Xilinx Inc. 產品

XC18V04VQ44C0100

Xilinx Inc.

RE-PROGRAMMABLE 4MB PROM

• Programmable Type: In System Programmable
• Memory Size: 4Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

XC7Z045-2FBG676CES

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XCZU7EV-L1FFVC1156I

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XCZU5EV-L1FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

XCZU9CG-2FFVB1156I

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC2S400E-6FT256C

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 163840
• Number of I/O: 182
• Number of Gates: 400000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XC2V6000-5FF1152I

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

• Number of LABs/CLBs: 8448
• Number of Logic Elements/Cells: -
• Total RAM Bits: 2654208
• Number of I/O: 824
• Number of Gates: 6000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

XC2V40-5CSG144C

Xilinx Inc.

IC FPGA 88 I/O 144CSBGA

• Number of LABs/CLBs: 64
• Number of Logic Elements/Cells: -
• Total RAM Bits: 73728
• Number of I/O: 88
• Number of Gates: 40000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-TFBGA, CSPBGA
• Supplier Device Package: 144-LCSBGA (12x12)

封裝: 144-TFBGA, CSPBGA

XC2V4000-4FFG1152I

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

• Number of LABs/CLBs: 5760
• Number of Logic Elements/Cells: -
• Total RAM Bits: 2211840
• Number of I/O: 824
• Number of Gates: 4000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

封裝: 1152-BBGA, FCBGA

XCV405E-8BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 2400
• Number of Logic Elements/Cells: 10800
• Total RAM Bits: 573440
• Number of I/O: 404
• Number of Gates: 129600
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

XCV1600E-6FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

• Number of LABs/CLBs: 7776
• Number of Logic Elements/Cells: 34992
• Total RAM Bits: 589824
• Number of I/O: 512
• Number of Gates: 2188742
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 680-LBGA Exposed Pad
• Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

XC4VFX140-10FFG1517I

Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

• Number of LABs/CLBs: 15792
• Number of Logic Elements/Cells: 142128
• Total RAM Bits: 10174464
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

XC7VX485T-1FFG1927I

Xilinx Inc.

IC FPGA 600 I/O 1927FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1927-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

XC2VP50-6FFG1517I

Xilinx Inc.

IC FPGA 852 I/O 1517FCBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 852
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

XC5VLX110T-2FFV1136C

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

XC2VP30-6FF896I

Xilinx Inc.

IC FPGA 556 I/O 896FCBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 556
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

封裝: 896-BBGA, FCBGA

XC4VLX60-11FF1148C

Xilinx Inc.

IC FPGA 640 I/O 1148FCBGA

• Number of LABs/CLBs: 6656
• Number of Logic Elements/Cells: 59904
• Total RAM Bits: 2949120
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

XC5VFX30T-2FFG665I

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

• Number of LABs/CLBs: 2560
• Number of Logic Elements/Cells: 32768
• Total RAM Bits: 2506752
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 665-BBGA, FCBGA
• Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

XC6VLX75T-2FFG784C

Xilinx Inc.

IC FPGA 360 I/O 784FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 360
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

封裝: 784-BBGA, FCBGA

XC5VLX50-1FFG1153C

Xilinx Inc.

IC FPGA 560 I/O 1153FCBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 560
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1153-BBGA, FCBGA
• Supplier Device Package: 1153-FCBGA (35x35)

封裝: 1153-BBGA, FCBGA

XA3S1600E-4FGG484Q

Xilinx Inc.

IC FPGA 376 I/O 1484FBGA

• Number of LABs/CLBs: 3688
• Number of Logic Elements/Cells: 33192
• Total RAM Bits: 663552
• Number of I/O: 376
• Number of Gates: 1600000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

XC6SLX100-L1FG484I

Xilinx Inc.

IC FPGA 326 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 326
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

XC3SD3400A-5CSG484C

Xilinx Inc.

IC FPGA 309 I/O 484CSBGA

• Number of LABs/CLBs: 5968
• Number of Logic Elements/Cells: 53712
• Total RAM Bits: 2322432
• Number of I/O: 309
• Number of Gates: 3400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-FBGA, CSPBGA
• Supplier Device Package: 484-CSPBGA (19x19)

封裝: 484-FBGA, CSPBGA

XA6SLX16-2CSG225I

Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 160
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

XC3S200-5PQG208C

Xilinx Inc.

IC FPGA 141 I/O 208QFP

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4320
• Total RAM Bits: 221184
• Number of I/O: 141
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP
• Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

XC7S25-2CSGA324C

Xilinx Inc.

XC7S25-2CSGA324C

• Number of LABs/CLBs: 1825
• Number of Logic Elements/Cells: 23360
• Total RAM Bits: 1658880
• Number of I/O: 150
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSGA (15x15)

封裝: 324-LFBGA, CSPBGA

XCVU13P-2FHGA2104I

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 216000
• Number of Logic Elements/Cells: 3780000
• Total RAM Bits: 514867200
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (52.5x52.5)

封裝: 2104-BBGA, FCBGA

XCKU11P-L2FFVD900E

Xilinx Inc.

XCKU11P-L2FFVD900E

• Number of LABs/CLBs: 37320
• Number of Logic Elements/Cells: 653100
• Total RAM Bits: 53964800
• Number of I/O: 408
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA