Xilinx Inc. 產品

XC17128EVOG8C

Xilinx Inc.

IC PROM SERIAL 128K 8-SOIC

• Programmable Type: OTP
• Memory Size: 128kb
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

XCZU5EV-1FBVB900E

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 256K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

XCZU3EG-1SFVA625I

Xilinx Inc.

IC FPGA 180 I/O 625FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 625-BFBGA, FCBGA
• Supplier Device Package: 625-FCBGA (21x21)

封裝: 625-BFBGA, FCBGA

XCZU3CG-1SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 533MHz, 1.3GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

封裝: 484-BBGA, FCBGA

XA2S150E-6FT256Q

Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 182
• Number of Gates: 150000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XCV150-5PQ240C

Xilinx Inc.

IC FPGA 166 I/O 240QFP

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 166
• Number of Gates: 164674
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP
• Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP

XCV1000-4BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 6144
• Number of Logic Elements/Cells: 27648
• Total RAM Bits: 131072
• Number of I/O: 404
• Number of Gates: 1124022
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

XC4044XL-1HQ240C

Xilinx Inc.

IC FPGA 193 I/O 240HQFP

• Number of LABs/CLBs: 1600
• Number of Logic Elements/Cells: 3800
• Total RAM Bits: 51200
• Number of I/O: 193
• Number of Gates: 44000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BFQFP Exposed Pad
• Supplier Device Package: 240-PQFP (32x32)

封裝: 240-BFQFP Exposed Pad

XC4010XL-3TQ176C

Xilinx Inc.

IC FPGA 145 I/O 176TQFP

• Number of LABs/CLBs: 400
• Number of Logic Elements/Cells: 950
• Total RAM Bits: 12800
• Number of I/O: 145
• Number of Gates: 10000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 176-LQFP
• Supplier Device Package: 176-TQFP (24x24)

封裝: 176-LQFP

XC4005XL-3TQ144C

Xilinx Inc.

IC FPGA 112 I/O 144TQFP

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 112
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

XC4003E-4PG120C

Xilinx Inc.

IC FPGA 80 I/O 120CPGA

• Number of LABs/CLBs: 100
• Number of Logic Elements/Cells: 238
• Total RAM Bits: 3200
• Number of I/O: 80
• Number of Gates: 3000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 120-BCPGA
• Supplier Device Package: 120-CPGA (34.55x34.55)

封裝: 120-BCPGA

XQ6VSX475T-1RF1156I

Xilinx Inc.

IC FPGA VIRTEX 6 476K 1156-BGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC6VSX475T-2FF1156E

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC6VHX380T-1FF1923I

Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

封裝: 1924-BBGA, FCBGA

XC4VFX140-11FF1517C

Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

• Number of LABs/CLBs: 15792
• Number of Logic Elements/Cells: 142128
• Total RAM Bits: 10174464
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

封裝: 1517-BBGA, FCBGA

XC5VLX110T-1FFG1136I

Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

• Number of LABs/CLBs: 8640
• Number of Logic Elements/Cells: 110592
• Total RAM Bits: 5455872
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1136-BBGA, FCBGA
• Supplier Device Package: 1136-FCBGA (35x35)

封裝: 1136-BBGA, FCBGA

XC4VFX100-10FF1152C

Xilinx Inc.

IC FPGA 576 I/O 1152FCBGA

• Number of LABs/CLBs: 10544
• Number of Logic Elements/Cells: 94896
• Total RAM Bits: 6930432
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-CFCBGA (35x35)

封裝: 1152-BBGA, FCBGA

XC7K355T-3FFG901E

Xilinx Inc.

IC FPGA 300 I/O 901FCBGA

• Number of LABs/CLBs: 27825
• Number of Logic Elements/Cells: 356160
• Total RAM Bits: 26357760
• Number of I/O: 300
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 901-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

XC6VLX195T-L1FF784I

Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

• Number of LABs/CLBs: 15600
• Number of Logic Elements/Cells: 199680
• Total RAM Bits: 12681216
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.91 V ~ 0.97 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 784-FCBGA (29x29)

封裝: 784-BBGA, FCBGA

XC5VLX50-2FFG324I

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

封裝: 324-BBGA, FCBGA

XC2VP4-5FGG456I

Xilinx Inc.

IC FPGA 248 I/O 456FBGA

• Number of LABs/CLBs: 752
• Number of Logic Elements/Cells: 6768
• Total RAM Bits: 516096
• Number of I/O: 248
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

封裝: 456-BBGA

XC7A50T-L2CSG324E

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

XC2S150-5FG256I

Xilinx Inc.

IC FPGA 176 I/O 256FBGA

• Number of LABs/CLBs: 864
• Number of Logic Elements/Cells: 3888
• Total RAM Bits: 49152
• Number of I/O: 176
• Number of Gates: 150000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-BGA
• Supplier Device Package: 256-FBGA (17x17)

封裝: 256-BGA

XC3S200-5VQ100C

Xilinx Inc.

IC FPGA 63 I/O 100VQFP

• Number of LABs/CLBs: 480
• Number of Logic Elements/Cells: 4320
• Total RAM Bits: 221184
• Number of I/O: 63
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

XC9536-15PC44C

Xilinx Inc.

IC CPLD 36MC 15NS 44PLCC

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 15.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

封裝: 44-LCC (J-Lead)

XCR3128XL-10VQ100I

Xilinx Inc.

IC CPLD 128MC 9.1NS 100VQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 84
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-VQFP (14x14)

封裝: 100-TQFP

XAZU3EG-1SFVC784Q

Xilinx Inc.

XAZU3EG-1SFVC784Q

• Architecture: -
• Core Processor: -
• Flash Size: -
• RAM Size: -
• Peripherals: -
• Connectivity: -
• Speed: -
• Primary Attributes: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

XCVU7P-L2FLVA2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 98520
• Number of Logic Elements/Cells: 1724100
• Total RAM Bits: 260812800
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.698 V ~ 0.742 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 110°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA