頁 68 - Infineon Technologies 產品 - 嵌入式 - 微控制器

CY8C6144LQI-S4F82

Infineon Technologies

IC MCU 32BIT 256KB FLASH 68QFN

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 50MHz, 150MHz
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Number of I/O: 52
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Data Converters: A/D 16x12b SAR, Sigma-Delta; D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Supplier Device Package: 68-QFN (8x8)

封裝: -

庫存7,740

32-Bit

50MHz, 150MHz

I2C, LINbus, QSPI, SPI, UART/USART, USB

Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT

52

256KB (256K x 8)

FLASH

-

128K x 8

1.7V ~ 3.6V

A/D 16x12b SAR, Sigma-Delta; D/A 1x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

68-VFQFN Exposed Pad

68-QFN (8x8)

CY8C6144LQI-S4F62

Infineon Technologies

IC MCU 32BIT 256KB FLASH 68QFN

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O: 52
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Data Converters: A/D 16x12b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Supplier Device Package: 68-QFN (8x8)

封裝: -

庫存7,791

32-Bit

150MHz

CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB

Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT

52

256KB (256K x 8)

FLASH

-

128K x 8

1.7V ~ 3.6V

A/D 16x12b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

68-VFQFN Exposed Pad

68-QFN (8x8)

CYT4BF8CDDQ0AEEGS

Infineon Technologies

IC MCU 32BT 8.1875MB FLSH 176QFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Quad-Core
Speed: 100MHz, 350MHz
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 148
Program Memory Size: 8.1875MB (8.1875M x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 99x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-TEQFP (24x24)

封裝: -

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32-Bit Quad-Core

100MHz, 350MHz

CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, WDT

148

8.1875MB (8.1875M x 8)

FLASH

256 x 8

1M x 8

2.7V ~ 5.5V

A/D 99x12b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

176-LQFP Exposed Pad

176-TEQFP (24x24)

CY9BF328SPMC-GK7E1

Infineon Technologies

IC MCU 32BT 1.0625MB FLSH 144QFP

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 60MHz
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 122
Program Memory Size: 1.0625MB (1.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 160K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b; D/A 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: -

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32-Bit

60MHz

CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB

DMA, LVD, POR, PWM, WDT

122

1.0625MB (1.0625M x 8)

FLASH

-

160K x 8

2.7V ~ 5.5V

A/D 24x12b; D/A 2x10b

Internal

-40°C ~ 105°C (TA)

Surface Mount

144-LQFP

144-LQFP (20x20)

CY9BF106NAPMC-G-UNE1

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

庫存2,700

32-Bit

80MHz

CSIO, EBI/EMI, I2C, LINbus, UART/USART

DMA, LVD, POR, PWM, WDT

80

512KB (512K x 8)

FLASH

-

64K x 8

2.7V ~ 5.5V

A/D 16x12b SAR

Internal

-40°C ~ 85°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

CY8C4246AZA-M443

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O: 38
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-TQFP (7x7)

封裝: -

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32-Bit

48MHz

I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT

38

64KB (64K x 8)

FLASH

-

8K x 8

1.71V ~ 5.5V

A/D 24x12b SAR; D/A 4x7/8b

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

48-LQFP

48-TQFP (7x7)

CY8C4246AZA-M445

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Number of I/O: 51
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-TQFP (10x10)

封裝: -

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32-Bit

48MHz

I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT

51

64KB (64K x 8)

FLASH

-

8K x 8

1.71V ~ 5.5V

A/D 24x12b SAR; D/A 4x7/8b

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-TQFP (10x10)

XMC7100-F176K4160AA

Infineon Technologies

INDUSTRIAL MCUS

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 100MHz, 250MHz
Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT
Number of I/O: 148
Program Memory Size: 4.063MB (4.063M x 8)
Program Memory Type: FLASH
EEPROM Size: 256K x 8
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 64x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-TEQFP (24x24)

封裝: -

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32-Bit Dual-Core

100MHz, 250MHz

CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT

148

4.063MB (4.063M x 8)

FLASH

256K x 8

768K x 8

2.7V ~ 5.5V

A/D 64x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

176-LQFP Exposed Pad

176-TEQFP (24x24)

CY9AF004BGL-G103MJK7ERE1

Infineon Technologies

IC MCU 32BIT 121PFBGA

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存6,000

-

CY8C4147AZAS575XQLA1

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-TQFP (10x10)

封裝: -

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32-Bit

48MHz

CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT

54

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-TQFP (10x10)

TC377TX96F300SABLXUMA1

Infineon Technologies

IC MCU 32BIT 6MB FLASH 292LFBGA

Core Processor: TriCore™
Core Size: 32-Bit 6-Core
Speed: 300MHz
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: 256K x 8
RAM Size: 992K x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Supplier Device Package: PG-LFBGA-292-13

封裝: -

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32-Bit 6-Core

300MHz

ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT

DMA, I2S, POR, PWM, WDT

-

6MB (6M x 8)

FLASH

256K x 8

992K x 8

2.97V ~ 5.5V

-

Internal

-40°C ~ 150°C (TA)

