Microchip Technology 產品

DSC8101BI2T

Microchip Technology

OSC MEMS BLANK CMOS

• Type: MEMS (Silicon)
• Programmable Type: Blank (User Must Program)
• Available Frequency Range: 10MHz ~ 100MHz
• Function: Standby
• Output: CMOS
• Voltage - Supply: 2.25 V ~ 3.6 V
• Frequency Stability: ±25ppm
• Frequency Stability (Total): -
• Operating Temperature: -40°C ~ 85°C
• Spread Spectrum Bandwidth: -
• Current - Supply (Max): 35mA
• Ratings: AEC-Q100
• Mounting Type: Surface Mount
• Package / Case: 6-SMD, No Lead
• Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
• Height: 0.035" (0.90mm)

封裝: 6-SMD, No Lead

MCP1603T-080I/MC

Microchip Technology

IC REG BUCK 0.8V 0.5A SYNC 8DFN

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 2.7V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 0.8V
• Voltage - Output (Max): -
• Current - Output: 500mA
• Frequency - Switching: 2MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-DFN (3x2)

封裝: 8-VFDFN Exposed Pad

TCM809JENB713

Microchip Technology

IC RESET MONITOR 4.00V SOT23B-3

• Type: Simple Reset/Power-On Reset
• Number of Voltages Monitored: 1
• Output: Push-Pull, Totem Pole
• Reset: Active Low
• Reset Timeout: 140 ms Minimum
• Voltage - Threshold: 4V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: SOT-23-3

封裝: TO-236-3, SC-59, SOT-23-3

AT73C211-ZI

Microchip Technology

IC POWER MANAGEMENT 48FBGA

• Applications: Power Management - Hand-Held Devices
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -20°C ~ 85°C
• Mounting Type: -
• Package / Case: 48-FBGA
• Supplier Device Package: -

封裝: 48-FBGA

25LC160CT-H/SN

Microchip Technology

IC EEPROM 16KBIT 5MHZ 8SOIC

• Memory Type: Non-Volatile
• Memory Format: EEPROM
• Technology: EEPROM
• Memory Size: 16Kb (2K x 8)
• Memory Interface: SPI
• Clock Frequency: 5MHz
• Write Cycle Time - Word, Page: 6ms
• Access Time: -
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封裝: 8-SOIC (0.154", 3.90mm Width)

MCP2021T-500E/MD

Microchip Technology

IC LIN TXRX ON-BOARD VREG 8DFN

• Type: Transceiver
• Protocol: LIN
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 175mV
• Data Rate: -
• Voltage - Supply: 6 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN (4x4)

封裝: 8-VDFN Exposed Pad

KSZ8893MBL-TR

Microchip Technology

IC MANAGED SW 10/100 100LFBGA

• Protocol: Ethernet
• Function: Switch
• Interface: I2C, SPI
• Standards: 10/100 Base-FX/T/TX
• Voltage - Supply: 3.1 V ~ 3.5 V
• Current - Supply: 120mA
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LFBGA
• Supplier Device Package: -

封裝: 100-LFBGA

AT90S8515-4AC

Microchip Technology

IC MCU 8BIT 8KB FLASH 44TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 32
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

PIC16LC72-04/SP

Microchip Technology

IC MCU 8BIT 3.5KB OTP 28SDIP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: I2C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.300", 7.62mm)
• Supplier Device Package: 28-SPDIP

封裝: 28-DIP (0.300", 7.62mm)

ATMEGA649P-MU

Microchip Technology

IC MCU 8BIT 64KB FLASH 64QFN

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SPI, UART/USART, USI
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 64KB (32K x 16)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-VFQFN Exposed Pad
• Supplier Device Package: 64-QFN (9x9)

封裝: 64-VFQFN Exposed Pad

ATSAM4S8BA-ANR

Microchip Technology

IC MCU 32BIT 512KB FLASH 64LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: I2C, IrDA, Memory Card, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 47
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 11x12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

封裝: 64-LQFP

PIC18LF4510T-I/PT

Microchip Technology

IC MCU 8BIT 32KB FLASH 44TQFP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 32KB (16K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1.5K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封裝: 44-TQFP

PIC16F628T-20I/SS

Microchip Technology

IC MCU 8BIT 3.5KB FLASH 20SSOP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• EEPROM Size: 128 x 8
• RAM Size: 224 x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

封裝: 20-SSOP (0.209", 5.30mm Width)

PIC12LCE519-04/SM

Microchip Technology

IC MCU 8BIT 1.5KB OTP 8SOIJ

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: -
• Peripherals: POR, WDT
• Number of I/O: 5
• Program Memory Size: 1.5KB (1K x 12)
• Program Memory Type: OTP
• EEPROM Size: 16 x 8
• RAM Size: 41 x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIJ

封裝: 8-SOIC (0.209", 5.30mm Width)

PIC24F32KA302-I/SO

Microchip Technology

IC MCU 16BIT 32KB FLASH 28SOIC

• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I2C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number of I/O: 24
• Program Memory Size: 32KB (11K x 24)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 13x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 28-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 28-SOIC

