頁 429 - Amphenol FCI 產品 - 背板連接器 - 專用 | 黑森爾電子
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Amphenol FCI 產品 - 背板連接器 - 專用

記錄 13,464
頁  429/481
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零件編號
製造商
描述
封裝
庫存
數量
Connector Type
Connector Style
Number of Positions
Number of Positions Loaded
Pitch
Number of Rows
Number of Columns
Mounting Type
Termination
Contact Layout, Typical
Features
Contact Finish
Contact Finish Thickness
Color
50015-5068G
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 68
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 17
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存3,294
Header, Male Pins
High Density (HDC, HDI, HPC)
68
All
0.100" (2.54mm)
4
17
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-5064J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 64
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 16
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存3,366
Header, Male Pins
High Density (HDC, HDI, HPC)
64
All
0.100" (2.54mm)
4
16
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-5060J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 60
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 15
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,174
Header, Male Pins
High Density (HDC, HDI, HPC)
60
All
0.100" (2.54mm)
4
15
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-5060A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 60
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 15
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,802
Header, Male Pins
High Density (HDC, HDI, HPC)
60
All
0.100" (2.54mm)
4
15
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-5052J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 52
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 13
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,696
Header, Male Pins
High Density (HDC, HDI, HPC)
52
All
0.100" (2.54mm)
4
13
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-5048C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 48
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 12
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold or Gold, GXT?
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存3,924
Header, Male Pins
High Density (HDC, HDI, HPC)
48
All
0.100" (2.54mm)
4
12
Through Hole
Solder
-
Mating Guide
Gold or Gold, GXT?
30µin (0.76µm)
Black
50015-1320J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 320
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 80
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存5,346
Header, Male Pins
High Density (HDC, HDI, HPC)
320
All
0.100" (2.54mm)
4
80
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1320D
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 320
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 80
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存5,994
Header, Male Pins
High Density (HDC, HDI, HPC)
320
All
0.100" (2.54mm)
4
80
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1320C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 320
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 80
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,138
Header, Male Pins
High Density (HDC, HDI, HPC)
320
All
0.100" (2.54mm)
4
80
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1320A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 320
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 80
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,046
Header, Male Pins
High Density (HDC, HDI, HPC)
320
All
0.100" (2.54mm)
4
80
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1300G
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 300
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 75
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,642
Header, Male Pins
High Density (HDC, HDI, HPC)
300
All
0.100" (2.54mm)
4
75
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1300C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 300
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 75
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,804
Header, Male Pins
High Density (HDC, HDI, HPC)
300
All
0.100" (2.54mm)
4
75
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1260J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 260
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 65
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,390
Header, Male Pins
High Density (HDC, HDI, HPC)
260
All
0.100" (2.54mm)
4
65
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1260D
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 260
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 65
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存4,914
Header, Male Pins
High Density (HDC, HDI, HPC)
260
All
0.100" (2.54mm)
4
65
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1260C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 260
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 65
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,550
Header, Male Pins
High Density (HDC, HDI, HPC)
260
All
0.100" (2.54mm)
4
65
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1240J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 60
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,700
Header, Male Pins
High Density (HDC, HDI, HPC)
240
All
0.100" (2.54mm)
4
60
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1240A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 240
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 60
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,794
Header, Male Pins
High Density (HDC, HDI, HPC)
240
All
0.100" (2.54mm)
4
60
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1232D
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 232
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 58
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,002
Header, Male Pins
High Density (HDC, HDI, HPC)
232
All
0.100" (2.54mm)
4
58
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1220G
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 220
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 55
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,748
Header, Male Pins
High Density (HDC, HDI, HPC)
220
All
0.100" (2.54mm)
4
55
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1220C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 220
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 55
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,272
Header, Male Pins
High Density (HDC, HDI, HPC)
220
All
0.100" (2.54mm)
4
55
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1212A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 212
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 53
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存8,460
Header, Male Pins
High Density (HDC, HDI, HPC)
212
All
0.100" (2.54mm)
4
53
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1200G
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 200
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 25
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,542
Header, Male Pins
High Density (HDC, HDI, HPC)
200
All
0.100" (2.54mm)
4
25
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1200C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 200
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 25
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存6,714
Header, Male Pins
High Density (HDC, HDI, HPC)
200
All
0.100" (2.54mm)
4
25
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1200A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 200
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 25
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,394
Header, Male Pins
High Density (HDC, HDI, HPC)
200
All
0.100" (2.54mm)
4
25
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1168J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 168
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 42
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存7,164
Header, Male Pins
High Density (HDC, HDI, HPC)
168
All
0.100" (2.54mm)
4
42
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1160C
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 160
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 40
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存3,654
Header, Male Pins
High Density (HDC, HDI, HPC)
160
All
0.100" (2.54mm)
4
40
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1160A
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 160
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 40
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,214
Header, Male Pins
High Density (HDC, HDI, HPC)
160
All
0.100" (2.54mm)
4
40
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black
50015-1148J
Amphenol FCI

4 ROW VERTICAL HEADER SOLDER

  • Connector Usage: Daughtercard
  • Connector Type: Header, Male Pins
  • Connector Style: High Density (HDC, HDI, HPC)
  • Number of Positions: 148
  • Number of Positions Loaded: All
  • Pitch: 0.100" (2.54mm)
  • Number of Rows: 4
  • Number of Columns: 37
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact Layout, Typical: -
  • Features: Mating Guide
  • Contact Finish: Gold
  • Contact Finish Thickness: 30µin (0.76µm)
  • Color: Black
封裝: -
庫存2,556
Header, Male Pins
High Density (HDC, HDI, HPC)
148
All
0.100" (2.54mm)
4
37
Through Hole
Solder
-
Mating Guide
Gold
30µin (0.76µm)
Black