Surface Mount

292-LFBGA

PG-LFBGA-292-13

S6J335EJBESE20000

Infineon Technologies

TRAVEO-40NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, CSIO, I2C, LINbus, SCI, UART/USART
Peripherals: DMA, LVD, LVR, POR, PWM, WDT
Number of I/O: 176
Program Memory Size: 4.16MB (4.16M x 8)
Program Memory Type: FLASH
EEPROM Size: 112K x 8
RAM Size: 544K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.2V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-TEQFP (24x24)

封裝: -

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32-Bit

240MHz

CANbus, CSIO, I2C, LINbus, SCI, UART/USART

DMA, LVD, LVR, POR, PWM, WDT

176

4.16MB (4.16M x 8)

FLASH

112K x 8

544K x 8

3.5V ~ 5.2V

A/D 16x10b

Internal

-40°C ~ 105°C (TA)

Surface Mount

176-LQFP Exposed Pad

176-TEQFP (24x24)

CY9BF168RPMC-G-MNERE2

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 160MHz
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A 2x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Supplier Device Package: 120-LQFP (16x16)

封裝: -

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32-Bit

160MHz

CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART

DMA, LVD, POR, PWM, WDT

100

1MB (1M x 8)

FLASH

-

128K x 8

2.7V ~ 5.5V

A/D 24x12b SAR; D/A 2x12b

External, Internal

-40°C ~ 125°C (TJ)

Surface Mount

120-LQFP

120-LQFP (16x16)

CY9BF521MBGL-GK9E1

Infineon Technologies

IC MCU 32BIT 96KB FLASH 96FBGA

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit Single-Core
Speed: 72MHz
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 65
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 26x12b; D/A 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-FBGA (6x6)

封裝: -

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32-Bit Single-Core

72MHz

CANbus, CSIO, I2C, LINbus, UART/USART, USB

DMA, LVD, POR, PWM, WDT

65

96KB (96K x 8)

FLASH

-

16K x 8

2.7V ~ 5.5V

A/D 26x12b; D/A 2x10b

Internal

-40°C ~ 105°C (TA)

Surface Mount

96-LFBGA

96-FBGA (6x6)

TC399XP256F300SBDKXUMA2

Infineon Technologies

IC MCU 32BIT 16MB FLASH 516LFBGA

Core Processor: TriCore™
Core Size: 32-Bit 10-Core
Speed: 300MHz
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, LVDS, PWM, WDT
Number of I/O: -
Program Memory Size: 16MB (16M x 8)
Program Memory Type: FLASH
EEPROM Size: 1M x 8
RAM Size: 2.47M x 8
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 516-LFBGA
Supplier Device Package: PG-LFBGA-516-10

封裝: -

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32-Bit 10-Core

300MHz

ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT

DMA, LVDS, PWM, WDT

-

16MB (16M x 8)

FLASH

1M x 8

2.47M x 8

2.97V ~ 5.5V

-

Internal

-40°C ~ 125°C (TA)

Surface Mount

516-LFBGA

PG-LFBGA-516-10

CY8C4126LQA-S453

Infineon Technologies

IC MCU 32BIT 64KB FLASH 40QFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 24MHz
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x10b, 20x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-UFQFN Exposed Pad
Supplier Device Package: 40-QFN (6x6)

封裝: -

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32-Bit

24MHz

I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT

34

64KB (64K x 8)

FLASH

-

8K x 8

1.71V ~ 5.5V

A/D 16x10b, 20x12b SAR

Internal

-40°C ~ 85°C (TA)

Surface Mount, Wettable Flank

40-UFQFN Exposed Pad

40-QFN (6x6)

CY9BF566RPMC-GNE2

Infineon Technologies

IC MCU 32BIT 544KB FLASH 120LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 544KB (544K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A 2x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Supplier Device Package: 120-LQFP (16x16)

封裝: -

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32-Bit Single-Core

160MHz

CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB

DMA, LVD, POR, PWM, WDT

100

544KB (544K x 8)

FLASH

-

64K x 8

2.7V ~ 5.5V

A/D 24x12b SAR; D/A 2x12b

External, Internal

-40°C ~ 125°C (TJ)

Surface Mount

120-LQFP

120-LQFP (16x16)

CY95F778ENPMC1-G-103UNE2

Infineon Technologies

MULTI-MARKET MCUS

Core Processor: F²MC-8FX
Core Size: 8-Bit
Speed: 16.25MHz
Connectivity: I2C, SIO, UART/USART
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 55
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x8/10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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8-Bit

16.25MHz

I2C, SIO, UART/USART

LCD, LVD, POR, PWM, WDT

55

60KB (60K x 8)

FLASH

-

2K x 8

1.8V ~ 5.5V

A/D 8x8/10b

External, Internal

-40°C ~ 85°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

CY8C4147AZES565XQLA1

Infineon Technologies

PSOC4 - GENERAL

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-TQFP (10x10)

封裝: -

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32-Bit

48MHz

CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART

Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT

54

128KB (128K x 8)

