頁 2 - Molex, LLC 產品 - 卡緣連接器 - 邊緣板連接器 | 黑森爾電子
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Molex, LLC 產品 - 卡緣連接器 - 邊緣板連接器

記錄 204
頁  2/8
圖片
零件編號
製造商
描述
封裝
庫存
數量
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
0459120012
Molex, LLC

CONN EDGE DUAL FMALE 12POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 8; 2; 2
  • Number of Positions: 12 (8 + 4 Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存6,246
Female
8; 2; 2
12 (8 + 4 Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Press-Fit
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0459120007
Molex, LLC

CONN EDGE DUAL FMALE 12POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 2; 2; 8
  • Number of Positions: 12 (8 + 4 Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存4,698
Female
2; 2; 8
12 (8 + 4 Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Press-Fit
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0877159920
Molex, LLC

CONN FEMALE 200POS 0.039 GOLD

  • Card Type: -
  • Gender: Female
  • Number of Positions/Bay/Row: 15; 85
  • Number of Positions: 200
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Standoffs
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 85°C
封裝: -
庫存6,048
Female
15; 85
200
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Standoffs
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
30µin (0.76µm)
-
Black
-
-55°C ~ 85°C
0457190005
Molex, LLC

CONN EDGE DUAL FEMALE 6POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 6 (Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存4,518
Female
-
6 (Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0458440001
Molex, LLC

CONN EDGE DUAL FEMALE 16POS GOLD

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 16
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: -
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存4,482
Female
-
16
0.062" (1.57mm)
2
-
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0877153908
Molex, LLC

CONN PCI EXP FEMALE 230POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: 11; 104
  • Number of Positions: 230
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存7,524
Female
11; 104
230
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
Cantilever
Black
-
-
0457190002
Molex, LLC

CONN EDGE DUAL FEMALE 6POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 6 (Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存5,904
Female
-
6 (Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0457140002
Molex, LLC

CONN EDGE DUAL FEMALE 6POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 6 (Power)
  • Card Thickness: 0.093" (2.36mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存7,686
Female
-
6 (Power)
0.093" (2.36mm)
2
0.508" (12.90mm)
-
Through Hole
Press-Fit
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0459110004
Molex, LLC

CONN EDGE DUAL FMALE 10POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 8; 2
  • Number of Positions: 10 (8 + 2 Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存6,714
Female
8; 2
10 (8 + 2 Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0459110003
Molex, LLC

CONN EDGE DUAL FMALE 10POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: 2; 8
  • Number of Positions: 10 (8 + 2 Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存3,258
Female
2; 8
10 (8 + 2 Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
1733000114
Molex, LLC

SPEEDEDGE 82CKT RECEPT

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 82
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存7,794
Female
-
82
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide
Surface Mount
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-
1733000106
Molex, LLC

SPEEDEDGE 60CKT RECEPT

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 60
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.031" (0.80mm)
  • Features: Board Guide
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存5,724
Female
-
60
0.062" (1.57mm)
2
0.031" (0.80mm)
Board Guide
Surface Mount
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-
0877159913
Molex, LLC

CONN PCI EXP FEMALE 164POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 164
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Lock, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存3,618
Female
-
164
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Lock, Locking Ramp
Through Hole
Solder, Staggered
Copper Alloy
Gold
30µin (0.76µm)
Cantilever
Black
-
-
0877159912
Molex, LLC

CONN EDGE DUAL FMALE 164POS .039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 164
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Lock, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存6,300
Female
-
164
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Lock, Locking Ramp
Through Hole
Solder, Staggered
Copper Alloy
Gold
30µin (0.76µm)
Cantilever
Black
-
-
0457190001
Molex, LLC

CONN EDGE DUAL FEMALE 4POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 4 (Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存6,696
Female
-
4 (Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0457140001
Molex, LLC

CONN EDGE DUAL FEMALE 4POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 4 (Power)
  • Card Thickness: 0.093" (2.36mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Press-Fit
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存8,712
Female
-
4 (Power)
0.093" (2.36mm)
2
0.508" (12.90mm)
-
Through Hole
Press-Fit
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0457190004
Molex, LLC

