圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存147,372 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
封裝: 16-TSSOP (0.173", 4.40mm Width) |
庫存48,000 |
|
1 | 2:4 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2.5GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存80,472 |
|
2 | 2:1 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存14,136 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存6,160 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 2GHz | 2.37 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 6GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存14,892 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4.5GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存8,208 |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 4GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存4,112 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存50,472 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存19,260 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存411,144 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:12 3GHZ 44MLF
|
封裝: 44-VFQFN Exposed Pad, 44-MLF? |
庫存78,180 |
|
1 | 2:12 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存18,348 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存257,112 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存292,488 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 3GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存15,936 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存123,192 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存12,456 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存23,556 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 650MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存13,728 |
|
1 | 1:4 | No/Yes | LVCMOS, LVTTL | LVDS | 650MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
封裝: 16-VFQFN Exposed Pad, 16-MLF? |
庫存68,232 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
封裝: SOT-23-6 |
庫存6,840 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC CLK BUFFER 1:5 134MHZ 8SOP
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存24,282 |
|
1 | 1:5 | No/No | CMOS | CMOS | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:22 1GHZ 64TQFP
|
封裝: 64-TQFP Exposed Pad |
庫存48,528 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:20 1.5GHZ 64TQFP
|
封裝: 64-TQFP Exposed Pad |
庫存7,548 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVDS | 1.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:6 7.5GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存5,664 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | CML | 7.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:6 5.5GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存272,748 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 6GHZ 32MLF
|
封裝: 32-VFQFN Exposed Pad, 32-MLF? |
庫存19,800 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | CML | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |