圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Frequency | Function | Output | Voltage - Supply | Frequency Stability | Operating Temperature | Current - Supply (Max) | Ratings | Mounting Type | Package / Case | Size / Dimension | Height - Seated (Max) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS 120.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存2,880 |
|
120MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 120.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存5,238 |
|
120MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存5,004 |
|
20MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存2,232 |
|
20MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 4.960MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存6,192 |
|
4.096MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 4.960MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存8,244 |
|
4.096MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±50ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存3,924 |
|
10MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 10.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead |
庫存4,302 |
|
10MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead | 0.197" L x 0.126" W (5.00mm x 3.20mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 100.000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存5,796 |
|
100MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -55°C ~ 125°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 66.0000MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存3,600 |
|
66MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -40°C ~ 85°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.608MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存5,472 |
|
40.608MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.68MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存7,560 |
|
7.68MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±10ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.6080MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存4,662 |
|
40.608MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 40.6080MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存7,488 |
|
40.608MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.68MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存3,150 |
|
7.68MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 7.68MHZ CMOS SMD
|
封裝: 6-SMD, No Lead, Exposed Pad |
庫存4,914 |
|
7.68MHz | Standby (Power Down) | CMOS | 2.25 V ~ 3.6 V | ±25ppm | -20°C ~ 70°C | 35mA | - | Surface Mount | 6-SMD, No Lead, Exposed Pad | 0.276" L x 0.197" W (7.00mm x 5.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存6,462 |
|
32MHz | Standby (Power Down) | CMOS | 3.3V | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 32.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,366 |
|
32MHz | Standby (Power Down) | CMOS | 3.3V | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 19.6608MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,456 |
|
19.6608MHz | Standby (Power Down) | CMOS | 3.3V | ±25ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 125.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存5,868 |
|
125MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 10mA | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 14.3181MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存2,808 |
|
14.3181MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.2880MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存8,586 |
|
12.288MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 12.2880MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存8,100 |
|
12.288MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 20.000MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,400 |
|
20MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -20°C ~ 70°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 18.4320MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存7,740 |
|
18.432MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -20°C ~ 70°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.098" L x 0.079" W (2.50mm x 2.00mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 35.3280MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,580 |
|
35.328MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 35.3280MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存3,294 |
|
35.328MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -40°C ~ 85°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |
||
Microchip Technology |
OSC MEMS 5.08MHZ CMOS SMD
|
封裝: 4-SMD, No Lead |
庫存5,742 |
|
2.08MHz | Standby (Power Down) | CMOS | 3.3V | ±50ppm | -20°C ~ 70°C | 3mA (Typ) | - | Surface Mount | 4-SMD, No Lead | 0.126" L x 0.098" W (3.20mm x 2.50mm) | 0.035" (0.90mm) |