圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 20.0000MHZ LVDS SMT
|
封裝: 6-SMD, No Lead |
庫存4,986 |
|
20MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 32mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 27.0000MHZ LVDS SMT
|
封裝: 6-SMD, No Lead |
庫存6,030 |
|
27MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 32mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 200.0000MHZ LVPECL SMT
|
封裝: 6-SMD, No Lead |
庫存5,904 |
|
200MHz | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 58mA | - | Surface Mount | 6-SMD, No Lead | 0.100" L x 0.079" W (2.54mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.0000MHZ LVDS SMT
|
封裝: 6-SMD, No Lead |
庫存5,184 |
|
125MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 156.25MHZ LVDS SMD
|
封裝: 6-SMD, No Lead |
庫存2,772 |
|
156.25MHz | Standby (Power Down) | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存5,436 |
|
125MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 35mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存6,516 |
|
25MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.0032MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存7,596 |
|
125.0032MHz | Enable/Disable | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 35mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存5,832 |
|
100MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.0000MHZ LVDS SMT
|
封裝: 6-SMD, No Lead |
庫存2,610 |
|
125MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 156.25000MHZ HCSL SMD
|
封裝: 6-SMD, No Lead |
庫存8,496 |
|
156.25MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 42mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 62.0000MHZ LVDS SMD
|
封裝: 6-SMD, No Lead |
庫存2,700 |
|
62MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 156.2500MHZ LVDS SMD
|
封裝: 6-SMD, No Lead |
庫存6,012 |
|
156.25MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 50.000MHZ LVDS SMD
|
封裝: 6-SMD, No Lead |
庫存5,562 |
|
50MHz | Enable/Disable | LVDS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 32mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 19.44MHZ LVPECL SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存2,880 |
|
19.44MHz | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 85°C | 58mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 80.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存4,950 |
|
80MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 80.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,096 |
|
80MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 105°C | 8.7mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ HCSL SMD
|
封裝: 6-SMD, No Lead |
庫存8,334 |
|
125MHz | Standby (Power Down) | HCSL | 2.25 V ~ 3.6V | ±10ppm | -40°C ~ 85°C | 42mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ LVPECL SMD
|
封裝: 6-SMD, No Lead |
庫存7,650 |
|
25MHz | Enable/Disable | LVPECL | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 58mA | - | Surface Mount | 6-SMD, No Lead | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 25.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存6,390 |
|
25MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±10ppm | -40°C ~ 85°C | 6.3mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.0000MHZ CMOS SMT
|
封裝: 4-SMD, No Lead |
庫存4,878 |
|
100MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 105°C | 35mA | - | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 80.0000MHZ LVCMOS SMD
|
封裝: 4-SMD, No Lead |
庫存2,178 |
|
80MHz | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -40°C ~ 105°C | 7.5mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 54.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存5,112 |
|
54MHz | Standby (Power Down) | LVCMOS | 1.7 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 48.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead Exposed Pad |
庫存7,164 |
|
48MHz | Standby (Power Down) | CMOS | 1.8 V ~ 3.3 V | ±25ppm | -40°C ~ 85°C | 7.2mA | AEC-Q100 | Surface Mount | 4-SMD, No Lead Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 200.000MHZ HCSL SMD
|
封裝: 6-SMD, No Lead |
庫存4,086 |
|
200MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 42mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ HCSL SMD
|
封裝: 6-SMD, No Lead |
庫存5,328 |
|
100MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 42mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 133.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存5,166 |
|
133MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6V | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 200.000MHZ HCSL SMD
|
封裝: 6-SMD, No Lead |
庫存8,334 |
|
200MHz | Enable/Disable | HCSL | 2.25 V ~ 3.6 V | ±25ppm | -40°C ~ 105°C | 42mA | AEC-Q100 | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |