頁 109 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
MRF1K50GNR5	NXP	WIDEBAND RF POWER LDMOS TRANSIST Transistor Type: LDMOS Frequency: 1.8MHz ~ 500MHz Gain: 23dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: - Power - Output: 1500W Voltage - Rated: 50V Package / Case: OM-1230G-4L Supplier Device Package: OM-1230G-4L	封裝: OM-1230G-4L	庫存6,272
PDTA144VK,115	NXP	TRANS PREBIAS PNP 250MW SMT3 Transistor Type: PNP - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): 10k DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存7,856
74HC273N,652	NXP	IC D-TYPE POS TRG SNGL 20DIP Function: Master Reset Type: D-Type Output Type: Non-Inverted Number of Elements: 1 Number of Bits per Element: 8 Clock Frequency: 122MHz Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Iq): 8µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 20-DIP (0.300", 7.62mm)	封裝: 20-DIP (0.300", 7.62mm)	庫存7,648
74LVC126APW/DG,118	NXP	IC BUFF DVR TRI-ST QD 14TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 1 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 14-TSSOP	封裝: 14-TSSOP (0.173", 4.40mm Width)	庫存6,512
SC68C752BIBS,151	NXP	IC UART DUAL W/FIFO 32-HVQFN Features: - Number of Channels: 2, DUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	封裝: 32-VFQFN Exposed Pad	庫存3,984
T2080NXN7MQB	NXP	IC SOC 64BIT 8X1.2GHZ 896FCBGA Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 896-FBGA, FCBGA Supplier Device Package: 896-FCPBGA (25x25)	封裝: 896-FBGA, FCBGA	庫存6,928
MPC8323ECZQADDC	NXP	IC MPU MPC83XX 266MHZ 516BGA Core Processor: PowerPC e300c2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	封裝: 516-BBGA	庫存2,736
P5021NSE7TMC	NXP	IC SOC 64BIT 2X1.8GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (10), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.1V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	封裝: 1295-BBGA, FCBGA	庫存9,012
P2020NSN2MHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存7,200
S9S12VR64F2VLC	NXP	IC MCU 16BIT 64KB FLASH 32LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 2x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存14,592
S9S08DZ48F1MLC	NXP	IC MCU 8BIT 48KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 3K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存2,912
P89LPC936FA,529	NXP	IC MCU 8BIT 16KB FLASH 28PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x8b; D/A 2x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-LCC (J-Lead) Supplier Device Package: 28-PLCC (11.51x11.51)	封裝: 28-LCC (J-Lead)	庫存2,448
MCHC908JW32FAE	NXP	IC MCU 8BIT 32KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SPI, USB Peripherals: LED, LVD, POR, PWM Number of I/O: 29 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存13,224
P89C51RB2BA/01,512	NXP	IC MCU 8BIT 16KB FLASH 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	封裝: 44-LCC (J-Lead)	庫存4,064
MCHC11F1VFNE3	NXP	IC MCU 8BIT ROMLESS 68PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 3MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	封裝: 68-LCC (J-Lead)	庫存2,560
SPC5643LFF2MMM1	NXP	IC MCU 32BIT 1MB FLASH 257MAPBGA Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CAN, FlexRay, LIN, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	封裝: 257-LFBGA	庫存4,848
S9S08AW32E5MFUE	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存6,656
MKE06Z64VLH4	NXP	IC MCU 32BIT 64KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: CAN, I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 58 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	封裝: 64-LQFP	庫存7,056
MSC8144ETVT800B	NXP	ENCRYPTION PACSUN R2.1 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	封裝: 783-BBGA, FCBGA	庫存2,320
MMA6823AKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±50g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封裝: 16-QFN Exposed Pad	庫存7,326
MMA5148NDIKGWR2	NXP	ACCELEROMETER PSI5 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,978
MMA1220KEGR2	NXP	ACCELEROMETER 8G ANALOG 16SOIC Type: Analog Axis: Z Acceleration Range: ±8g Sensitivity (LSB/g): - Sensitivity (mV/g): 250 Bandwidth: 250Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	封裝: 16-SOIC (0.295", 7.50mm Width)	庫存6,930
MC34PF1510A6EP	NXP	PF1510 Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Current - Supply: - Voltage - Supply: 3.8 V ~ 7 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-QFN (5x5)	封裝: 40-VFQFN Exposed Pad	庫存4,624
MWCT1013AVLH	NXP	15W MULTI-COIL AUTO PREMIUM L Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,272
T1014NXN7KQA	NXP	QORIQ 1XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,432
MCIMX6X1EVK10AC	NXP	I.MX 6SLX ROM PERF ENHAN Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 200MHz, 1GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Package / Case: 400-LFBGA Supplier Device Package: 400-MAPBGA (14x14)	封裝: 400-LFBGA	庫存2,240
MKL27Z128VFM4	NXP	KINETIS L 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I²C, SPI, UART/USART, USB Peripherals: DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	封裝: 32-UFQFN Exposed Pad	庫存8,724
PSMN2R9-30MLC-GFX	NXP	PSMN2R9-30MLC/GFX FET Type: - Technology: - Drain to Source Voltage (Vdss): - Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: - Supplier Device Package: - Package / Case: -	封裝: -	Request a Quote

MRF1K50GNR5

NXP

WIDEBAND RF POWER LDMOS TRANSIST

Transistor Type: LDMOS
Frequency: 1.8MHz ~ 500MHz
Gain: 23dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 1500W
Voltage - Rated: 50V
Package / Case: OM-1230G-4L
Supplier Device Package: OM-1230G-4L

封裝: OM-1230G-4L

庫存6,272

PDTA144VK,115

NXP

TRANS PREBIAS PNP 250MW SMT3

Transistor Type: PNP - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): 10k
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 5mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 250mW
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存7,856

74HC273N,652

NXP

IC D-TYPE POS TRG SNGL 20DIP

Function: Master Reset
Type: D-Type
Output Type: Non-Inverted
Number of Elements: 1
Number of Bits per Element: 8
Clock Frequency: 122MHz
Max Propagation Delay @ V, Max CL: 26ns @ 6V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2 V ~ 6 V
Current - Quiescent (Iq): 8µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)

封裝: 20-DIP (0.300", 7.62mm)

庫存7,648

74LVC126APW/DG,118

NXP

IC BUFF DVR TRI-ST QD 14TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 1
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 14-TSSOP

封裝: 14-TSSOP (0.173", 4.40mm Width)

庫存6,512

SC68C752BIBS,151

NXP

IC UART DUAL W/FIFO 32-HVQFN

Features: -
Number of Channels: 2, DUART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

封裝: 32-VFQFN Exposed Pad

庫存3,984

T2080NXN7MQB

NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

Core Processor: PowerPC e6500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 896-FBGA, FCBGA
Supplier Device Package: 896-FCPBGA (25x25)

封裝: 896-FBGA, FCBGA

庫存6,928

MPC8323ECZQADDC

NXP

IC MPU MPC83XX 266MHZ 516BGA

Core Processor: PowerPC e300c2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

封裝: 516-BBGA

庫存2,736

P5021NSE7TMC

NXP

IC SOC 64BIT 2X1.8GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.8GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (10), 10 Gbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.1V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

封裝: 1295-BBGA, FCBGA

庫存9,012

P2020NSN2MHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存7,200

S9S12VR64F2VLC

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存14,592

S9S08DZ48F1MLC

NXP

IC MCU 8BIT 48KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 3K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存2,912

P89LPC936FA,529

NXP

IC MCU 8BIT 16KB FLASH 28PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: A/D 8x8b; D/A 2x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-LCC (J-Lead)
Supplier Device Package: 28-PLCC (11.51x11.51)

封裝: 28-LCC (J-Lead)

庫存2,448

MCHC908JW32FAE

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Number of I/O: 29
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存13,224

P89C51RB2BA/01,512

NXP

IC MCU 8BIT 16KB FLASH 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

庫存4,064

MCHC11F1VFNE3

NXP

IC MCU 8BIT ROMLESS 68PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 3MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 30
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

封裝: 68-LCC (J-Lead)

庫存2,560

SPC5643LFF2MMM1

NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 120MHz
Connectivity: CAN, FlexRay, LIN, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封裝: 257-LFBGA

庫存4,848

S9S08AW32E5MFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存6,656

MKE06Z64VLH4

NXP

IC MCU 32BIT 64KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CAN, I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 58
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

庫存7,056

MSC8144ETVT800B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

封裝: 783-BBGA, FCBGA

庫存2,320

MMA6823AKGWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±50g
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封裝: 16-QFN Exposed Pad

庫存7,326

MMA5148NDIKGWR2

NXP

ACCELEROMETER PSI5 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,978

MMA1220KEGR2

NXP

ACCELEROMETER 8G ANALOG 16SOIC

Type: Analog
Axis: Z
Acceleration Range: ±8g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 250
Bandwidth: 250Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

封裝: 16-SOIC (0.295", 7.50mm Width)

庫存6,930

MC34PF1510A6EP

NXP

PF1510

Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply: -
Voltage - Supply: 3.8 V ~ 7 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-QFN (5x5)

封裝: 40-VFQFN Exposed Pad

庫存4,624

MWCT1013AVLH

NXP

15W MULTI-COIL AUTO PREMIUM L

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,272

T1014NXN7KQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,432

MCIMX6X1EVK10AC

NXP

I.MX 6SLX ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 200MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Package / Case: 400-LFBGA
Supplier Device Package: 400-MAPBGA (14x14)

封裝: 400-LFBGA

庫存2,240

MKL27Z128VFM4

NXP

KINETIS L 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I²C, SPI, UART/USART, USB
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-UFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

封裝: 32-UFQFN Exposed Pad

庫存8,724

PSMN2R9-30MLC-GFX

NXP

PSMN2R9-30MLC/GFX

FET Type: -
Technology: -
Drain to Source Voltage (Vdss): -
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: -
Supplier Device Package: -
Package / Case: -

封裝: -

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