Xilinx Inc. 產品

XC17S50AVO8C

Xilinx Inc.

IC PROM SER 500K 8-SOIC

• Programmable Type: OTP
• Memory Size: 500kb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-TSOP

封裝: 8-SOIC (0.154", 3.90mm Width)

XCZU17EG-1FFVD1760E

Xilinx Inc.

IC FPGA 308 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

XC7Z035-2FFV676E

Xilinx Inc.

IC FPGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 800MHz
• Primary Attributes: Kintex?-7 FPGA, 275K Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XA7Z010-1CLG400Q

Xilinx Inc.

IC SOC CORTEX A-9 ZYNQ7 400BGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
• Operating Temperature: -40°C ~ 125°C (TJ)
• Package / Case: 400-LFBGA, CSPBGA
• Supplier Device Package: 400-CSPBGA (17x17)

封裝: 400-LFBGA, CSPBGA

XC2V1500-4FG676I

Xilinx Inc.

IC FPGA 392 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 392
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

封裝: 676-BBGA, FCBGA

XCV600-6BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

• Number of LABs/CLBs: 3456
• Number of Logic Elements/Cells: 15552
• Total RAM Bits: 98304
• Number of I/O: 404
• Number of Gates: 661111
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 560-LBGA, Metal
• Supplier Device Package: 560-MBGA (42.5x42.5)

封裝: 560-LBGA, Metal

XCVU7P-2FLVB2104I

Xilinx Inc.

XCVU7P-2FLVB2104I

• Number of LABs/CLBs: 98520
• Number of Logic Elements/Cells: 1724100
• Total RAM Bits: 236134400
• Number of I/O: 702
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封裝: -

XC6VSX475T-L1FFG1759C

Xilinx Inc.

IC FPGA 840 I/O 1759FCBGA

• Number of LABs/CLBs: 37200
• Number of Logic Elements/Cells: 476160
• Total RAM Bits: 39223296
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1759-FCBGA (42.5x42.5)

封裝: 1760-BBGA, FCBGA

XC4VLX160-10FF1148C

Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

• Number of LABs/CLBs: 16896
• Number of Logic Elements/Cells: 152064
• Total RAM Bits: 5308416
• Number of I/O: 768
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

XCKU5P-2FFVD900I

Xilinx Inc.

XCKU5P-2FFVD900I

• Number of LABs/CLBs: 27120
• Number of Logic Elements/Cells: 474600
• Total RAM Bits: 35737600
• Number of I/O: 304
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: -
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

封裝: 900-BBGA, FCBGA

XC2VP40-7FF1148C

Xilinx Inc.

IC FPGA 804 I/O 1148FCBGA

• Number of LABs/CLBs: 4848
• Number of Logic Elements/Cells: 43632
• Total RAM Bits: 3538944
• Number of I/O: 804
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

XC2VP50-5FFG1148C

Xilinx Inc.

IC FPGA 812 I/O 1148FBGA

• Number of LABs/CLBs: 5904
• Number of Logic Elements/Cells: 53136
• Total RAM Bits: 4276224
• Number of I/O: 812
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1148-BBGA, FCBGA
• Supplier Device Package: 1148-FCPBGA (35x35)

封裝: 1148-BBGA, FCBGA

XC6VLX130T-2FF1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

封裝: 1156-BBGA, FCBGA

XC4VFX60-11FFG672C

Xilinx Inc.

IC FPGA 352 I/O 672FCBGA

• Number of LABs/CLBs: 6320
• Number of Logic Elements/Cells: 56880
• Total RAM Bits: 4276224
• Number of I/O: 352
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 672-BBGA, FCBGA
• Supplier Device Package: 672-FCBGA (27x27)

封裝: 672-BBGA, FCBGA

XC6VLX130T-1FF484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 10000
• Number of Logic Elements/Cells: 128000
• Total RAM Bits: 9732096
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

XC2VP30-5FGG676C

Xilinx Inc.

