頁 244 - Xilinx Inc. 產品

零件編號	製造商	描述	封裝	庫存
XCZU19EG-2FFVE1924E	Xilinx Inc.	IC FPGA 668 I/O 1924FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存2,448
XCZU5EG-1SFVC784I	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	封裝: 784-BBGA, FCBGA	庫存7,024
XC6SLX75-N3FGG676I	Xilinx Inc.	IC FPGA 408 I/O 676FBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 408 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存2,176
XC3S1000L-4FGG676C	Xilinx Inc.	IC FPGA 391 I/O 676FBGA Number of LABs/CLBs: 480 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 391 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存4,976
XCV800-4FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 4704 Number of Logic Elements/Cells: 21168 Total RAM Bits: 114688 Number of I/O: 512 Number of Gates: 888439 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	封裝: 680-LBGA Exposed Pad	庫存7,584
XCV100E-6FG256C	Xilinx Inc.	IC FPGA 176 I/O 256FBGA Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 176 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-BGA Supplier Device Package: 256-FBGA (17x17)	封裝: 256-BGA	庫存10,224
XC4005XL-2PQ100C	Xilinx Inc.	IC FPGA 77 I/O 100QFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 77 Number of Gates: 5000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-BQFP Supplier Device Package: 100-PQFP (14x20)	封裝: 100-BQFP	庫存3,040
XC4005E-4TQ144C	Xilinx Inc.	IC FPGA 112 I/O 144TQFP Number of LABs/CLBs: 196 Number of Logic Elements/Cells: 466 Total RAM Bits: 6272 Number of I/O: 112 Number of Gates: 5000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	封裝: 144-LQFP	庫存7,344
XQ5VLX330T-1EF1738I4089	Xilinx Inc.	IC FPGA VIRTEX-5 330K 1738FBGA Number of LABs/CLBs: 25920 Number of Logic Elements/Cells: 331776 Total RAM Bits: 11943936 Number of I/O: 960 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1738-BBGA, FCBGA Supplier Device Package: 1738-FCBGA (42.5x42.5)	封裝: 1738-BBGA, FCBGA	庫存5,120
XC7VX980T-L2FF1926E	Xilinx Inc.	IC FPGA 720 I/O 1926FCBGA Number of LABs/CLBs: 76500 Number of Logic Elements/Cells: 979200 Total RAM Bits: 55296000 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1926-FCBGA (45x45)	封裝: 1924-BBGA, FCBGA	庫存5,024
XQ7VX330T-2RF1761I	Xilinx Inc.	IC FPGA VIRTEX-7 330K 1761BGA Number of LABs/CLBs: 25500 Number of Logic Elements/Cells: 326400 Total RAM Bits: 27648000 Number of I/O: 700 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1761-FCBGA (42.5x42.5)	封裝: 1760-BBGA, FCBGA	庫存6,656
XC5VSX50T-3FF665C	Xilinx Inc.	IC FPGA 360 I/O 665FCBGA Number of LABs/CLBs: 4080 Number of Logic Elements/Cells: 52224 Total RAM Bits: 4866048 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	封裝: 665-BBGA, FCBGA	庫存4,672
XCKU040-L1FBVA676I	Xilinx Inc.	IC FPGA 312 I/O 676FCBGA Number of LABs/CLBs: 30300 Number of Logic Elements/Cells: 530250 Total RAM Bits: 21606000 Number of I/O: 312 Number of Gates: - Voltage - Supply: 0.880 V ~ 0.920 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	封裝: 676-BBGA, FCBGA	庫存7,920
XC6VLX75T-L1FFG484I	Xilinx Inc.	IC FPGA 240 I/O 484FCBGA Number of LABs/CLBs: 5820 Number of Logic Elements/Cells: 74496 Total RAM Bits: 5750784 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,200
XC6VCX130T-1FFG484C	Xilinx Inc.	IC FPGA 240 I/O 484FCBGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存5,712
XC7A75T-L1FGG676I	Xilinx Inc.	IC FPGA 300 I/O 676FCBGA Number of LABs/CLBs: 5900 Number of Logic Elements/Cells: 75520 Total RAM Bits: 3870720 Number of I/O: 300 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	封裝: 676-BGA	庫存3,008
XC3S1600E-5FG400C	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 3688 Number of Logic Elements/Cells: 33192 Total RAM Bits: 663552 Number of I/O: 304 Number of Gates: 1600000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	封裝: 400-BGA	庫存4,944
XA6SLX45T-2CSG324I	Xilinx Inc.	IC FPGA 190 I/O 324CSGBGA Number of LABs/CLBs: 3411 Number of Logic Elements/Cells: 43661 Total RAM Bits: 2138112 Number of I/O: 190 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存6,528
XC7A35T-1FGG484I	Xilinx Inc.	IC FPGA 250 I/O 484FCBGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33208 Total RAM Bits: 1843200 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	封裝: 484-BBGA	庫存14,496
XC7K70T-1FBG484C	Xilinx Inc.	IC FPGA 285 I/O 484FCBGA Number of LABs/CLBs: 5125 Number of Logic Elements/Cells: 65600 Total RAM Bits: 4976640 Number of I/O: 285 Number of Gates: - Voltage - Supply: 0.97 V ~ 1.03 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	封裝: 484-BBGA, FCBGA	庫存4,368
XC6SLX16-3CSG324C	Xilinx Inc.	IC FPGA 232 I/O 324CSBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 232 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 324-CSPBGA (15x15)	封裝: 324-LFBGA, CSPBGA	庫存5,008
XC9572-10PCG84C	Xilinx Inc.	IC CPLD 72MC 10NS 84PLCC Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 72 Number of Gates: 1600 Number of I/O: 69 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 84-LCC (J-Lead) Supplier Device Package: 84-PLCC (29.31x29.31)	封裝: 84-LCC (J-Lead)	庫存4,416
XC95288XV-10CS280C	Xilinx Inc.	IC CPLD 288MC 10NS 280CSP Programmable Type: In System Programmable Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 2.37 V ~ 2.62 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 280-TFBGA, CSPBGA Supplier Device Package: 280-CSBGA (16x16)	封裝: 280-TFBGA, CSPBGA	庫存7,520
XC95216-10HQ208I	Xilinx Inc.	IC CPLD 216MC 10NS 208HQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 10.0ns Voltage Supply - Internal: 4.5 V ~ 5.5 V Number of Logic Elements/Blocks: 12 Number of Macrocells: 216 Number of Gates: 4800 Number of I/O: 166 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP Exposed Pad	庫存5,152
XCR3512XL-7FG324C	Xilinx Inc.	IC CPLD 512MC 7NSNS 324BGA Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 32 Number of Macrocells: 512 Number of Gates: 12000 Number of I/O: 260 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 324-BBGA Supplier Device Package: 324-FBGA (23x23)	封裝: 324-BBGA	庫存2,720
XC2C384-10PQ208I	Xilinx Inc.	IC CPLD 384MC 9.2NS 208QFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 9.2ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 173 Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-BFQFP Supplier Device Package: 208-PQFP (28x28)	封裝: 208-BFQFP	庫存2,176
XC95288XL-6BG256C	Xilinx Inc.	IC CPLD 288MC 6NS 256BGA Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 6.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 16 Number of Macrocells: 288 Number of Gates: 6400 Number of I/O: 192 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (27x27)	封裝: 256-BBGA	庫存7,908
XCR3064XL-7CP56C	Xilinx Inc.	IC CPLD 64MC 7NS 56CSP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 48 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 56-LFBGA, CSPBGA Supplier Device Package: 56-CSBGA (6x6)	封裝: 56-LFBGA, CSPBGA	庫存7,776

XCZU19EG-2FFVE1924E

Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存2,448

XCZU5EG-1SFVC784I

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

封裝: 784-BBGA, FCBGA

庫存7,024

XC6SLX75-N3FGG676I

Xilinx Inc.

IC FPGA 408 I/O 676FBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 408
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存2,176

XC3S1000L-4FGG676C

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

Number of LABs/CLBs: 480
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 391
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存4,976

XCV800-4FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 4704
Number of Logic Elements/Cells: 21168
Total RAM Bits: 114688
Number of I/O: 512
Number of Gates: 888439
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

封裝: 680-LBGA Exposed Pad

庫存7,584

XCV100E-6FG256C

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 176
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-BGA
Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

庫存10,224

XC4005XL-2PQ100C

Xilinx Inc.

IC FPGA 77 I/O 100QFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 77
Number of Gates: 5000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-BQFP
Supplier Device Package: 100-PQFP (14x20)

封裝: 100-BQFP

庫存3,040

XC4005E-4TQ144C

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

Number of LABs/CLBs: 196
Number of Logic Elements/Cells: 466
Total RAM Bits: 6272
Number of I/O: 112
Number of Gates: 5000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

庫存7,344

XQ5VLX330T-1EF1738I4089

Xilinx Inc.

IC FPGA VIRTEX-5 330K 1738FBGA

Number of LABs/CLBs: 25920
Number of Logic Elements/Cells: 331776
Total RAM Bits: 11943936
Number of I/O: 960
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1738-BBGA, FCBGA
Supplier Device Package: 1738-FCBGA (42.5x42.5)

封裝: 1738-BBGA, FCBGA

庫存5,120

XC7VX980T-L2FF1926E

Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

Number of LABs/CLBs: 76500
Number of Logic Elements/Cells: 979200
Total RAM Bits: 55296000
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1926-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

庫存5,024

XQ7VX330T-2RF1761I

Xilinx Inc.