CONN EDGE DUAL FEMALE 4POS 0.508

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 4 (Power)
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.508" (12.90mm)
  • Features: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -40°C ~ 105°C
封裝: -
庫存4,050
Female
-
4 (Power)
0.062" (1.57mm)
2
0.508" (12.90mm)
-
Through Hole
Solder
Copper Alloy
Gold
30µin (0.76µm)
-
Black
-
-40°C ~ 105°C
0877159903
Molex, LLC

CONN EDGE DUAL FMALE 98POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: Flash
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存2,736
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
Flash
Cantilever
Black
-
-
0877159902
Molex, LLC

CONN EDGE DUAL FMALE 98POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: Flash
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存3,744
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
Flash
Cantilever
Black
-
-
0877159308
Molex, LLC

CONN PCI EXP FEMALE 164POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 164
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存7,668
Female
-
164
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
Cantilever
Black
-
-
0877159907
Molex, LLC

CONN EDGE DUAL FMALE 98POS 0.039

  • Card Type: Non Specified - Dual Edge
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存2,700
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
Cantilever
Black
-
-
0877159910
Molex, LLC

CONN PCI EXP FEMALE 98POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Lock, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存6,534
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Lock, Locking Ramp
Through Hole
Solder, Staggered
Copper Alloy
Gold
30µin (0.76µm)
Cantilever
Black
-
-
0877159911
Molex, LLC

CONN PCI EXP FEMALE 98POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Lock, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Copper Alloy
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存4,032
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Lock, Locking Ramp
Through Hole
Solder, Staggered
Copper Alloy
Gold
30µin (0.76µm)
Cantilever
Black
-
-
0877159602
Molex, LLC

CONN PCI EXP FEMALE 98POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Brass
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存5,292
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Brass
Gold
15µin (0.38µm)
Cantilever
Black
-
-
0877159203
Molex, LLC

CONN PCI EXP FEMALE 98POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 98
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: Flash
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存5,706
Female
-
98
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
Flash
Cantilever
Black
-
-
0877159901
Molex, LLC

CONN FEMALE 26POS 0.039 GOLD

  • Card Type: -
  • Gender: Female
  • Number of Positions/Bay/Row: 13
  • Number of Positions: 26
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Standoffs
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 85°C
封裝: -
庫存7,200
Female
13
26
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Standoffs
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
-
Black
-
-55°C ~ 85°C
0877159900
Molex, LLC

CONN FEMALE 26POS 0.039 GOLD

  • Card Type: -
  • Gender: Female
  • Number of Positions/Bay/Row: 13
  • Number of Positions: 26
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Standoffs
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: -
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -55°C ~ 85°C
封裝: -
庫存6,462
Female
13
26
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Standoffs
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
-
Black
-
-55°C ~ 85°C
0877159108
Molex, LLC

CONN PCI EXP FEMALE 64POS 0.039

  • Card Type: PCI Express?
  • Gender: Female
  • Number of Positions/Bay/Row: -
  • Number of Positions: 64
  • Card Thickness: 0.062" (1.57mm)
  • Number of Rows: 2
  • Pitch: 0.039" (1.00mm)
  • Features: Board Guide, Locking Ramp
  • Mounting Type: Through Hole
  • Termination: Solder, Staggered
  • Contact Material: Phosphor Bronze
  • Contact Finish: Gold
  • Contact Finish Thickness: 15µin (0.38µm)
  • Contact Type: Cantilever
  • Color: Black
  • Flange Feature: -
  • Operating Temperature: -
封裝: -
庫存6,462
Female
-
64
0.062" (1.57mm)
2
0.039" (1.00mm)
Board Guide, Locking Ramp
Through Hole
Solder, Staggered
Phosphor Bronze
Gold
15µin (0.38µm)
Cantilever
Black
-
-