封裝: 28-SOIC (0.295", 7.50mm Width)

CEC1702Q-B1-SX-TR

Microchip Technology

CRYPTO EMBEDDED CONTROLLER 480 K

• Applications: Cryptography
• Core Processor: ARM? Cortex?-M4F
• Program Memory Type: SRAM
• Controller Series: -
• RAM Size: 480K x 8
• Interface: I2C, SPI, UART
• Number of I/O: 65
• Voltage - Supply: 1.71 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 84-WFBGA
• Supplier Device Package: 84-WFBGA (7x7)

封裝: 84-WFBGA

ATSAMD20G14B-MU

Microchip Technology

48QFN IND TEMP, GREEN,1.6-3.6V,4

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.62 V ~ 3.6 V
• Data Converters: A/D 14x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-VQFN (7x7)

封裝: 48-VFQFN Exposed Pad

ZL50021GAC

Microchip Technology

IC TDM SWITCH 4K-CH ENH 256BGA

• Function: Switch
• Interface: -
• Number of Circuits: 1
• Voltage - Supply: 1.71V ~ 1.89V
• Current - Supply: 1.75mA
• Power (Watts): -
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 256-BGA
• Supplier Device Package: 256-BGA (17x17)

封裝: 256-BGA

PIC32MZ1064DAL169-I/HF

Microchip Technology

32-BIT CACHE-BASED MCU GRAPHICS

• Core Processor: MIPS32® microAptiv™
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, HLVD, I²S, POR, PWM, WDT
• Number of I/O: 120
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 640K x 8
• Voltage - Supply (Vcc/Vdd): 1.7V ~ 1.9V
• Data Converters: A/D 45x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 169-LFBGA
• Supplier Device Package: 169-LFBGA (11x11)

封裝: 169-LFBGA

1N4679

Microchip Technology

DIODE ZENER

• Voltage - Zener (Nom) (Vz): 2 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 5 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封裝: -

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ATMEGA1609-AU

Microchip Technology

IC MCU 8BIT 16KB FLASH 48TQFP

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number of I/O: 41
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-TQFP
• Supplier Device Package: 48-TQFP (7x7)

封裝: -

UM6610B

Microchip Technology

SI PPIN HERMETIC GLASS AXIAL

• Diode Type: PIN - Single
• Voltage - Peak Reverse (Max): 1000V
• Current - Max: -
• Capacitance @ Vr, F: 0.4pF @ 100V, 1MHz
• Resistance @ If, F: 2.5Ohm @ 100mA, 100MHz
• Power Dissipation (Max): 2.5 W
• Operating Temperature: -
• Package / Case: Axial
• Supplier Device Package: Axial

封裝: -

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CD4715

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 36 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 10 nA @ 27.3 V
• Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

封裝: -

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1N5529-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 9.1 V
• Tolerance: ±20%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): -
• Current - Reverse Leakage @ Vr: 100 nA @ 7 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C (TJ)
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封裝: -

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JANTXV1N647UR-1

Microchip Technology

DIODE GP 400V 400MA DO213AA

• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 400 V
• Current - Average Rectified (Io): 400mA
• Voltage - Forward (Vf) (Max) @ If: 1 V @ 400 mA
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: -
• Capacitance @ Vr, F: -
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA
• Operating Temperature - Junction: -65°C ~ 175°C

封裝: -

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JAN1N6912UTK2-TR

Microchip Technology

DIODE GEN PURP 45V 25A THINKEY2

• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 45 V
• Current - Average Rectified (Io): 25A
• Voltage - Forward (Vf) (Max) @ If: 640 mV @ 25 A
• Speed: No Recovery Time > 500mA (Io)
• Reverse Recovery Time (trr): -
• Current - Reverse Leakage @ Vr: 1.2 mA @ 45 V
• Capacitance @ Vr, F: 1000pF @ 5V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: ThinKey™2
• Supplier Device Package: ThinKey™2
• Operating Temperature - Junction: -65°C ~ 150°C

封裝: -

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JANTXV1N5519BUR-1-TR

Microchip Technology

VOLTAGE REGULATOR

• Voltage - Zener (Nom) (Vz): 3.6 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 24 Ohms
• Current - Reverse Leakage @ Vr: 3 µA @ 1 V
• Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Surface Mount
• Package / Case: DO-213AA
• Supplier Device Package: DO-213AA

封裝: -

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1N4567E3

Microchip Technology

TEMPERATURE COMPENSATED

• Voltage - Zener (Nom) (Vz): 6.4 V
• Tolerance: ±5%
• Power - Max: 500 mW
• Impedance (Max) (Zzt): 200 Ohms
• Current - Reverse Leakage @ Vr: 2 µA @ 3 V
• Voltage - Forward (Vf) (Max) @ If: -
• Operating Temperature: -65°C ~ 175°C
• Mounting Type: Through Hole
• Package / Case: DO-204AH, DO-35, Axial
• Supplier Device Package: DO-204AH (DO-35)

封裝: -

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