IC FPGA 416 I/O 676FBGA

• Number of LABs/CLBs: 3424
• Number of Logic Elements/Cells: 30816
• Total RAM Bits: 2506752
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

封裝: 676-BGA

XC5VLX50-2FFG324C

Xilinx Inc.

IC FPGA 220 I/O 324FBGA

• Number of LABs/CLBs: 3600
• Number of Logic Elements/Cells: 46080
• Total RAM Bits: 1769472
• Number of I/O: 220
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-BBGA, FCBGA
• Supplier Device Package: 324-FCBGA (19x19)

封裝: 324-BBGA, FCBGA

XC6SLX150-3FGG900I

Xilinx Inc.

IC FPGA 576 I/O 900FBGA

• Number of LABs/CLBs: 11519
• Number of Logic Elements/Cells: 147443
• Total RAM Bits: 4939776
• Number of I/O: 576
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA
• Supplier Device Package: 900-FBGA (31x31)

封裝: 900-BBGA

XC7A50T-2CSG324C

Xilinx Inc.

IC FPGA ARTIX7 210 I/O 324CSBGA

• Number of LABs/CLBs: 4075
• Number of Logic Elements/Cells: 52160
• Total RAM Bits: 2764800
• Number of I/O: 210
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 324-LFBGA, CSPBGA
• Supplier Device Package: 324-CSPBGA (15x15)

封裝: 324-LFBGA, CSPBGA

XC6SLX16-N3CSG225C

Xilinx Inc.

IC FPGA 160 I/O 225CSBGA

• Number of LABs/CLBs: 1139
• Number of Logic Elements/Cells: 14579
• Total RAM Bits: 589824
• Number of I/O: 160
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 225-LFBGA, CSPBGA
• Supplier Device Package: 225-CSPBGA (13x13)

封裝: 225-LFBGA, CSPBGA

XC7K160T-3FBG484E

Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

• Number of LABs/CLBs: 12675
• Number of Logic Elements/Cells: 162240
• Total RAM Bits: 11980800
• Number of I/O: 285
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (23x23)

封裝: 484-BBGA, FCBGA

XC3S200AN-5FTG256C

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

• Number of LABs/CLBs: 448
• Number of Logic Elements/Cells: 4032
• Total RAM Bits: 294912
• Number of I/O: 195
• Number of Gates: 200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

封裝: 256-LBGA

XC9536XL-10VQ44I

Xilinx Inc.

IC CPLD 36MC 10NS 44VQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-VQFP (10x10)

封裝: 44-TQFP

XCR3128XL-10TQG144C

Xilinx Inc.

IC CPLD 128MC 9.1NS 144TQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 8
• Number of Macrocells: 128
• Number of Gates: 3000
• Number of I/O: 108
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

封裝: 144-LQFP

XCDAISY-CPG132

Xilinx Inc.

IC 132 BALL CHIP-SCALE BGA

• Number of LABs/CLBs: -
• Number of Logic Elements/Cells: -
• Total RAM Bits: -
• Number of I/O: -
• Number of Gates: -
• Voltage - Supply: -
• Mounting Type: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

封裝: -

XC7S75-1FGGA676I

Xilinx Inc.

XC7S75-1FGGA676I

• Number of LABs/CLBs: 6000
• Number of Logic Elements/Cells: 76800
• Total RAM Bits: 4331520
• Number of I/O: 400
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FPBGA (27x27)

封裝: 676-BGA

XCVU190-1FLGC2104I

Xilinx Inc.

IC FPGA VIRTEX-U 2104FCBGA

• Number of LABs/CLBs: 134280
• Number of Logic Elements/Cells: 2349900
• Total RAM Bits: 150937600
• Number of I/O: 416
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA

XCVU9P-1FLGA2104E

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

• Number of LABs/CLBs: 147780
• Number of Logic Elements/Cells: 2586150
• Total RAM Bits: 391168000
• Number of I/O: 832
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 2104-BBGA, FCBGA
• Supplier Device Package: 2104-FCBGA (47.5x47.5)

封裝: 2104-BBGA, FCBGA