頁 114 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
PHT11N06LT,135	NXP	MOSFET N-CH 55V 4.9A SOT223 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta) Drive Voltage (Max Rds On, Min Rds On): 5V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 17nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 1400pF @ 25V Vgs (Max): ±13V FET Feature: - Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc) Rds On (Max) @ Id, Vgs: 40 mOhm @ 5A, 5V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: SOT-223 Package / Case: TO-261-4, TO-261AA	封裝: TO-261-4, TO-261AA	庫存6,672
TDA3681TH/N2S,518	NXP	IC REG MULTIPLE VOLTAGE 20HSOP Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	庫存5,296
N74F543N,602	NXP	IC TRANSCVR TRI-ST 8BIT 24DIP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 3mA, 24mA; 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 24-DIP (0.300", 7.62mm) Supplier Device Package: 24-DIP	封裝: 24-DIP (0.300", 7.62mm)	庫存3,312
74ALVT16241DGG,118	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存6,592
PCA9674PW/S911,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	封裝: 16-TSSOP (0.173", 4.40mm Width)	庫存5,792
KMPC8548HXAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存5,184
MPC8547EVUAUJ	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存4,848
MPC8536BVJAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存6,576
P87C51FC-4A,512	NXP	IC MCU 8BIT 32KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR, PWM Number of I/O: 32 Program Memory Size: 32KB (32K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存6,144
MC68HC908QY4CDW	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存4,800
MCF51EM128CLL	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: Coldfire V1 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Number of I/O: 63 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	封裝: 100-LQFP	庫存6,800
SPC5602DF1VLH4	NXP	IC MCU 32BIT 256KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存3,488
PCKV857ADGG,512	NXP	IC CLK BUF DDR 250MHZ 1CIRC PLL: Yes Main Purpose: Memory, DDR, SDRAM Input: SSTL-2 Output: SSTL-2 Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: Yes/Yes Frequency - Max: 250MHz Voltage - Supply: 2.3 V ~ 2.7 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存2,288
NCK2983AHN/T2CY	NXP	IC TRANSCEIVER 3CH 48HVQFN Type: TxRx + MCU RF Family/Standard: - Protocol: - Modulation: ASK, FSK Frequency: 315MHz, 433MHz, 868MHz, 915MHz Data Rate (Max): - Power - Output: - Sensitivity: -123dBm Memory Size: 32kB Flash, 4kB RAM Serial Interfaces: - GPIO: - Voltage - Supply: 2.1 V ~ 5.5 V Current - Receiving: 17mA Current - Transmitting: - Operating Temperature: -40°C ~ 125°C Package / Case: 48-VFQFN Exposed Pad	封裝: 48-VFQFN Exposed Pad	庫存6,012
JN5168/001,518	NXP	IC RF TXRX+MCU 802.15.4 40-VFQFN Type: TxRx + MCU RF Family/Standard: 802.15.4 Protocol: ZigbeePRO? Modulation: O-QPSK Frequency: 2.4GHz Data Rate (Max): 1Mbps Power - Output: 2.5dBm Sensitivity: -96dBm Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Serial Interfaces: I2C, JTAG, SPI, UART GPIO: 20 Voltage - Supply: 2 V ~ 3.6 V Current - Receiving: 17mA Current - Transmitting: 15.3mA Operating Temperature: -40°C ~ 125°C Package / Case: 40-VFQFN Exposed Pad	封裝: 40-VFQFN Exposed Pad	庫存3,942
OM7614/BGM1011	NXP	EVAL BOARD FOR BGM1011 Type: Amplifier Frequency: 0Hz ~ 4GHz For Use With/Related Products: BGM1011 Supplied Contents: Board	封裝: -	庫存8,748
T2080NSE8T1B	NXP	QORIQ 64B POWER ARCH8X 1.8GHZ Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存6,688
LS1043ASE7MNLA	NXP	QORIQ 4XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存5,008
SPC5603BK0MLQ6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存5,392
FS32R274KCK2MMM	NXP	NXP 32 BIT MCU 2M FLASH 1.5MB Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Speed: 180MHz, 240MHz Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 1.5M x 8 Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	封裝: 257-LFBGA	庫存5,568
S9S12GN16J1VTJ	NXP	IC MCU 16BIT 16KB FLASH 20TSSOP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: -	Request a Quote
SAF4000EL-101Z524Y	NXP	SAF4000EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LPC5514JBD100Y	NXP	IC MCU 32BIT 128KB FLSH 100HLQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	封裝: -	Request a Quote
MIMX8MN3DUCJZAA	NXP	NANO SOLOLITE I.MX 8M LFBGA486 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote
LS1023ACE9PQB	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A53 Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: - RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) SATA: SATA 6Gbps (1) USB: USB 3.0 + PHY (3) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FBGA (23x23)	封裝: -	Request a Quote
S912ZVL64AVLC	NXP	S12Z CPU, 64K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: -	Request a Quote
MIMXRT106VDVL6B	NXP	IC MCU Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存1,368
TDA10028HN-C1-551	NXP	IC VIDEO SILICON TUNER Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	Request a Quote