IC FPGA VIRTEX-7 330K 1761BGA

Number of LABs/CLBs: 25500
Number of Logic Elements/Cells: 326400
Total RAM Bits: 27648000
Number of I/O: 700
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1761-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

庫存6,656

XC5VSX50T-3FF665C

Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

Number of LABs/CLBs: 4080
Number of Logic Elements/Cells: 52224
Total RAM Bits: 4866048
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

封裝: 665-BBGA, FCBGA

庫存4,672

XCKU040-L1FBVA676I

Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

Number of LABs/CLBs: 30300
Number of Logic Elements/Cells: 530250
Total RAM Bits: 21606000
Number of I/O: 312
Number of Gates: -
Voltage - Supply: 0.880 V ~ 0.920 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

庫存7,920

XC6VLX75T-L1FFG484I

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

Number of LABs/CLBs: 5820
Number of Logic Elements/Cells: 74496
Total RAM Bits: 5750784
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,200

XC6VCX130T-1FFG484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存5,712

XC7A75T-L1FGG676I

Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

Number of LABs/CLBs: 5900
Number of Logic Elements/Cells: 75520
Total RAM Bits: 3870720
Number of I/O: 300
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

庫存3,008

XC3S1600E-5FG400C

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 3688
Number of Logic Elements/Cells: 33192
Total RAM Bits: 663552
Number of I/O: 304
Number of Gates: 1600000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

封裝: 400-BGA

庫存4,944

XA6SLX45T-2CSG324I

Xilinx Inc.

IC FPGA 190 I/O 324CSGBGA

Number of LABs/CLBs: 3411
Number of Logic Elements/Cells: 43661
Total RAM Bits: 2138112
Number of I/O: 190
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存6,528

XC7A35T-1FGG484I

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33208
Total RAM Bits: 1843200
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

封裝: 484-BBGA

庫存14,496

XC7K70T-1FBG484C

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

Number of LABs/CLBs: 5125
Number of Logic Elements/Cells: 65600
Total RAM Bits: 4976640
Number of I/O: 285
Number of Gates: -
Voltage - Supply: 0.97 V ~ 1.03 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

庫存4,368

XC6SLX16-3CSG324C

Xilinx Inc.

IC FPGA 232 I/O 324CSBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 232
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

庫存5,008

XC9572-10PCG84C

Xilinx Inc.

IC CPLD 72MC 10NS 84PLCC

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 72
Number of Gates: 1600
Number of I/O: 69
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 84-LCC (J-Lead)
Supplier Device Package: 84-PLCC (29.31x29.31)

封裝: 84-LCC (J-Lead)

庫存4,416

XC95288XV-10CS280C

Xilinx Inc.

IC CPLD 288MC 10NS 280CSP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 2.37 V ~ 2.62 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 280-TFBGA, CSPBGA
Supplier Device Package: 280-CSBGA (16x16)

封裝: 280-TFBGA, CSPBGA

庫存7,520

XC95216-10HQ208I

Xilinx Inc.

IC CPLD 216MC 10NS 208HQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 10.0ns
Voltage Supply - Internal: 4.5 V ~ 5.5 V
Number of Logic Elements/Blocks: 12
Number of Macrocells: 216
Number of Gates: 4800
Number of I/O: 166
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP Exposed Pad

庫存5,152

XCR3512XL-7FG324C

Xilinx Inc.

IC CPLD 512MC 7NSNS 324BGA

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 32
Number of Macrocells: 512
Number of Gates: 12000
Number of I/O: 260
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Supplier Device Package: 324-FBGA (23x23)

封裝: 324-BBGA

庫存2,720

XC2C384-10PQ208I

Xilinx Inc.

IC CPLD 384MC 9.2NS 208QFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 9.2ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 173
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-BFQFP
Supplier Device Package: 208-PQFP (28x28)

封裝: 208-BFQFP

庫存2,176

XC95288XL-6BG256C

Xilinx Inc.

IC CPLD 288MC 6NS 256BGA

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 6.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 16
Number of Macrocells: 288
Number of Gates: 6400
Number of I/O: 192
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (27x27)

封裝: 256-BBGA

庫存7,908

XCR3064XL-7CP56C

Xilinx Inc.

IC CPLD 64MC 7NS 56CSP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 48
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 56-LFBGA, CSPBGA
Supplier Device Package: 56-CSBGA (6x6)

封裝: 56-LFBGA, CSPBGA

庫存7,776