圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Contact Type | Pitch - Mating | Style | Shrouding | Number of Positions | Number of Positions Loaded | Number of Rows | Row Spacing - Mating | Mounting Type | Termination | Fastening Type | Contact Length - Mating | Contact Length - Post | Overall Contact Length | Insulation Height | Contact Shape | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material | Insulation Material | Features | Operating Temperature | Ingress Protection | Material Flammability Rating | Insulation Color |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol FCI |
BS II SNGL
|
封裝: - |
庫存3,978 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 11 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BS II SNGL
|
封裝: - |
庫存7,020 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 15 | All | 1 | - | Through Hole | Solder | Push-Pull | 0.230" (5.84mm) | 0.095" (2.41mm) | 0.425" (10.80mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
CONN HEADER 8PS .100 SMD GOLD
|
封裝: - |
庫存2,286 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.315" (8.00mm) | - | - | 0.100" (2.54mm) | Square | Gold, GXT? | 15µin (0.38µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
CONN HEADER 8PS .100 SMD GOLD
|
封裝: - |
庫存4,572 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 8 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.232" (5.90mm) | - | - | 0.100" (2.54mm) | Square | Gold, GXT? | 15µin (0.38µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存2,574 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 6 | All | 2 | 0.100" (2.54mm) | Surface Mount | Solder | Push-Pull | 0.232" (5.90mm) | - | - | 0.100" (2.54mm) | Square | Gold, GXT? | 15µin (0.38µm) | Tin | Phosphor Bronze | Thermoplastic | Pick and Place | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK II SR STRAIGHT RET
|
封裝: - |
庫存3,060 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 16 | All | 1 | - | Through Hole | Press-Fit, Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | 0.450" (11.43mm) | 0.100" (2.54mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
CONN RCPT SAS VERT
|
封裝: - |
庫存5,454 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | 9 | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | Tin | Copper Alloy | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存2,988 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.095" (2.41mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BS II DUAL RA
|
封裝: - |
庫存5,364 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.318" (8.08mm) | 0.110" (2.79mm) | - | 0.240" (6.10mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BS II
|
封裝: - |
庫存5,292 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BS II
|
封裝: - |
庫存3,418 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK II SR RIGHT ANGLE
|
封裝: - |
庫存7,272 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.095" (2.41mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK II SNGL RA
|
封裝: - |
庫存3,708 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.095" (2.41mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
BERGSTIK II SNGL RA
|
封裝: - |
庫存3,510 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.095" (2.41mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
QUICKIE
|
封裝: - |
庫存5,562 |
|
Male Pin | 0.100" (2.54mm) | Board to Cable/Wire | Shrouded - 4 Wall | 14 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.240" (6.10mm) | 0.165" (4.19mm) | - | 0.344" (8.75mm) | Circular | Gold or Gold-Palladium | - | Tin | Copper Alloy | Polybutylene Terephthalate (PBT) | Keying Slot | -55°C ~ 125°C | - | UL94 V-0 | Gray |
||
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存2,556 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存2,502 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.120" (3.05mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存8,514 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 15µin (0.38µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存6,174 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.090" (2.29mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK R/A
|
封裝: - |
庫存8,478 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.100" (2.54mm) | Through Hole, Right Angle | Solder | Push-Pull | 0.230" (5.84mm) | 0.095" (2.41mm) | - | 0.190" (4.83mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HD VT TH SHRD
|
封裝: - |
庫存5,580 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Shrouded - 4 Wall | 6 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Push-Pull | 0.120" (3.05mm) | 0.091" (2.30mm) | - | 0.213" (5.40mm) | Square | Gold | Flash | Tin | Copper Alloy | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HD SMT
|
封裝: - |
庫存8,190 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | 0.120" (3.05mm) | - | - | - | Square | Gold | 10µin (0.25µm) | Tin | Copper Alloy | Thermoplastic | Pick and Place | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HD VT TH
|
封裝: - |
庫存8,694 |
|
Male Pin | 0.050" (1.27mm) | Board to Board | Unshrouded | 10 | All | 2 | 0.050" (1.27mm) | Through Hole | Solder | Push-Pull | 0.120" (3.05mm) | 0.091" (2.30mm) | 0.309" (7.86mm) | 0.098" (2.50mm) | Square | Gold, GXT? | 30µin (0.76µm) | Tin | Copper Alloy | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
HEADER BERGSTIK
|
封裝: - |
庫存4,842 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 8 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.310" (7.87mm) | 0.250" (6.35mm) | - | 0.095" (2.41mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | - | Phosphor Bronze | - | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
MINITEK
|
封裝: - |
庫存4,716 |
|
Male Pin | 0.079" (2.00mm) | Board to Board | Unshrouded | 4 | All | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | 0.157" (4.00mm) | 0.118" (3.00mm) | 0.335" (8.51mm) | 0.059" (1.50mm) | Square | Gold, GXT? | 30µin (0.76µm) | Tin | Copper Alloy | Thermoplastic | - | - | - | UL94 V-0 | Black |
||
Amphenol FCI |
WTB 1.25 WAFER 90 SMT
|
封裝: - |
庫存2,100 |
|
Male Pin | 0.049" (1.25mm) | Board to Cable/Wire | Shrouded - 4 Wall | 10 | All | 1 | - | Surface Mount, Right Angle | Solder | Detent Lock | - | - | - | 0.134" (3.40mm) | Rectangular | Tin | - | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | Solder Retention | -40°C ~ 105°C | - | UL94 V-0 | Natural |
||
Amphenol FCI |
WTB 1.25 WAFER 180 SMT
|
封裝: - |
庫存4,806 |
|
Male Pin | 0.049" (1.25mm) | Board to Cable/Wire | Shrouded - 4 Wall | 10 | All | 1 | - | Surface Mount | Solder | Detent Lock | 0.089" (2.25mm) | - | - | 0.185" (4.70mm) | Rectangular | Tin | - | Tin | Copper Alloy | Liquid Crystal Polymer (LCP) | Solder Retention | -40°C ~ 105°C | - | UL94 V-0 | Natural |
||
Amphenol FCI |
BERGSTIK
|
封裝: - |
庫存4,302 |
|
Male Pin | 0.100" (2.54mm) | Board to Board | Unshrouded | 5 | All | 1 | - | Through Hole, Right Angle | Solder | Push-Pull | 0.225" (5.72mm) | 0.101" (2.57mm) | - | 0.094" (2.40mm) | Square | Gold or Gold, GXT? | 30µin (0.76µm) | Tin | Phosphor Bronze | Thermoplastic | - | - | - | UL94 V-0 | Black |