頁 481 - Molex, LLC 產品 - 矩形連接器 - 排針座、公引腳

0879331618

Molex, LLC

SLIM-GRID HEADER, 16 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 16
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存7,038

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

16

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

15µin (0.38µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331617

Molex, LLC

SLIM-GRID HEADER, 16 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 16
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存7,776

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

16

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

30µin (0.76µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331616

Molex, LLC

SLIM-GRID HEADER, 16 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 16
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存5,400

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

16

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Tin

100µin (2.54µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331615

Molex, LLC

SLIM-GRID HEADER, 16 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 16
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Gold
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存6,336

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

16

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Gold

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331423

Molex, LLC

SLIM-GRID HEADER, 14 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 14
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存2,952

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

14

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331418

Molex, LLC

SLIM-GRID HEADER, 14 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 14
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存5,436

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

14

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

15µin (0.38µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331417

Molex, LLC

SLIM-GRID HEADER, 14 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 14
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存4,068

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

14

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

30µin (0.76µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331416

Molex, LLC

SLIM-GRID HEADER, 14 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 14
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存2,304

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

14

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Tin

100µin (2.54µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331415

Molex, LLC

SLIM-GRID HEADER, 14 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 14
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Gold
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存3,834

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

14

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Gold

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331223

Molex, LLC

SLIM-GRID HEADER, 12 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 12
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存7,542

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

12

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331222

Molex, LLC

SLIM-GRID HEADER, 12 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 12
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存7,686

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

12

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

15µin (0.38µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331221

Molex, LLC

SLIM-GRID HEADER, 12 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 12
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存5,382

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

12

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

30µin (0.76µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879331220

Molex, LLC

SLIM-GRID HEADER, 12 CIRCUITS, S

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 12
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存4,392

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

12

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Tin

100µin (2.54µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330823

Molex, LLC

SLIM-GRID HEADER, 8 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存6,192

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

8

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330818

Molex, LLC

SLIM-GRID HEADER, 8 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存2,430

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

8

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

15µin (0.38µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330817

Molex, LLC

SLIM-GRID HEADER, 8 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存3,996

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

8

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

30µin (0.76µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330816

Molex, LLC

SLIM-GRID HEADER, 8 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存2,178

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

8

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Tin

100µin (2.54µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330815

Molex, LLC

SLIM-GRID HEADER, 8 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Gold
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存6,300

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

8

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Gold

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330623

Molex, LLC

SLIM-GRID HEADER, 6 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 6
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存5,652

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

6

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330618

Molex, LLC

SLIM-GRID HEADER, 6 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 6
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存6,660

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

6

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

15µin (0.38µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330617

Molex, LLC

SLIM-GRID HEADER, 6 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 6
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存3,544

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

6

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

30µin (0.76µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330616

Molex, LLC

SLIM-GRID HEADER, 6 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 6
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Finish - Post: Tin
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存3,400

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

6

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Tin

100µin (2.54µm)

Tin

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0879330615

Molex, LLC

SLIM-GRID HEADER, 6 CIRCUITS, SU

Connector Type: Header, Breakaway
Contact Type: Male Pin
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board
Shrouding: Unshrouded
Number of Positions: 6
Number of Positions Loaded: All
Number of Rows: 2
Row Spacing - Mating: 0.050" (1.27mm)
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: 0.120" (3.05mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.099" (2.51mm)
Contact Shape: Square
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 2µin (0.05µm)
Contact Finish - Post: Gold
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled
Features: Pick and Place
Operating Temperature: -55°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: -
Insulation Color: Black

封裝: -

庫存6,354

Male Pin

0.050" (1.27mm)

Board to Board

Unshrouded

6

All

2

0.050" (1.27mm)

Surface Mount

Solder

Push-Pull

0.120" (3.05mm)

-

0.099" (2.51mm)

Square

Gold

2µin (0.05µm)

Gold

Copper Alloy

Liquid Crystal Polymer (LCP), Glass Filled

Pick and Place

-55°C ~ 105°C

-

Black

0934070308

Molex, LLC

HEADER PCB

Connector Type: Header
Contact Type: Male Blade
Pitch - Mating: 0.050" (1.27mm)
Style: Board to Board or Cable
Shrouding: Shrouded - 2 Wall
Number of Positions: 8
Number of Positions Loaded: All
Number of Rows: 1
Row Spacing - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Fastening Type: Latch Lock
Contact Length - Mating: 0.083" (2.10mm)
Contact Length - Post: -
Overall Contact Length: -
Insulation Height: 0.333" (8.45mm)
Contact Shape: Rectangular
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 118.1µin (3.00µm)
Contact Finish - Post: Tin
Contact Material: Brass
Insulation Material: Polyphthalamide (PPA), Glass Filled
Features: -
Operating Temperature: -40°C ~ 105°C
Ingress Protection: -
Material Flammability Rating: UL94 HB
Insulation Color: Black

