圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Frequency | Standards | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC NFC TAG TYPE 2 504BYTE IC
|
封裝: Die |
庫存7,830 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 75°C | Die | Die |
||
NXP |
TRANSPONDER RFIC HITAG S UNCASED
|
封裝: Die |
庫存3,618 |
|
100kHz ~ 150kHz | - | - | 3.5V | -25°C ~ 85°C | Die | Die |
||
NXP |
IC I-CODE SLI SOT1122
|
封裝: Die |
庫存3,420 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | - |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
封裝: Die |
庫存7,794 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC TRANSPONDER RFID HITAG
|
封裝: Die |
庫存7,488 |
|
100kHz ~ 150kHz | ISO 11784, ISO 11785 | - | 4 V ~ 6 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
封裝: - |
庫存6,948 |
|
- | - | - | - | - | - | - |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
封裝: Die |
庫存2,574 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC I-CODE SLI UNCASED FOIL
|
封裝: Die |
庫存2,322 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC TRANSPONDER RFID HITAG
|
封裝: Die |
庫存4,266 |
|
100kHz ~ 150kHz | ISO 11784, ISO 11785 | - | 4 V ~ 6 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC NFC TAG TYPE 2 144BYTE IC
|
封裝: Die |
庫存4,536 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC I-CODE ILT-M UNCASED WAFER
|
封裝: Die |
庫存8,226 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC MIFARE ULTRALIGHT EV1 UNCASED
|
封裝: Die |
庫存2,412 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC MIFARE ULTRALIGHT EV1 UNCASED
|
封裝: Die |
庫存3,096 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC SMART TAG NFC TYPE2 UNCASED
|
封裝: Die |
庫存6,732 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Wafer |
||
NXP |
IC SMART TAG NFC TYPE2 UNCASED
|
封裝: Die |
庫存7,038 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Wafer |
||
NXP |
IC I-CODE ILT UNCASED WAFER
|
封裝: Die |
庫存2,376 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC I-CODE ILT-M UNCASED WAFER
|
封裝: Die |
庫存7,650 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC I-CODE ILT-M UNCASED WAFER
|
封裝: Die |
庫存7,650 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
TRANSPONDER RFIC HITAG RO64 DIE
|
封裝: Die |
庫存8,910 |
|
100kHz ~ 150kHz | - | - | 5V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC MIFARE ULTRALIGHT EV1 UNCASED
|
封裝: Die |
庫存2,466 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC MIFARE ULTRALIGHT EV1 UNCASED
|
封裝: Die |
庫存3,564 |
|
13.56MHz | ISO 14443, MIFARE | - | - | -25°C ~ 70°C | Die | Die |
||
NXP |
IC I-CODE ILT UNCASED WAFER
|
封裝: Die |
庫存3,888 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC I-CODE ILT UNCASED WAFER
|
封裝: Die |
庫存3,294 |
|
13.56MHz | ISO 15693, ISO 18000-3 | - | 1.5 V ~ 1.7 V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
TRANSPONDER RFIC HITAG RO64 DIE
|
封裝: Die |
庫存6,498 |
|
100kHz ~ 150kHz | - | - | 5V | -40°C ~ 85°C | Die | Die |
||
NXP |
IC SMART TAG NFC TYPE2 UNCASED
|
封裝: Die |
庫存7,902 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Wafer |
||
NXP |
IC SMART TAG NFC TYPE2 UNCASED
|
封裝: Die |
庫存3,132 |
|
13.56MHz | ISO 14443 | - | - | -25°C ~ 70°C | Die | Wafer |
||
NXP |
IC U-CODE G2IL+ DIE WAFER
|
封裝: Die |
庫存7,308 |
|
840MHz ~ 960MHz | EPC | - | 1.8V | -40°C ~ 85°C | Die | Wafer |
||
NXP |
IC UCODE G2XL UNCASED FOIL
|
封裝: Die |
庫存2,556 |
|
840MHz ~ 960MHz | EPC | - | 1.8V | -40°C ~ 85°C | Die | Die |