圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Molex, LLC |
CONN FPC 17POS 0.30MM R/A
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封裝: - |
庫存8,694 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 17 | 0.012" (0.30mm) | Solder | 0.30mm | 0.039" (1.00mm) | - | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 30POS 1.25MM R/A
|
封裝: - |
庫存5,832 |
|
Through Hole, Right Angle | Contacts, Top | 30 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 31POS 1.25MM PCB
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封裝: - |
庫存8,100 |
|
Through Hole | Contacts, Vertical, 1 Sided | 31 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 8POS 0.50MM R/A
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封裝: - |
庫存6,876 |
|
Surface Mount, Right Angle | Contacts, Bottom | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -30°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FFC FPC VERT 25POS 1MM SMD
|
封裝: - |
庫存3,078 |
|
Surface Mount | Contacts, Vertical, 1 Sided | 25 | 0.039" (1.00mm) | Solder | 0.30mm | 0.199" (5.05mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | - | 125V | -20°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FPC TOP 19POS 1.00MM R/A
|
封裝: - |
庫存6,408 |
|
Through Hole, Right Angle | Contacts, Top | 19 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
|
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Molex, LLC |
CONN FFC BOTTOM 11POS 1.00MM R/A
|
封裝: - |
庫存8,442 |
|
Surface Mount, Right Angle | Contacts, Bottom | 11 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC/FPC 28POS .5MM SMD R/A
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封裝: - |
庫存4,464 |
|
Surface Mount, Right Angle | Contacts, Bottom | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
|
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Molex, LLC |
CONN FPC TOP 9POS 1.00MM R/A
|
封裝: - |
庫存6,876 |
|
Surface Mount, Right Angle | Contacts, Top | 9 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
|
|
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Molex, LLC |
CONN FFC VERT 30POS 1.25MM PCB
|
封裝: - |
庫存7,560 |
|
Through Hole | Contacts, Vertical, 1 Sided | 30 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 4POS 2MM SMD R/A
|
封裝: - |
庫存5,616 |
|
Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.079" (2.00mm) | Solder | 0.30mm | 0.191" (4.85mm) | - | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | - | Solder Retention | 50V | -40°C ~ 125°C | UL94 V-0 |
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Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 22
|
封裝: - |
庫存5,112 |
|
Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
|
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|
Molex, LLC |
CONN FPC TOP 15POS 1.00MM R/A
|
封裝: - |
庫存8,370 |
|
Through Hole, Right Angle | Contacts, Top | 15 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
|
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Molex, LLC |
CONN FFC VERT 29POS 1.25MM PCB
|
封裝: - |
庫存3,454 |
|
Through Hole | Contacts, Vertical, 1 Sided | 29 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FPC TOP 21POS 1.00MM R/A
|
封裝: - |
庫存4,248 |
|
Through Hole, Right Angle | Contacts, Top | 21 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 7POS 0.50MM R/A
|
封裝: - |
庫存4,266 |
|
Surface Mount, Right Angle | Contacts, Bottom | 7 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FFC/FPC 26POS .5MM SMD R/A
|
封裝: - |
庫存8,892 |
|
Surface Mount, Right Angle | Contacts, Bottom | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
|
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Molex, LLC |
CONN FFC TOP 28POS 1.25MM R/A
|
封裝: - |
庫存4,104 |
|
Through Hole, Right Angle | Contacts, Top | 28 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.197" (5.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FPC 15POS .3MM SMD R/A
|
封裝: - |
庫存2,088 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 15 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
|
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Molex, LLC |
CONN FPC 15POS .3MM SMD R/A
|
封裝: - |
庫存8,280 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 15 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
|
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|
Molex, LLC |
CONN FPC TOP 14POS 1.00MM R/A
|
封裝: - |
庫存8,442 |
|
Through Hole, Right Angle | Contacts, Top | 14 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
|
|
|
Molex, LLC |
CONN FPC 19POS .3MM SMD R/A
|
封裝: - |
庫存2,178 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 19 | 0.012" (0.30mm) | Solder | 0.20mm | 0.037" (0.95mm) | Flip Lock, Backlock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
|
|
|
Molex, LLC |
0.5 FFC ZIF BTM CONT EMBT PKG 20
|
封裝: - |
庫存2,268 |
|
Surface Mount, Right Angle | Contacts, Bottom | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Tin | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0 |
|
|
|
Molex, LLC |
CONN FFC VERT 27POS 1.25MM PCB
|
封裝: - |
庫存5,976 |
|
Through Hole | Contacts, Vertical, 1 Sided | 27 | 0.049" (1.25mm) | Kinked Pin | 0.30mm | 0.315" (8.00mm) | - | Straight | Phosphor Bronze | Tin | Polybutylene Terephthalate (PBT), Polyester | - | - | 200V | -40°C ~ 85°C | UL94 V-0 |
|
|
|
Molex, LLC |
CONN FFC/FPC 24POS .5MM SMD R/A
|
封裝: - |
庫存5,418 |
|
Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
|
|
|
Molex, LLC |
CONN FPC TOP 17POS 1.00MM R/A
|
封裝: - |
庫存2,862 |
|
Through Hole, Right Angle | Contacts, Top | 17 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.142" (3.60mm) | - | Straight | Phosphor Bronze | Tin | Polyphenylene Sulfide (PPS) | - | - | 50V | -20°C ~ 80°C | UL94 V-0 |
|
|
|
Molex, LLC |
CONN FPC 11POS .3MM SMD R/A
|
封裝: - |
庫存3,150 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 11 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
|
|
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Molex, LLC |
CONN FPC 11POS .3MM SMD R/A
|
封裝: - |
庫存7,434 |
|
Surface Mount, Right Angle | Contacts, Top and Bottom | 11 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
