圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC DDR TERM W/STANDBY 8-SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
庫存4,032 |
|
14mA | 1.6 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) Exposed Pad | 8-HSO |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
封裝: 206-LFBGA |
庫存2,000 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (13x13) |
||
NXP |
IC REG MULTIPLE VOLTAGE DBS23P
|
封裝: 23-SIP Formed Leads |
庫存7,392 |
|
300µA | 9 V ~ 18 V | -40°C ~ 85°C | Through Hole | 23-SIP Formed Leads | DBS23P |
||
NXP |
IC SBC W/PWR SUPPLY 64LQFP
|
封裝: 64-LQFP Exposed Pad |
庫存7,840 |
|
- | 5.2 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
NXP |
IC SBC W/PWR SUPPLY 64LQFP
|
封裝: 64-LQFP Exposed Pad |
庫存4,224 |
|
- | 5.2 V ~ 20 V | -40°C ~ 125°C | Surface Mount | 64-LQFP Exposed Pad | 64-LQFP (10x10) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存4,256 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
封裝: 206-LFBGA |
庫存15,000 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (8x8) |
||
NXP |
IC POWER MANAGEMENT 206MAPBGA
|
封裝: 206-LFBGA |
庫存3,632 |
|
- | 1.8 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 206-LFBGA | 206-MAPBGA (8x8) |
||
NXP |
IC MULTI COIL 5W 5V 32QFN
|
封裝: - |
庫存5,712 |
|
- | - | - | - | - | - |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存5,248 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC RECEIVER 16KB FLASH 32QFN
|
封裝: 36-UFBGA, WLCSP |
庫存4,640 |
|
120mA | 3.5 V ~ 20 V | -40°C ~ 85°C | Surface Mount | 36-UFBGA, WLCSP | 36-WLCSP (3.07x2.98) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存6,064 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存5,248 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存3,408 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
封裝: 139-TFBGA |
庫存2,112 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
封裝: 139-TFBGA |
庫存17,964 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 186BGA
|
封裝: 186-LFBGA |
庫存6,224 |
|
- | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
封裝: 139-TFBGA |
庫存3,824 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC PWR MGMT I.MX35/51 186BGA
|
封裝: 186-LFBGA |
庫存3,360 |
|
- | - | -40°C ~ 85°C | Surface Mount | 186-LFBGA | 186-PBGA (12x12) |
||
NXP |
IC PWR MGMT I.MX35/51 139BGA
|
封裝: 139-TFBGA |
庫存14,856 |
|
- | - | -40°C ~ 85°C | Surface Mount | 139-TFBGA | 139-PBGA (7x7) |
||
NXP |
IC SBC HIGH SPEED CAN 5V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存3,792 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC SWITCH HIGH SIDE 32SOIC
|
封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
庫存6,224 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-SSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC EP |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存2,016 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC PWR MGMT IMX50/53 130MAPBGA
|
封裝: 130-LFBGA |
庫存3,792 |
|
370µA | 3 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 130-LFBGA | 130-MAPBGA (8x8) |
||
NXP |
IC ENGINE CTRL SW/DVR 54-SOIC
|
封裝: 54-SSOP (0.295", 7.50mm Width) Exposed Pad |
庫存3,152 |
|
10mA | 5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 54-SSOP (0.295", 7.50mm Width) Exposed Pad | 54-SOICW-EP |
||
NXP |
IC CTRL SMALL ENG 2CYL 48LQFP
|
封裝: 48-LQFP Exposed Pad |
庫存4,992 |
|
10mA | 4.5 V ~ 36 V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
||
NXP |
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
封裝: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad |
庫存7,616 |
|
2mA | 5.5 V ~ 28 V | -40°C ~ 125°C | Surface Mount | 32-BSSOP (0.295", 7.50mm Width) Exposed Pad | 32-SOIC |
||
NXP |
IC REG MULTIPLE VOLTAGE 20HSOP
|
封裝: 20-SOIC (0.433", 11.00mm Width) Exposed Pad |
庫存5,456 |
|
110µA | 9.5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.433", 11.00mm Width) Exposed Pad | 20-HSOP |