封裝: -

庫存7,092

Male Blade

0.050" (1.27mm)

Board to Board or Cable

Shrouded - 2 Wall

8

All

1

-

Surface Mount

Solder

Latch Lock

0.083" (2.10mm)

-

0.333" (8.45mm)

Rectangular

Tin

118.1µin (3.00µm)

Tin

Brass

Polyphthalamide (PPA), Glass Filled

-

-40°C ~ 105°C

-

UL94 HB

Black

0750187125

Molex, LLC

HS DOCK FIXED CONN 8.74CL 108CKT

Connector Type: Header
Contact Type: Male Blade; Male Pin
Pitch - Mating: -
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Number of Positions: 108
Number of Positions Loaded: All
Number of Rows: 3
Row Spacing - Mating: -
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: -
Contact Length - Post: 0.112" (2.84mm)
Overall Contact Length: -
Insulation Height: -
Contact Shape: Rectangular, Square
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Finish - Post: -
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP)
Features: -
Operating Temperature: -20°C ~ 85°C
Ingress Protection: -
Material Flammability Rating: UL94 V-0
Insulation Color: -

封裝: -

庫存3,580

Male Blade; Male Pin

-

Board to Board

Shrouded - 4 Wall

108

All

3

-

Through Hole, Right Angle

Solder

Push-Pull

-

0.112" (2.84mm)

-

Rectangular, Square

-

Copper Alloy

Liquid Crystal Polymer (LCP)

-

-20°C ~ 85°C

-

UL94 V-0

-

0750187100

Molex, LLC

HS DOCK FIXED ASSY 72CKT NO EARS

Connector Type: Header
Contact Type: Male Blade; Male Pin
Pitch - Mating: -
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Number of Positions: 72
Number of Positions Loaded: All
Number of Rows: 3
Row Spacing - Mating: -
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: -
Contact Length - Post: 0.112" (2.84mm)
Overall Contact Length: -
Insulation Height: -
Contact Shape: Rectangular, Square
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Finish - Post: -
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP)
Features: -
Operating Temperature: -20°C ~ 85°C
Ingress Protection: -
Material Flammability Rating: UL94 V-0
Insulation Color: -

封裝: -

庫存6,210

Male Blade; Male Pin

-

Board to Board

Shrouded - 4 Wall

72

All

3

-

Through Hole, Right Angle

Solder

Push-Pull

-

0.112" (2.84mm)

-

Rectangular, Square

-

Copper Alloy

Liquid Crystal Polymer (LCP)

-

-20°C ~ 85°C

-

UL94 V-0

-

0750187030

Molex, LLC

HS DOCK FIXED CONN 144CKT 4.74CL

Connector Type: Header
Contact Type: Male Blade; Male Pin
Pitch - Mating: -
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Number of Positions: 144
Number of Positions Loaded: All
Number of Rows: 3
Row Spacing - Mating: -
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: -
Contact Length - Post: 0.112" (2.84mm)
Overall Contact Length: -
Insulation Height: -
Contact Shape: Rectangular, Square
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Finish - Post: -
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP)
Features: -
Operating Temperature: -20°C ~ 85°C
Ingress Protection: -
Material Flammability Rating: UL94 V-0
Insulation Color: -

封裝: -

庫存6,192

Male Blade; Male Pin

-

Board to Board

Shrouded - 4 Wall

144

All

3

-

Through Hole, Right Angle

Solder

Push-Pull

-

0.112" (2.84mm)

-

Rectangular, Square

-

Copper Alloy

Liquid Crystal Polymer (LCP)

-

-20°C ~ 85°C

-

UL94 V-0

-

0750187024

Molex, LLC

HS DOCK FIXED CONN 4.74CL 108CKT

Connector Type: Header
Contact Type: Male Blade; Male Pin
Pitch - Mating: -
Style: Board to Board
Shrouding: Shrouded - 4 Wall
Number of Positions: 108
Number of Positions Loaded: All
Number of Rows: 3
Row Spacing - Mating: -
Mounting Type: Through Hole, Right Angle
Termination: Solder
Fastening Type: Push-Pull
Contact Length - Mating: -
Contact Length - Post: 0.112" (2.84mm)
Overall Contact Length: -
Insulation Height: -
Contact Shape: Rectangular, Square
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Finish - Post: -
Contact Material: Copper Alloy
Insulation Material: Liquid Crystal Polymer (LCP)
Features: -
Operating Temperature: -20°C ~ 85°C
Ingress Protection: -
Material Flammability Rating: UL94 V-0
Insulation Color: -

封裝: -

庫存4,140

Male Blade; Male Pin

-

Board to Board

Shrouded - 4 Wall

108

All

3

-

Through Hole, Right Angle

Solder

Push-Pull

-

0.112" (2.84mm)

-

Rectangular, Square

-

Copper Alloy

Liquid Crystal Polymer (LCP)

-

-20°C ~ 85°C

-

UL94 V-0

-