PHT11N06LT,135

NXP

MOSFET N-CH 55V 4.9A SOT223

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 4.9A (Ta)
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 17nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 1400pF @ 25V
Vgs (Max): ±13V
FET Feature: -
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 40 mOhm @ 5A, 5V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: SOT-223
Package / Case: TO-261-4, TO-261AA

封裝: TO-261-4, TO-261AA

庫存6,672

TDA3681TH/N2S,518

NXP

IC REG MULTIPLE VOLTAGE 20HSOP

Applications: Ignition Buffer, Regulator
Current - Supply: 110µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

庫存5,296

N74F543N,602

NXP

IC TRANSCVR TRI-ST 8BIT 24DIP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 24-DIP (0.300", 7.62mm)
Supplier Device Package: 24-DIP

封裝: 24-DIP (0.300", 7.62mm)

庫存3,312

74ALVT16241DGG,118

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存6,592

PCA9674PW/S911,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

封裝: 16-TSSOP (0.173", 4.40mm Width)

庫存5,792

KMPC8548HXAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存5,184

MPC8547EVUAUJ

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存4,848

MPC8536BVJAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存6,576

P87C51FC-4A,512

NXP

IC MCU 8BIT 32KB OTP 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Number of I/O: 32
Program Memory Size: 32KB (32K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存6,144

MC68HC908QY4CDW

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存4,800

MCF51EM128CLL

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: Coldfire V1
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Number of I/O: 63
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: 100-LQFP

庫存6,800

SPC5602DF1VLH4

NXP

IC MCU 32BIT 256KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存3,488

PCKV857ADGG,512

NXP

IC CLK BUF DDR 250MHZ 1CIRC

PLL: Yes
Main Purpose: Memory, DDR, SDRAM
Input: SSTL-2
Output: SSTL-2
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/Yes
Frequency - Max: 250MHz
Voltage - Supply: 2.3 V ~ 2.7 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存2,288

NCK2983AHN/T2CY

NXP

IC TRANSCEIVER 3CH 48HVQFN

Type: TxRx + MCU
RF Family/Standard: -
Protocol: -
Modulation: ASK, FSK
Frequency: 315MHz, 433MHz, 868MHz, 915MHz
Data Rate (Max): -
Power - Output: -
Sensitivity: -123dBm
Memory Size: 32kB Flash, 4kB RAM
Serial Interfaces: -
GPIO: -
Voltage - Supply: 2.1 V ~ 5.5 V
Current - Receiving: 17mA
Current - Transmitting: -
Operating Temperature: -40°C ~ 125°C
Package / Case: 48-VFQFN Exposed Pad

封裝: 48-VFQFN Exposed Pad

庫存6,012

JN5168/001,518

NXP

IC RF TXRX+MCU 802.15.4 40-VFQFN

Type: TxRx + MCU
RF Family/Standard: 802.15.4
Protocol: ZigbeePRO?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 1Mbps
Power - Output: 2.5dBm
Sensitivity: -96dBm
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Serial Interfaces: I2C, JTAG, SPI, UART
GPIO: 20
Voltage - Supply: 2 V ~ 3.6 V
Current - Receiving: 17mA
Current - Transmitting: 15.3mA
Operating Temperature: -40°C ~ 125°C
Package / Case: 40-VFQFN Exposed Pad

封裝: 40-VFQFN Exposed Pad

庫存3,942

OM7614/BGM1011

NXP

EVAL BOARD FOR BGM1011

Type: Amplifier
Frequency: 0Hz ~ 4GHz
For Use With/Related Products: BGM1011
Supplied Contents: Board

封裝: -

庫存8,748

T2080NSE8T1B

NXP

QORIQ 64B POWER ARCH8X 1.8GHZ

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,688

LS1043ASE7MNLA

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存5,008

SPC5603BK0MLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存5,392

FS32R274KCK2MMM

NXP

NXP 32 BIT MCU 2M FLASH 1.5MB

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit Tri-Core
Speed: 180MHz, 240MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封裝: 257-LFBGA

庫存5,568

S9S12GN16J1VTJ

NXP

IC MCU 16BIT 16KB FLASH 20TSSOP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: -

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SAF4000EL-101Z524Y

NXP

SAF4000EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LPC5514JBD100Y

NXP

IC MCU 32BIT 128KB FLSH 100HLQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

封裝: -

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MIMX8MN3DUCJZAA

NXP

NANO SOLOLITE I.MX 8M LFBGA486

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

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LS1023ACE9PQB

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A53

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.4GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1)
SATA: SATA 6Gbps (1)
USB: USB 3.0 + PHY (3)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Boot Security
Package / Case: 780-BFBGA, FCBGA
Supplier Device Package: 780-FBGA (23x23)

封裝: -

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S912ZVL64AVLC

NXP

S12Z CPU, 64K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: -

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MIMXRT106VDVL6B

NXP

IC MCU

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存1,368

TDA10028HN-C1-551

NXP

IC VIDEO SILICON TUNER

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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