圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存5,376 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 160MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 160MHZ 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存54,000 |
|
1 | 1:4 | No/No | LVTTL | LVTTL | 160MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存5,632 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存6,352 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 20VFQFPN
|
封裝: 20-VFQFN Exposed Pad |
庫存6,240 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3.5x4.5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 20VFQFPN
|
封裝: 20-VFQFN Exposed Pad |
庫存2,400 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3.5x4.5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 200MHZ 16TSSOP
|
封裝: 16-TSSOP (0.173", 4.40mm Width) |
庫存2,320 |
|
1 | 1:5 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 200MHZ 16TSSOP
|
封裝: 16-TSSOP (0.173", 4.40mm Width) |
庫存32,280 |
|
1 | 1:5 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:16 650MHZ 52VFQFPN
|
封裝: 52-VFQFN Exposed Pad |
庫存2,464 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:16 650MHZ 52VFQFPN
|
封裝: 52-VFQFN Exposed Pad |
庫存4,096 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:16 450MHZ 64TQFP
|
封裝: 64-LQFP |
庫存7,552 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:16 450MHZ 64TQFP
|
封裝: 64-LQFP |
庫存3,184 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 650MHZ 40VFQFPN
|
封裝: 40-VFQFN Exposed Pad |
庫存4,576 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 650MHZ 40VFQFPN
|
封裝: 40-VFQFN Exposed Pad |
庫存5,904 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 650MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 450MHZ
|
封裝: 44-TQFP |
庫存2,048 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 44-TQFP | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:10 450MHZ
|
封裝: 44-TQFP |
庫存3,280 |
|
1 | 2:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 44-TQFP | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:6 800MHZ 28VFQFPN
|
封裝: 28-VFQFN Exposed Pad |
庫存3,152 |
|
1 | 2:6 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 800MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 450MHZ 32TQFP
|
封裝: 32-LQFP |
庫存2,832 |
|
1 | 2:6 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 450MHZ 32TQFP
|
封裝: 32-LQFP |
庫存4,576 |
|
1 | 2:6 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 450MHZ 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存6,352 |
|
1 | 2:4 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 450MHZ 24TSSOP
|
封裝: 24-TSSOP (0.173", 4.40mm Width) |
庫存2,960 |
|
1 | 2:4 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 450MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存6,912 |
|
1 | 1:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 450MHZ 20TSSOP
|
封裝: 20-TSSOP (0.173", 4.40mm Width) |
庫存2,448 |
|
1 | 1:2 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 450MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:16 1GHZ 52VFQFPN
|
封裝: 52-VFQFN Exposed Pad |
庫存7,456 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:16 1GHZ 52VFQFPN
|
封裝: 52-VFQFN Exposed Pad |
庫存3,552 |
|
1 | 2:16 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-VFQFPN (8x8) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 40VFQFPN
|
封裝: 40-VFQFN Exposed Pad |
庫存5,104 |
|
1 | 1:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 1GHZ 40VFQFPN
|
封裝: 40-VFQFN Exposed Pad |
庫存3,584 |
|
1 | 1:10 | Yes/Yes | CML, eHSTL, HSTL, LVDS, LVEPECL, LVPECL, LVTTL | LVDS | 1GHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 250MHZ 48TSSOP
|
封裝: 48-TFSOP (0.240", 6.10mm Width) |
庫存6,592 |
|
1 | 1:5 | Yes/Yes | eHSTL, HSTL, LVPECL, LVTTL | eHSTL, HSTL, LVTTL | 250MHz | 2.4 V ~ 2.6 V | -40°C ~ 85°C | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |