頁 3 - Epson Electronics America Inc-Semiconductor Div 產品

零件編號	製造商	描述	封裝	庫存
S1F77602Y0A000L	Epson Electronics America Inc-Semiconductor Div	IC BATTERY LEAK PREVENTION SOT89 Function: - Battery Chemistry: - Number of Cells: - Fault Protection: - Interface: - Operating Temperature: - Package / Case: - Supplier Device Package: SOT-89-3	封裝: -	庫存3,200
S2D13719F00A200	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 80LQFP Type: - Applications: - Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-QFP (12x12)	封裝: 80-LQFP	庫存2,864
S2D13515F00A100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 256QFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 256-LQFP Supplier Device Package: 256-QFP (28x28)	封裝: 256-LQFP	庫存6,304
S1D13A04B00B200	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 121PFBGA Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 121-BGA Supplier Device Package: -	封裝: 121-BGA	庫存5,952
S1D13742F01A200	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 144QFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-QFP (20x20)	封裝: 144-LQFP	庫存6,288
S1D13701F00A100	Epson Electronics America Inc-Semiconductor Div	IC OLED CONTROLLER/MEMORY 64-QFP Type: - Applications: - Mounting Type: Surface Mount Package / Case: 64-QFP Supplier Device Package: -	封裝: 64-QFP	庫存3,536
S1D13517F00A100	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 128LQFP Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 128-LQFP Supplier Device Package: 128-QFP15 (16x16)	封裝: 128-LQFP	庫存6,944
S1D13505F00A200	Epson Electronics America Inc-Semiconductor Div	IC GRAPHIC LCD CTRLR 128LQFP Type: Graphic Controller Applications: CRT, LCD Display Mounting Type: Surface Mount Package / Case: 128-LQFP Supplier Device Package: 128-QFP15 (14x14)	封裝: 128-LQFP	庫存19,368
S1R72U06F12E100	Epson Electronics America Inc-Semiconductor Div	IC CONTROLLER USB 48QFP Protocol: USB Function: Host Controller Interface: UART Standards: USB 2.0 Voltage - Supply: 1.8V, 3.3V Current - Supply: 30mA Operating Temperature: -40°C ~ 85°C Package / Case: 48-LQFP Supplier Device Package: 48-QFP (7x7)	封裝: 48-LQFP	庫存4,720
S1R72U01F12E300	Epson Electronics America Inc-Semiconductor Div	IC CONTROLLER USB 48QFP Protocol: USB Function: Host Controller Interface: UART Standards: USB 2.0 Voltage - Supply: 1.8V, 3.3V Current - Supply: 30mA Operating Temperature: -40°C ~ 85°C Package / Case: 48-LQFP Supplier Device Package: 48-QFP (7x7)	封裝: 48-LQFP	庫存7,312
S1C17704F401100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 64KB FLASH 144TQFP Core Processor: S1C17 Core Size: 16-Bit Speed: 8.2MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: LCD, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -20°C ~ 70°C (TA) Mounting Type: - Package / Case: 144-TQFP Supplier Device Package: -	封裝: 144-TQFP	庫存5,152
S1C17M01F00C100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 64TQFP Core Processor: S1C17 Core Size: 16-Bit Speed: 16.3MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: AMRC, LCD, PWM, RFC, WDT Number of I/O: 19 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-TQFP Supplier Device Package: -	封裝: 64-TQFP	庫存15,432
S1V3S344A00A800-160	Epson Electronics America Inc-Semiconductor Div	VOICE GUIDANCE IC (FLASH) Function: Voice Processor Applications: Signal Processing Number of Channels: 1 Interface: SPI Voltage - Supply: 3.3 V ~ 5 V Operating Temperature: - Specifications: - Package / Case: 52-LQFP Supplier Device Package: 52-QFP13 (10x10)	封裝: 52-LQFP	庫存7,312
S1C17W15F002100-90	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 64KB FLASH 4KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存3,744
S1C17W15F003100-260	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 64KB FLASH 4KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,152
S1C17W03F101100-250	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ16KB FLASH 2KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,440
S1C17W13F002100-260	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 48KB FLASH 2KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存4,048
S1C17W13F002100	Epson Electronics America Inc-Semiconductor Div	16-BIT MCU 4.2MHZ 48KB FLASH 2KB Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存2,656
S1D13A05B00B200-240	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER BUILT-IN 256KB SR Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 121-TFBGA Supplier Device Package: 121-PFBGA (10x10)	封裝: 121-TFBGA	庫存4,880
S1D13742F01A200-60	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER BUILT-IN 768KB SR Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 144-LQFP Supplier Device Package: 144-QFP20 (20x20)	封裝: 144-LQFP	庫存6,624
S1D13705F00A200-119	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER BUILT-IN 80KB SRA Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 80-LQFP Supplier Device Package: 80-QFP14 (12x12)	封裝: 80-LQFP	庫存2,416
S1D13717F00A200-40	Epson Electronics America Inc-Semiconductor Div	LCD CONTROLLER BUILT-IN 224KB SR Type: Graphic Controller Applications: LCD Display Mounting Type: Surface Mount Package / Case: 176-LQFP Supplier Device Package: 176-QFP21 (24x24)	封裝: 176-LQFP	庫存3,872
S1C17M23F001100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 24SQFN4 Core Processor: S1C17 Core Size: 16-Bit Speed: 21MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT Number of I/O: - Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-SQFN4 (4x4)	封裝: -	Request a Quote
S1C17M31F001100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 48KB FLASH 48TQFP12 Core Processor: S1C17 Core Size: 16-Bit Speed: 17.12MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT Number of I/O: 37 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 3x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TQFP Supplier Device Package: 48-TQFP12 (7x7)	封裝: -	Request a Quote
S1C17M31F001100-250	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 48KB FLASH 48TQFP12 Core Processor: S1C17 Core Size: 16-Bit Speed: 17.12MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT Number of I/O: 37 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 3x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TQFP Supplier Device Package: 48-TQFP12 (7x7)	封裝: -	Request a Quote
S1C17M23F001100-490	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 32KB FLASH 24SQFN4 Core Processor: S1C17 Core Size: 16-Bit Speed: 21MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT Number of I/O: - Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-SQFN4 (4x4)	封裝: -	Request a Quote
S1C17M33F001100	Epson Electronics America Inc-Semiconductor Div	IC MCU 16BIT 96KB FLASH 80TQFP14 Core Processor: S1C17 Core Size: 16-Bit Speed: 17.12MHz Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT Number of I/O: 65 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 6x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 80-TQFP Supplier Device Package: 80-TQFP14 (12x12)	封裝: -	Request a Quote
S1C31D01D101000	Epson Electronics America Inc-Semiconductor Div	IC MCU 32BIT 256KB FLASH CHIP Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 21MHz Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT Number of I/O: 57 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Data Converters: A/D 8x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: Die Supplier Device Package: Chip	封裝: -	Request a Quote

