA) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (17x17)	封裝: 400-LFBGA	庫存7,984
SPC5602BAMLL4R	NXP	32BIT 256KF 100LD 48MHZ Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存3,680
LPC54S016JBD100E	NXP	32-BIT ARM CORTEX-M4 Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,472
SPC5603BK0VLH4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存5,152
DSPB56721CAF	NXP	DSP 24BIT AUD 200MHZ 80-LQFP Type: Audio Processor Interface: Host Interface, I²C, SAI, SPI Clock Rate: 200MHz Non-Volatile Memory: External On-Chip RAM: 744kB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 80-QFP Supplier Device Package: 80-LQFP (14x14)	封裝: 80-QFP	庫存6,928
SAF4000EL-101S23BK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
TJA1145ATK-0Z	NXP	IC TRANSCEIVER FULL 1/1 14HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Full Receiver Hysteresis: 800 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	封裝: -	庫存16,143
TJA1057CT-0Z	NXP	IC TRANSCEIVER HI SPEED 8SO Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300 mV Data Rate: 5Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	封裝: -	Request a Quote

BUK951R6-30E,127

NXP

MOSFET N-CH 30V 120A TO220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

封裝: TO-220-3

庫存3,888

BUK9623-75A,118

NXP

MOSFET N-CH 75V 53A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 75V
Current - Continuous Drain (Id) @ 25°C: 53A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 3120pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 138W (Tc)
Rds On (Max) @ Id, Vgs: 22 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

封裝: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

庫存6,944

BF420,112

NXP

TRANS NPN 300V 0.05A SOT54

Transistor Type: NPN
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 300V
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 30mA
Current - Collector Cutoff (Max): 10nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 25mA, 20V
Power - Max: 830mW
Frequency - Transition: 60MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

封裝: TO-226-3, TO-92-3 (TO-226AA)

庫存6,144

PDTA143XE,135

NXP

TRANS PREBIAS PNP 150MW SC75

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 4.7k
Resistor - Emitter Base (R2) (Ohms): 10k
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 150mW
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

封裝: SC-75, SOT-416

庫存3,664

BFT25,215

NXP

TRANS RF NPN 5V 2.3GHZ SOT23-3

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 5V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Gain: -
Power - Max: 30mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Current - Collector (Ic) (Max): 6.5mA
Operating Temperature: 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

封裝: TO-236-3, SC-59, SOT-23-3

庫存4,736

MC33874BPNA

NXP

IC SW QUAD HI SIDE 35MOHM 24PQFN

Switch Type: General Purpose
Number of Outputs: 4
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 6 V ~ 27 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): -
Rds On (Typ): 35 mOhm
Input Type: -
Features: Slew Rate Controlled, Watchdog Timer
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 150°C (TJ)
Package / Case: 24-PowerQFN
Supplier Device Package: 24-PQFN (12x12)

封裝: 24-PowerQFN

庫存7,232

TDA18219HN/C1,518

NXP

IC TV SILICON TUNER 40HVQFN

Type: Tuner
Applications: CATV
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

封裝: 40-VFQFN Exposed Pad

庫存3,168

UJA1075ATW/5V0WD,1

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

庫存4,432

TDA8035HN/C1/S1QL

NXP

IC SMART CARD LP 32HVQFN

Applications: -
Interface: Analog
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)
Mounting Type: Surface Mount

封裝: 32-VFQFN Exposed Pad

庫存3,856

TJA1028TK/3V3/10,1

NXP

IC TXRX LIN SAE J2602 8HVSON

Type: Transceiver
Protocol: LIN
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 200mV
Data Rate: -
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

封裝: 8-VDFN Exposed Pad

庫存2,192

P5020NXE1TNB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (5), 10 Gbps (1)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存8,436

MPC8535CVTAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (1)
USB: USB 2.0 (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存3,344

KMPC8541PXAPF

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 833MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存3,680

MC908LK24CPKE

NXP

IC MCU 8BIT 24KB FLASH 80LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Number of I/O: 40
Program Memory Size: 24KB (24K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存6,640

MC9S12XDT256MAG

NXP

IC MCU 16BIT 256KB FLASH 144LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 24x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存7,764

MC9S12C96CPBE

NXP

IC MCU 16BIT 96KB FLASH 52LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 35
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LQFP
Supplier Device Package: 52-LQFP (10x10)

封裝: 52-LQFP

庫存5,856

MKL16Z256VLH4

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存46,260

DSP56303AG100R2

NXP

IC DSP 24BIT 100MHZ 144-LQFP

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 100MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存4,064

LM75BTP,147

NXP

SENSOR TEMPERATURE I2C 8HWSON

Sensor Type: Digital, Local
Sensing Temperature - Local: -55°C ~ 125°C
Sensing Temperature - Remote: -
Output Type: I2C
Voltage - Supply: 2.8 V ~ 5.5 V
Resolution: 11 b
Features: Output Switch, Programmable Limit, Shutdown Mode
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Operating Temperature: -55°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Supplier Device Package: 8-HWSON (2x3)

封裝: 8-WFDFN Exposed Pad

庫存600,000

TEA6849H/V1,557

NXP

IC CAR RADIO TUNER 80-LQFP

Frequency: AM, FM, WB
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM
Applications: AM/FM Radio Receiver
Current - Receiving: 88mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 7.8 V ~ 9.2 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (12x12)

封裝: 80-LQFP

庫存3,204

MCIMX6X3CVN08AC

NXP

I.MX 6SX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 800MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (17x17)

封裝: 400-LFBGA

庫存7,984

SPC5602BAMLL4R

NXP

32BIT 256KF 100LD 48MHZ

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存3,680

LPC54S016JBD100E

NXP

32-BIT ARM CORTEX-M4

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,472

SPC5603BK0VLH4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存5,152

DSPB56721CAF

NXP

DSP 24BIT AUD 200MHZ 80-LQFP

Type: Audio Processor
Interface: Host Interface, I²C, SAI, SPI
Clock Rate: 200MHz
Non-Volatile Memory: External
On-Chip RAM: 744kB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 80-QFP
Supplier Device Package: 80-LQFP (14x14)

封裝: 80-QFP

庫存6,928

SAF4000EL-101S23BK

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

Request a Quote

TJA1145ATK-0Z

NXP

IC TRANSCEIVER FULL 1/1 14HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Full
Receiver Hysteresis: 800 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

封裝: -

庫存16,143

TJA1057CT-0Z

NXP

IC TRANSCEIVER HI SPEED 8SO

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 300 mV
Data Rate: 5Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

封裝: -

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