FLASH

-

16K x 8

1.71V ~ 5.5V

A/D 16x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

64-LQFP

64-TQFP (10x10)

S6J327CLUPSC20000

Infineon Technologies

TRAVEO-55NM

Core Processor: ARM® Cortex®-R5F
Core Size: 32-Bit
Speed: 240MHz
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 2.0625MB (2.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2.25K x 8
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Data Converters: A/D 50x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Supplier Device Package: 216-TEQFP (24x24)

封裝: -

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32-Bit

240MHz

CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART

DMA, I2S, LCD, LVD, POR, PWM, WDT

128

2.0625MB (2.0625M x 8)

FLASH

-

2.25K x 8

1.15V ~ 5.5V

A/D 50x12b

Internal

-40°C ~ 105°C (TA)

Surface Mount

216-LQFP Exposed Pad

216-TEQFP (24x24)

CYT4BF8CDDQ0AESGS

Infineon Technologies

IC MCU 32BT 8.1875MB FLSH 176QFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Quad-Core
Speed: 100MHz, 350MHz
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 148
Program Memory Size: 8.1875MB (8.1875M x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 1M x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 99x12b SAR
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-TEQFP (24x24)

封裝: -

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32-Bit Quad-Core

100MHz, 350MHz

CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART

Brown-out Detect/Reset, DMA, POR, PWM, WDT

148

8.1875MB (8.1875M x 8)

FLASH

256 x 8

1M x 8

2.7V ~ 5.5V

A/D 99x12b SAR

Internal

-40°C ~ 125°C (TA)

Surface Mount

176-LQFP Exposed Pad

176-TEQFP (24x24)

CYT2B75BADQ0AZSGS

Infineon Technologies

IC MCU 32BT 1.0625MB FLSH 100QFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Dual-Core
Speed: 100MHz, 160MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O: 78
Program Memory Size: 1.0625MB (1.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: 96K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 57x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

庫存2,700

32-Bit Dual-Core

100MHz, 160MHz

CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

78

1.0625MB (1.0625M x 8)

FLASH

96K x 8

128K x 8

2.7V ~ 5.5V

A/D 57x12b SAR

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

CY8C4248BZS-L489

Infineon Technologies

IC MCU 32BIT 256KB FLSH 124VFBGA

Core Processor: ARM® Cortex®-M0
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT
Number of I/O: 98
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 124-VFBGA
Supplier Device Package: 124-VFBGA (9x9)

封裝: -

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32-Bit

48MHz

CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB

Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, Temp Sensor, WDT

98

256KB (256K x 8)

FLASH

-

32K x 8

1.71V ~ 5.5V

A/D 16x12b SAR; D/A 4x7/8b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

124-VFBGA

124-VFBGA (9x9)

CY9BF321LPMC1-GNE2

Infineon Technologies

IC MCU 32BIT 96KB FLASH 64LQFP

Core Processor: ARM® Cortex®-M3
Core Size: 32-Bit
Speed: 72MHz
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 23x12b SAR; D/A 2x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

封裝: -

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32-Bit

72MHz

CSIO, I2C, LINbus, UART/USART, USB

DMA, LVD, POR, PWM, WDT

50

96KB (96K x 8)

FLASH

-

16K x 8

2.7V ~ 5.5V

A/D 23x12b SAR; D/A 2x10b

External, Internal

-40°C ~ 105°C (TA)

Surface Mount

64-LQFP

64-LQFP (10x10)

CY9AF314NAPMC-G-MJE1

Infineon Technologies

IC MCU 32BIT 256KB 100LQFP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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-

CYT2B75BADQ0AZEGS

Infineon Technologies

IC MCU 32BT 1.0625MB FLSH 100QFP

Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Core Size: 32-Bit Dual-Core
Speed: 100MHz, 160MHz
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Number of I/O: 78
Program Memory Size: 1.0625MB (1.0625M x 8)
Program Memory Type: FLASH
EEPROM Size: 96K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 57x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

庫存2,691

32-Bit Dual-Core

100MHz, 160MHz

CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART

Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT

78

1.0625MB (1.0625M x 8)

FLASH

96K x 8

128K x 8

2.7V ~ 5.5V

A/D 57x12b SAR

External, Internal

-40°C ~ 125°C (TA)

Surface Mount

100-LQFP

100-LQFP (14x14)

CY9BF568NPMC-GNE2

Infineon Technologies

IC MCU 32B 1.03125MB FLSH 100QFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 160MHz
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 80
Program Memory Size: 1.03125MB (1.03125M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A 2x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

封裝: -

庫存2,685

32-Bit Single-Core

160MHz

CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB

DMA, LVD, POR, PWM, WDT

80

1.03125MB (1.03125M x 8)

FLASH

-

128K x 8

2.7V ~ 5.5V

A/D 24x12b SAR; D/A 2x12b

External, Internal

-40°C ~ 125°C (TJ)

Surface Mount

100-LQFP

100-LQFP (14x14)

CY8C68237FM9-BLET

Infineon Technologies

IC MCU ARM CORTEX PSOC 104LFCSP

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

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-