頁 3 - Aries Electronics 產品

零件編號	製造商	描述	封裝	庫存
441-PGG21001-40	Aries Electronics	CONN SOCKET PGA GOLD Type: PGA Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,024
40-3575-16	Aries Electronics	CONN IC DIP SOCKET ZIF 40POS GLD Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	封裝: -	庫存3,672
24-C300-21	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	封裝: -	庫存2,538
40-81150-610C	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,694
48-6574-10	Aries Electronics	CONN IC DIP SOCKET ZIF 48POS GLD Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Operating Temperature: -	封裝: -	庫存7,380
28-8250-610C	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 28 (2 x 14) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存8,820
32-9513-11H	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD Type: DIP, 0.9" (22.86mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存8,640
20-81156-310C	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 20 (2 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存4,248
10-7925-10	Aries Electronics	CONN SOCKET SIP 10POS TIN Type: SIP Number of Positions or Pins (Grid): 10 (1 x 10) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,276
14-8620-310C	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame, Elevated Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,164
18-0503-20	Aries Electronics	CONN SOCKET SIP 18POS GOLD Type: SIP Number of Positions or Pins (Grid): 18 (1 x 18) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: - Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA), Nylon, Glass Filled Operating Temperature: -	封裝: -	庫存5,472
48-6518-11	Aries Electronics	CONN IC DIP SOCKET 48POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 48 (2 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存3,456
14-6822-90C	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole, Right Angle, Horizontal Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存7,146
24-0511-10	Aries Electronics	CONN SOCKET SIP 24POS TIN Type: SIP Number of Positions or Pins (Grid): 24 (1 x 24) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 50µin (1.27µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: - Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 50µin (1.27µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 105°C	封裝: -	庫存3,492
24-3513-10H	Aries Electronics	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存2,592
14-3501-31	Aries Electronics	CONN IC DIP SOCKET 14POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 14 (2 x 7) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	封裝: -	庫存6,642
16-3511-11	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 16 (2 x 8) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Phosphor Bronze Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10µin (0.25µm) Contact Material - Post: Phosphor Bronze Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -55°C ~ 125°C	封裝: -	庫存7,290
40-6518-10T	Aries Electronics	CONN IC DIP SOCKET 40POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 40 (2 x 20) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存5,022
08-3513-10T	Aries Electronics	CONN IC DIP SOCKET 8POS GOLD Type: DIP, 0.3" (7.62mm) Row Spacing Number of Positions or Pins (Grid): 8 (2 x 4) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10µin (0.25µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Brass Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Operating Temperature: -	封裝: -	庫存2,160
361-PRS19001-12	Aries Electronics	CONN SOCKET PGA ZIF GOLD Type: PGA, ZIF (ZIP) Number of Positions or Pins (Grid): - Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polyphenylene Sulfide (PPS) Operating Temperature: -65°C ~ 125°C	封裝: -	庫存5,814
84-505-110	Aries Electronics	SOCKET ADAPTER PLCC TO 84PGA Convert From (Adapter End): PLCC Convert To (Adapter End): PGA Number of Pins: 84 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存7,398
28-555000-00	Aries Electronics	SOCKET ADAPTER SSOP TO 28SOWIC Convert From (Adapter End): SSOP Convert To (Adapter End): SOWIC Number of Pins: 28 Pitch - Mating: 0.026" (0.65mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,858
14-666000-00	Aries Electronics	SOCKET ADAPTER SOIC TO 14SOWIC Convert From (Adapter End): SOIC Convert To (Adapter End): SOWIC Number of Pins: 14 Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: - Mounting Type: Surface Mount Termination: Solder Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存6,822
1110748	Aries Electronics	SOCKET ADAPTER SOT25 TO 6DIP 0.3 Convert From (Adapter End): SOT-25 Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing Number of Pins: 6 Pitch - Mating: 0.037" (0.95mm) Contact Finish - Mating: - Mounting Type: Through Hole Termination: Solder Pitch - Post: - Contact Finish - Post: Tin-Lead Housing Material: - Board Material: FR4 Epoxy Glass	封裝: -	庫存4,680
36-6625-20	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Post Number of Positions: 36 Pitch: 0.100" (2.54mm) Number of Rows: 2 Row Spacing: 0.600" (15.24mm) Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Tin Contact Finish Thickness: 200µin (5.08µm) Color: Black	封裝: -	庫存5,238
02-6625-11	Aries Electronics	625 DIP HDR SCRW MACH CONTACT Connector Type: DIP, DIL - Header Contact Type: Forked Number of Positions: 2 Pitch: - Number of Rows: 2 Row Spacing: 0.600" (15.24mm) Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Gold Contact Finish Thickness: 10µin (0.25µm) Color: Black	封裝: -	庫存3,582
02-0625-70	Aries Electronics	0625 PIN-LINE HDR SCRW MACH CONT Connector Type: Header Strip Contact Type: Post Number of Positions: 2 Pitch: 0.100" (2.54mm) Number of Rows: 1 Row Spacing: - Mounting Type: Through Hole Termination: Solder Features: - Contact Finish: Tin Contact Finish Thickness: 200µin (5.08µm) Color: Black	封裝: -	庫存5,184
14-658-10	Aries Electronics	680 PROGRAM HEADERS/COVERS Accessory Type: Cap (Cover) Number of Positions: 14 For Use With/Related Products: 680 Series Features: Top Slot	封裝: -	庫存2,898

441-PGG21001-40

Aries Electronics

CONN SOCKET PGA GOLD

Type: PGA
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,024

40-3575-16

Aries Electronics

CONN IC DIP SOCKET ZIF 40POS GLD

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存3,672

24-C300-21

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存2,538

40-81150-610C

Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,694

48-6574-10

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS GLD

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存7,380

28-8250-610C

Aries Electronics

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存8,820

32-9513-11H

Aries Electronics

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存8,640

20-81156-310C

Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存4,248

10-7925-10

Aries Electronics

CONN SOCKET SIP 10POS TIN

Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,276

14-8620-310C

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,164

18-0503-20

Aries Electronics

CONN SOCKET SIP 18POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA), Nylon, Glass Filled
Operating Temperature: -

封裝: -

庫存5,472

48-6518-11

Aries Electronics

CONN IC DIP SOCKET 48POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存3,456

14-6822-90C

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole, Right Angle, Horizontal
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存7,146

24-0511-10

Aries Electronics

CONN SOCKET SIP 24POS TIN

Type: SIP
Number of Positions or Pins (Grid): 24 (1 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C

封裝: -

庫存3,492

24-3513-10H

Aries Electronics

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存2,592

14-3501-31

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存6,642

16-3511-11

Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10µin (0.25µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 125°C

封裝: -

庫存7,290

40-6518-10T

Aries Electronics

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存5,022

08-3513-10T

Aries Electronics

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -

封裝: -

庫存2,160

361-PRS19001-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存5,814

84-505-110

Aries Electronics

SOCKET ADAPTER PLCC TO 84PGA

Convert From (Adapter End): PLCC
Convert To (Adapter End): PGA
Number of Pins: 84
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存7,398

28-555000-00

Aries Electronics

SOCKET ADAPTER SSOP TO 28SOWIC

Convert From (Adapter End): SSOP
Convert To (Adapter End): SOWIC
Number of Pins: 28
Pitch - Mating: 0.026" (0.65mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,858

14-666000-00

Aries Electronics

SOCKET ADAPTER SOIC TO 14SOWIC

Convert From (Adapter End): SOIC
Convert To (Adapter End): SOWIC
Number of Pins: 14
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: -
Mounting Type: Surface Mount
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存6,822

1110748

Aries Electronics

SOCKET ADAPTER SOT25 TO 6DIP 0.3

Convert From (Adapter End): SOT-25
Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
Number of Pins: 6
Pitch - Mating: 0.037" (0.95mm)
Contact Finish - Mating: -
Mounting Type: Through Hole
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin-Lead
Housing Material: -
Board Material: FR4 Epoxy Glass

封裝: -

庫存4,680

36-6625-20

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Post
Number of Positions: 36
Pitch: 0.100" (2.54mm)
Number of Rows: 2
Row Spacing: 0.600" (15.24mm)
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Tin
Contact Finish Thickness: 200µin (5.08µm)
Color: Black

封裝: -

庫存5,238

02-6625-11

Aries Electronics

625 DIP HDR SCRW MACH CONTACT

Connector Type: DIP, DIL - Header
Contact Type: Forked
Number of Positions: 2
Pitch: -
Number of Rows: 2
Row Spacing: 0.600" (15.24mm)
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Gold
Contact Finish Thickness: 10µin (0.25µm)
Color: Black

封裝: -

庫存3,582

02-0625-70

Aries Electronics

0625 PIN-LINE HDR SCRW MACH CONT

Connector Type: Header Strip
Contact Type: Post
Number of Positions: 2
Pitch: 0.100" (2.54mm)
Number of Rows: 1
Row Spacing: -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Finish: Tin
Contact Finish Thickness: 200µin (5.08µm)
Color: Black

封裝: -

庫存5,184

14-658-10

Aries Electronics

680 PROGRAM HEADERS/COVERS

Accessory Type: Cap (Cover)
Number of Positions: 14
For Use With/Related Products: 680 Series
Features: Top Slot

封裝: -

庫存2,898