S1F77602Y0A000L

Epson Electronics America Inc-Semiconductor Div

IC BATTERY LEAK PREVENTION SOT89

Function: -
Battery Chemistry: -
Number of Cells: -
Fault Protection: -
Interface: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: SOT-89-3

封裝: -

庫存3,200

S2D13719F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 80LQFP

Type: -
Applications: -
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-QFP (12x12)

封裝: 80-LQFP

庫存2,864

S2D13515F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 256QFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 256-LQFP
Supplier Device Package: 256-QFP (28x28)

封裝: 256-LQFP

庫存6,304

S1D13A04B00B200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 121PFBGA

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 121-BGA
Supplier Device Package: -

封裝: 121-BGA

庫存5,952

S1D13742F01A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 144QFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-QFP (20x20)

封裝: 144-LQFP

庫存6,288

S1D13701F00A100

Epson Electronics America Inc-Semiconductor Div

IC OLED CONTROLLER/MEMORY 64-QFP

Type: -
Applications: -
Mounting Type: Surface Mount
Package / Case: 64-QFP
Supplier Device Package: -

封裝: 64-QFP

庫存3,536

S1D13517F00A100

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128LQFP

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Supplier Device Package: 128-QFP15 (16x16)

封裝: 128-LQFP

庫存6,944

S1D13505F00A200

Epson Electronics America Inc-Semiconductor Div

IC GRAPHIC LCD CTRLR 128LQFP

Type: Graphic Controller
Applications: CRT, LCD Display
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Supplier Device Package: 128-QFP15 (14x14)

封裝: 128-LQFP

庫存19,368

S1R72U06F12E100

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 48QFP

Protocol: USB
Function: Host Controller
Interface: UART
Standards: USB 2.0
Voltage - Supply: 1.8V, 3.3V
Current - Supply: 30mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-LQFP
Supplier Device Package: 48-QFP (7x7)

封裝: 48-LQFP

庫存4,720

S1R72U01F12E300

Epson Electronics America Inc-Semiconductor Div

IC CONTROLLER USB 48QFP

Protocol: USB
Function: Host Controller
Interface: UART
Standards: USB 2.0
Voltage - Supply: 1.8V, 3.3V
Current - Supply: 30mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-LQFP
Supplier Device Package: 48-QFP (7x7)

封裝: 48-LQFP

庫存7,312

S1C17704F401100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 64KB FLASH 144TQFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 8.2MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: LCD, PWM, WDT
Number of I/O: 28
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -20°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 144-TQFP
Supplier Device Package: -

封裝: 144-TQFP

庫存5,152

S1C17M01F00C100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 64TQFP

Core Processor: S1C17
Core Size: 16-Bit
Speed: 16.3MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: AMRC, LCD, PWM, RFC, WDT
Number of I/O: 19
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-TQFP
Supplier Device Package: -

封裝: 64-TQFP

庫存15,432

S1V3S344A00A800-160

Epson Electronics America Inc-Semiconductor Div

VOICE GUIDANCE IC (FLASH)

Function: Voice Processor
Applications: Signal Processing
Number of Channels: 1
Interface: SPI
Voltage - Supply: 3.3 V ~ 5 V
Operating Temperature: -
Specifications: -
Package / Case: 52-LQFP
Supplier Device Package: 52-QFP13 (10x10)

封裝: 52-LQFP

庫存7,312

S1C17W15F002100-90

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存3,744

S1C17W15F003100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,152

S1C17W03F101100-250

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ16KB FLASH 2KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,440

S1C17W13F002100-260

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存4,048

S1C17W13F002100

Epson Electronics America Inc-Semiconductor Div

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存2,656

S1D13A05B00B200-240

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 256KB SR

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 121-TFBGA
Supplier Device Package: 121-PFBGA (10x10)

封裝: 121-TFBGA

庫存4,880

S1D13742F01A200-60

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 768KB SR

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Supplier Device Package: 144-QFP20 (20x20)

封裝: 144-LQFP

庫存6,624

S1D13705F00A200-119

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 80KB SRA

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Supplier Device Package: 80-QFP14 (12x12)

封裝: 80-LQFP

庫存2,416

S1D13717F00A200-40

Epson Electronics America Inc-Semiconductor Div

LCD CONTROLLER BUILT-IN 224KB SR

Type: Graphic Controller
Applications: LCD Display
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Supplier Device Package: 176-QFP21 (24x24)

封裝: 176-LQFP

庫存3,872

S1C17M23F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 24SQFN4

Core Processor: S1C17
Core Size: 16-Bit
Speed: 21MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Number of I/O: -
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-SQFN4 (4x4)

封裝: -

Request a Quote

S1C17M31F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

Core Processor: S1C17
Core Size: 16-Bit
Speed: 17.12MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
Number of I/O: 37
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 3x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Supplier Device Package: 48-TQFP12 (7x7)

封裝: -

Request a Quote

S1C17M31F001100-250

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 48KB FLASH 48TQFP12

Core Processor: S1C17
Core Size: 16-Bit
Speed: 17.12MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
Number of I/O: 37
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 3x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-TQFP
Supplier Device Package: 48-TQFP12 (7x7)

封裝: -

Request a Quote

S1C17M23F001100-490

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 32KB FLASH 24SQFN4

Core Processor: S1C17
Core Size: 16-Bit
Speed: 21MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Number of I/O: -
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-SQFN4 (4x4)

封裝: -

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S1C17M33F001100

Epson Electronics America Inc-Semiconductor Div

IC MCU 16BIT 96KB FLASH 80TQFP14

Core Processor: S1C17
Core Size: 16-Bit
Speed: 17.12MHz
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, Voltage Detect, WDT
Number of I/O: 65
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 6x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 80-TQFP
Supplier Device Package: 80-TQFP14 (12x12)

封裝: -

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S1C31D01D101000

Epson Electronics America Inc-Semiconductor Div

IC MCU 32BIT 256KB FLASH CHIP

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 21MHz
Connectivity: I2C, IrDA, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, Voltage Detect, WDT
Number of I/O: 57
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Data Converters: A/D 8x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: Die
Supplier Device Package: Chip

封裝: -

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